Professional Documents
Culture Documents
Email: navakant@ece.iisc.ernet.in
URL: http://ece.iisc.ernet.in/~navakant/Navakant_Bhat.html
• Current Mirror
Cascode Current Mirror, Wilson Current Mirror, Regulated Cascode
• Layout issues
• Output Stage
• Sense Amplifier
Voltage SA, Current SA, Latch type SA, Gain bandwidth analysis
• Alternate Device Gallery for Low Voltage Low Power Analog Design
Wide common range OPAMP
Bulk driven OPAMP
Lateral BJT in CMOS Technology
Sub-threshold operation of MOSFET : Neural Network Application
Floating Gate transistor as analog memory
PMOSFET NMOSFET
metal metal
oxide oxide
p+ n p+ n+ p n+
Silicon Silicon
CMOS Inverter
PMOS
IN OUT
NMOS
• State of the art fab set-up costs more than US$2 billion
• Recovering the fab cost requires a modular process technology
approach capable of producing diverse products
metal
oxide
n+ n+ n+
p p p p
n-
Silicon
p
G B
S
schematic switch model
gate
n+ n+
A A’
P-well
Si
lay out cross section
Tox Oxide
xj n+ source n+ drain
p substrate
Doping concentration = Na
µε oxW (Vgs − Vt )2
Ids =
Tox L 2
Vg3
Saturation
Vds=Vdd
Vds Vgs
•Ids is constant and independent of Vds in saturation
•Ids is zero in sub-threshold region
Both of these idealities are incorrect especially for
the sub-micron MOS transistor
Dr. Navakanta Bhat
Channel length modulation
Vg > Vt Vd > Vg - Vt Ids
∆Vds
Rout =
∆I ds
n+ source ∆L n+ drain
electron channel
p-substrate Vds=Vgs-Vt
Vds
Effective channel length is Leff = L - ∆L, where ∆L=f(Vds)
µε oxW (Vgs − Vt )2 µε oxW (Vgs − Vt )2
I ds = I ds = (1 + λVds )
Tox Leff 2 Tox L 2
Ids increases slightly in saturation region with increasing Vds
This limits the AC output resistance for analog applications
λ is channel length modulation parameter in SPICE
Dr. Navakanta Bhat
Sub threshold conduction
G
Tox 4ε s qN aφb
Vt 0 = V fb + 2φb +
ε ox
Vt = Vt 0 + γ ( Vbs + 2φb − 2φb )
Tox 2qε s N a γ = body effect factor (γ = 0.3-0.7)
γ=
ε ox
• Vt increases due to body effect
• This results in a transconductance term
Dr. Navakanta Bhat
Short Channel Effect (SCE)
Vg Vt
n+ n+
L
depletion depletion
~1µm
p-substrate
L (µm)
• Fraction of the depletion charge (Qd in Vt equation) is supported
by the source and drain junctions and hence Vg need not support this
• When L is very small (~ 1µm) this charge becomes significant
fraction of the total depletion charge and can not be neglected
=> Vt decreases with decreasing L
• Impacts matching of transistors in analog applications
Dr. Navakanta Bhat
Reverse Short Channel Effect
Vt dV t
= − ve
dL
dV t
= + ve
dL L
Vds=0.1V
L
Vds=Vdd
Potential barrier
depletion n+
W ~1µm
p-substrate
W (µm)
• Additional depletion charge at the edge of source & drain should
be supported by the Vg before inverting the channel
• When W is very small (~ 1µm) this charge becomes significant
fraction of the total depletion charge and can not be neglected
=> Vt increases with decreasing W
Dr. Navakanta Bhat
Velocity saturation
Ids α (Vgs-Vt)2
107cm/sec at T=300oK
Ids Ids α (Vgs-Vt)
v
~104 V/cm
E Vds
v= µE valid only at low Ids will be less than expected
electric fields (E) due to velocity saturation
•For velocity saturated transistor, the saturation drive current is
εW (Vgs − Vt )vsat
Ids =
Tox
•Transconductance will be independent of L
•For L=0.1µm transistor operating at Vd=1V:
E=105 V/cm => transistor is velocity saturated
Dr. Navakanta Bhat
Punch through
Vd > Vg - Vt
n+ n+
depletion depletion
p-substrate
For short channel length, the drain depletion region merges with
source depletion region for Vd > Vpt, punch through voltage
This results in large transistor current resulting in breakdown
n+ source n+ drain
electron channel
p-substrate
x
Avalanche hot electrons
due to high electric field
E
E
ID
OX
p-Si
gate
Eox = Vox/Tox
Under high electric fields electrons tunnel through the oxide
Tunneling electrons create damage in the oxide and hence
affect the transistor performance
Gate oxide reliability worsens with decreasing oxide thickness
Design parameters:
L, Vdd, Tox, N, Xj
• S/D engineering
• Channel engineering
Vt Pac
Psb
0.4 Vt/Vdd Vdd
Delay increases significantly for Vt/Vdd > 0.4
Pactive (Pac) = CVdd2f
Pstandby (Psb) = WVddIoff
Delay and Power are the only trade-off points for digital design
NOISE LINEARITY
POWER GAIN
B. Razavi
Multiple trade-offs involved in Analog Design make it very complex
+ S
vsb
-
B
gm,gmb and go are the 3 conductance parameters
Dr. Navakanta Bhat
Transconductance, gm
ids ∂I ds
gm = = , with constant Vds, Vsb
v gs ∂Vgs
2 I ds
gm =
Vgs − Vt
gm gm
Vgs-Vt Ids
Ids constant
In order to obtain large gm,
gm the input/output swing
trades-off with the transistor size
Vgs-Vt
Dr. Navakanta Bhat
Body effect transconductance, gmb
ids ∂I ds ∂I ds ∂Vt
g mb =− =− =− , with constant Vds, Vgs
vsb ∂Vsb ∂Vt ∂Vsb
γ Cs
g mb = gm = g m = ηg m
2 2 φb + Vsb Cox
µε oxW (Vgs − Vt )2
go = λ
2 LTox
∆
go = I ds
2(L − ∆ )(Vds − Vdsat ) , more rigorous analysis
Vgs-Vt=1V
gm ~ 10-4 A/V 1 / gm ~ 10 kΩ
Cov Cov
Cjsw Cjsw
Cch
Cja Cja
Cdb=AD*Cja(Vsb) + PD*Cjsw(Vsb)
AS,PS source area, perimeter; AD, PD drain area, perimeter
In saturation:
2
C gs = WLeff Cox + nWLD Cox C gd = nWLD Cox
3
In linear region:
Cgs
WLCox
C gs = C gd = + nWLD Cox
2
Cgd
off sat lin
Vt Vds+Vt Vgs
Cdb=Csb=0.7fF
In saturation:
Cgs=1.1fF Cgd=0.2fF
In linear region:
Cgs=Cgd=0.8fF
+
vgs Cgs gmvgs gmbvsb go
-
Cgb + S Cdb
Csb
vsb
-
B
Gate to bulk capacitance Cgb is insignificant and hence neglected
Dr. Navakanta Bhat
Cut-off frequency
S 1
ft = wt
2π
Dr. Navakanta Bhat
Scaling trend for ft
1 gm
ft ≅
2π C gs
Technology scaling factor k > 1
Ideally gm does not scale and C scales as 1/k
hence ft increases by a factor k
However, if Vt is not scaled due to leakage constraints then
gm will decrease in DSM regime, thus affecting the scaling trend
X(s) Y ( s) Y(s)
H (s) =
X (s)
1 − s 1 − s ...
z1 z 2
H (s) =
1 − s 1 − s ...
p p
1 2
z1,z2,… are zeros and p1, p2, … are the poles of the system
1
0.707
ωp ω
Dr. Navakanta Bhat
Gain and Phase response due to pole
= −20 log 1 + (w w p )
Vo 2
G = 20 log φ = − tan −1 w w
Vi
p
20log|Av|
0dB -20dB/decade
-6dB/octave 0o
-3 dB
-45o
-90o
ωp ω ω
ωp
At ωp the gain is 3dB lower At ωp the the phase shift is –45o
Beyond ωp, the gain decreases at a At 0.1ωp the the phase shift saturates to 0o
rate of –20dB/decade
At 10ωp the the phase shift saturates to -90o
ω
ωz
Dr. Navakanta Bhat
Gain and Phase response due to zero
= Go + 20 log 1 + (w w p )
Vo
G = 20 log
2
Vi φ = tan −1 w w
p
R2
Go = 20 log
R
1 + R2
90o
45o
+20dB/decade 0o
Go+3dB +6dB/octave
GodB
ωz ω ω
ωz
At ωz the gain is 3dB higher At ωz the the phase shift is 45o
Beyond ωz, the gain increases at a At 0.1ωz the the phase shift saturates to 0o
rate of 20dB/decade
At 10ωz the the phase shift saturates to 90o
Dr. Navakanta Bhat
Miller Approximation
(a) (b)
Z Z Vy
Z1 = and Z2 = , where Av =
1 − Av 1 − Av−1 Vx
Proof: For the two circuits to be equivalent, the current flowing through Z
from X to Y in (a) should be same as current flowing through Z1 in (b)
Vx − V y V Z Z
Z1 = Similarly, Z2 =
= x ⇒ Vy Vx
Z Z1 1− 1−
Vx Vy
Dr. Navakanta Bhat
Caveats of Miller’s Theorem
If the impedance Z forms the only signal path between X and Y,
Then the conversion is not valid
R1
X Y X Y
R2
Av =
R2 R1 + R2 R1+R2 R2 -R2
Z
-A
Main signal path
Dr. Navakanta Bhat
Single stage amplifier
•Common Source
Resistive load
Diode connected load
PMOS current source load
Source degeneration
•Source Follower
•Common Gate
•Cascode
•Folded Cascode
+
Cgs gmvin go Cdb GD=1/RD
vi
-
S NOTE: vsb=0
If there is any output load capacitance, that should be added with Cdb
Dr. Navakanta Bhat
AC analysis
Applying KCL at the output node:
High RD also results in lower pole frequency and hence the band width
RD RD
WISHLIST
Gain
Gain becomes
nonlinear transfer Need to make gain insensitive
function for the to the input swings
large input swings
Need to decouple the DC bias
point from the AC requirements
Vt Vin+vin
This configuration can make the gain a little more insensitive to input
vi
M1
VIN Vo
Vi-Vt1 VDD-Vt2
Region 1: M1 linear, M2 saturation
Vo Region 2: M1 saturation, M2 saturation
I II III Region 3: M1 saturation, M2 cutoff
VDD-Vt2
Region 1: M1 cutoff, M2 saturation
Region 2: M1 saturation, M2 saturation
Region 3: M1 linear, M2 saturation
Cgs2 Csb2
-gm2vo gmb2vo go2
Cgd1
vo
+
Cgs1 gm1vi go1 Cdb1
vi
-
+ gm2+gmb2+go1+go2 Cdb1+Cgs2+Csb2
Cgs1 gm1vi
vi
-
Applying KCL at the output node:
g m1 (W L )1
=
gm2 (W L )2
( ) (W L )1 1
Av 0 = −
(W L )2 (1 + η 2 )
The gain is essentially controlled by device dimension which are
the design parameters under the control of the designer
There is some sensitivity on body bias
Dr. Navakanta Bhat
Body bias insensitivity using PMOS load
VDD
(W L )1 µ n
Av (0 ) = −
(W L )2 µ p
Vgs 2 − Vt 2
Av (0 ) ≈
Vgs1 − Vt1
Suppose VDD=3.5V, Vt1= Vt1=0.4V, and gain is required to be 30
Let Vgs1-Vt=0.1V in order to maximise output swing (i.e. VIN=0.5V)
Then, Vgs2-Vt=3V i.e. Vgs2=Vds2=3.4V
Hence Vo=Vds2=0.1V which is just at the verge of saturation.
Vo
Cgd2 Cdb2
go2
Cgd1
vo
+
Cgs1 gm1vi go1 Cdb1
vi
-
+ go1+go2 Cdb1+Cgd2+Cdb2
Cgs1 gm1vi
vi
-
Applying KCL at the output node:
+
Rs go1
vgs1 gm1vgs1 gmb1vsb1
-
X go2
+
vsb1
Rs
-
g m1 g m1 + g mb1 + g o1 + g o 2
z=− p=−
C gs1 C gs1 + Csb1 + C gd 2 + Cdb 2
g m1 + g mb1 + g o1 + g o 2 g m1
=
C gs1 + Csb1 + C gd 2 + Cdb 2 C gs1
C gs1
= Av (0)
C gs1 + Csb1 + C gd 2 + Cdb 2
Av(0)
since
C gs1
C gs1 + Csb1 + C gd 2 + Cdb 2 〉
Av (0)
Av(0)
ω
ωp ωz
I x = Vx g m1 + Vx g mb1 + Vx g o1
+
vgs1 gm1 gmb1 go1 Vx 1
Ro = =
- Ix g m1 + g mb1 + g o1
1
Ix Ro ≈
g m1 + g mb1
Vx
+ + RL
vi 1/gmb1 RL v Av =
o 1 + RL
- - g m1
vo M2
Vx Vx
vo
vi M1 vi M1
VGB
M3
Vxmin=Vi-Vt
Vxmin=Vgs2+ Vgs3 -Vt
Otherwise M3 comes out of saturation
The voltage swing at node X is reduced
vo 1 1 + sRs C gs1
Zo = = Zo(0)=1/gm1 and Zo(∞)=Rs
io g m1 1 + s C gs1
g m1
Dr. Navakanta Bhat
Variation of Zo with ω
vo 1 1 + sRs C gs1
Zo = =
io g m1 1 + s C gs1
g m1
|Zo|
1/gm1
Rs < 1/gm1
Rs
ω
gm1 /Cgs1 1/RsCgs1
vi
|Zo|
Rs
Rs > 1/gm1 Inductive!
vo
1/gm1 Ringing
ω
gm1 /Cgs1 1/RsCgs1
gT=gmb1+go1+go2 CT=Csb1+Cdb2+Cgd2
ii g i 1
vi =
+ ii + m1 i
sC gs1 sC gs1 ( gT + sCT )
vi 1 g 1
Z in = =
+ 1+ m1
ii sC gs1 sC gs1 (gT + sCT )
vi 1 g 1
Z in = = + 1 + m1
ii sC gs1 sC gs1 sCT
Negative
1 1 g m1
Z in = + − 2 Resistance!
sC gs1 sCT ω C gs1CT
g o1 + GL
p=−
Cdb1 + C gd 1
1
Z in =
g m1 + g mb1
RL
50 Ω transmission line vo
M1 VGB
I1
Rin
M2
The current through output node is same as ix
VGB
X io= ix vo=ixRL
vi
M1
vo =gm1viRL
Av(0)= gm1RL
VGB M2
ro2eff ro 2 eff = ( g m 2 ro1 )ro 2
X
vi The output impedance enhanced!
M1 M2
X Av (0) = g m1 g m 2 ro1ro 2
ro1 The intrinsic gain of cascode
is the square of the CS stage
The increased output impedance is exploited in current mirror design
Dr. Navakanta Bhat
Input pole desensitisation
The small signal equivalent, neglecting go1, go2
and neglecting zero due to Cgd1
gmb2v1
RS
vx v1
gm2v1
+ vo
vi CT1 gm1vx CT2 CT3 RL
-
CT3=Cdb2+Cgd2+ CL
RD
vo
M1 M2 VGB M1
vi vi M2 VGB
vo
RD
IO IO
IO
VO
Current Mirror Current Lens
VO
VO VO
Iref IO= Iref Iref IO= KIref
Often times, the term current mirror is used to include current lens
Dr. Navakanta Bhat
Simplest current source/sink
NMOS/PMOS transistor in saturation
Vo
Io
µε oxW (VGB − Vt )
2
VGB Io = (1 + λVo )
Tox L 2
• Sensitive to variation in Vo (I.e.Ro is not infinity)
• Sensitive to variation in VGB
• Sensitive to temperature variation (Vt, µn, µp)
• Sensitive to process variation (Vt, W, L, Tox)
Strategy: Create one very well defined current reference using
complex temperature compensation and VDD insensitivity.
Then use current mirrors (copy) to generate others
Dr. Navakanta Bhat
Basic Current Mirror
IR M1 is diode connected and
is always in saturation
IO
+ IR sets a unique bias voltage VR
M1 M2 VO µε oxW1 (VR − Vt )2
(1 + λVR )
VR+
_ -
IR =
Tox L1 2
∆V VO
Dr. Navakanta Bhat
Current ratio
Neglecting channel length modulation effect,
(W L )2
IO = IR
(W L )1
However it is advisable to choose constant L for
Both M1 and M2 and ratio based on Ws only
L = Lg − 2 LD
LD is constant for all Lg ⇒ Ratio in Lg does not translate to ratio in L
W2
IO = IR
W1
W = Wg − 2∆W
where ∆W is due to field oxide encroachment
Ratio in Wg does not translate to ratio in W
Parallel transistor layout can be used to overcome this problem
Ex: Io=2IR , then W2=2W1
M1 M2 M2
S D S
I O W 2 1 + λVo
= For L1=L2, λ1= λ2 =λ
I R W1 1 + λVR
For λVR << 1, and neglecting λ2 term:
IO W 2
= [1 + λ (Vo − VR )]
I R W1
The output resistance is finite
Ro=ro2
Ro = ro 3 • g m 3 ro 2 (1 + η ) ≈ ro 3 • g m 3 ro 2
+
vx-vy gm1(vx-vy) gmb1vy go1
-
Y
go2 gm2 +
vy
go2
gm3vy
-
Ro=vo/io
g m1 g m 3
Ro = ro1 1 +
g m 2 g o3
Ro ≈ ro1 ( g m1ro 3 )
+
vx-vy gm1(vx-vy) gmb1vy go1
-
Y
go2 +
vy
go2
gm3vy
-
g m1 g m 3
Ro = ro1 1 +
g o 2 g o3
Ro ≈ ro1 ( g m ro ) 2
Very high output impedance
Dr. Navakanta Bhat
Regulated cascode with bias generation
VDD
M6 M7 VO
IR IO
X M1
X Y M3 Y
M5 M4 M2
VR+-
Orientation
Symmetry
Common centroid
M1 M2 M1 M2
M1 M2
Metal 1
M1 M2
Metal 1 Metal 1
S Dummy poly
D1
G
S
D2
Interdigitation distributes the transistors uniformly
Dummy poly line eliminates loading effect in photo and etch
Dr. Navakanta Bhat
Common centroid
1/2M1 1/2M2
1/2M1 1/2M2
M1 M2 M3 M4 Mn
V+
_R
…
RS
Q1 Q2 VO2=VBE2 + VTlnn
A nA which is the required reference
Need a mechanism for VO1 = VO2
Q1 is unit transistor with area A
Q2 has n unit transistors in parallel lnn =17.2 results in impractical n and
The current in one unit of Q2 is IO/n hence should some how scaled properly
p+ p+ n+
n well
p-substrate
R1 R2
Y -
A1
X +
VO
R3
A nA Vo
Q1 Q2
Zs + - Zs
vo Differential signal is
vi1 vi2 measured with respect to
2 nodes which make equal
and opposite excursion
Capacitive coupling
vd
vi1
vi2
Id1,Id2 Vp
Vo1,Vo2
VDD
IS/2
slope≈1
VDD-ISRD/2
0
Vt+∆V1/2+∆V3 Vt Vt+∆V1/2+∆V3 Vc
Vt Vc
Vc min ≈ Vt + 2∆V
Dr. Navakanta Bhat
Upper limit for Vc
As Vc starts approaching VDD at certain value of Vc,
M1 and M2 come out of saturation
IS
This happens at Vc max = VDD − RD + Vt
2
Beyond this point circuit is not usable since gm and ro drop
|Av|
Vt VDD Vc
Vcmin Vcmax
vid=vi1-vi2
-ISRD
Dr. Navakanta Bhat
Input range and Transconductance
I d1 =
µε oxW1 (V gs1 − Vt )
2
=
k1
(Vgs1 − Vt )2
RD1 RD2
Tox L1 2 2
vo1 vo2 µε oxW2 (Vgs 2 − Vt )
2
= (Vgs 2 − Vt )
k2 2
Id 2 =
vi1 M1 M2 vi2 Tox L2 2 2
2I d1 2I d 2
Vgs1 = Vt + Vgs 2 = Vt +
k k
Dr. Navakanta Bhat
Input range and Transconductance
∆Vi = Vi1 − Vi 2 = Vgs1 − Vgs 2
∆Vi =
2
k
[ I d1 − I d 2 ]
22
[
∆Vi = I d 1 + I d 2 − 2 I d 1 I d 2
k
]
k 4I S 2
∆I d = ∆Vi − ∆Vi
2 k
This is used to get the input range and transconductance
µCox = 50µA/V2
W/L = 100
2 × 100
∆ViM = = 0.04 = 0.2V
50 ×100
Gm
Gm0
Gm0
vid vod
v1 gmv1 ro RD
2 2
P
vod
vod 2 = − g ro RD
Ad = = m
vid vid ro + RD
2
Ad ≈ − g m RD If RD << ro
RD RD
voc voc
v1 gmv1 ro ro gmv2 v2
iX
P
2RS 2RS
vic
In a balanced circuit iX=0
Dr. Navakanta Bhat
Common mode response
The circuit can be broken into two parts
R1 R2=(gm3ro1)ro3
vo1 vo2
R2
g m1
VB1
M3 M4 Av = −
( g m 5 ro 7 )ro 5 + ( g m 3 ro1 )ro 3
vi1 M1 M2 vi2 Stacking transistors reduces the
voltage swing
IS
TELESCOPIC CASCODE
Dr. Navakanta Bhat
Gilbert Cell
vo
RD RD = − g m RD
vi
vo
vo = − g m RD vi
M1 M2
vi vo = − f (Vc ) RD vi
Vc M3 vo = −αVc RD vi
Assuming gm=αVc
M1 M2 M3 M4
vi vi
M5 M6
vc
M3
IS
vi
vc positive vc negative
vi
vc
Multiplication by +1 and -1
vo
ISRD
0 π/2 π ϕ
-ISRD
Also the large signal settling time for the closed loop system
depends on the open loop unity gain frequency
ACL ACL
τ= =
Av (0)ω3dB ωU
dVO/dt
SR
dVi/dt
Dr. Navakanta Bhat
Parameters of interest
Output swing: Trade off between O/P swing, bias current and gain
Linearity:
Differential implementation to suppress even harmonics
Allow significant open loop gain so that closed loop feedback
system achieves required linearity
Noise : Thermal noise and 1/f noise
Offset : Systematic and Random offset
Output load : Typical on-chip OPAMP applications mostly have
very low capacitive load < 1pF
Stand alone OPAMPs may have to drive
high capacitive and low resistance loads
0dB
ωp1 ωp2 ω If Av(0) is very large and
if ωp2 is close to ωp1,
0o
-45o Then it is likely that at
-90o at some frequency ωx, the
-135o
-180o phase shift will be –180o
but the gain will still be
greater than unity
ωp2 ω
ωp1
ωx
Dr. Navakanta Bhat
Implication in closed loop negative
feedback system
At DC and low frequency there is
vi- a phase shift –180o between the
- vo
Av(w) Input vi and the output vo
vi+ + (This is due to the inversion between
Gate and Drain voltage of Transistor)
ωp1 ωz1 ω
Dr. Navakanta Bhat
Negative zero is good
H (s) =
( s + z1 )
(s + p1 )
20log|Av|
Go dB -20dB/dec
φ = tan −1 w w − tan −1 w w
z1 p1
0dB
ωp1 ωz1 ω Negative zero can increase PM
0o
-45o
-90o
-135o
-180o
ωp1 ωz1 ω
Dr. Navakanta Bhat
First stage for the 2 stage OPAMP
The first stage should do two tasks
Produce reasonably large gain
Perform differential to single ended conversion
This is done using differential amplifier with
active current mirror load to enhance the gain
VDD
Active current mirror adds
M3 M4 currents in two branches
g m ∆v
g m ∆v 2
and doubles the gain while
g m ∆v vo performing differential to
2
2
M1 M2 single ended conversion
vi1 vi2
IS
vix
M6
vo
To 1X buffer
Ccomp
M3 M4
g m ∆v
g m ∆v 2
g m ∆v M6
2 vo
2
vi1 - M1 M2
Ccomp
vi2+
M5 M7
Vbias
The input vi2 goes through two inversions and hence is +ve i/p
The input vi1 goes through one inversions and hence is -ve i/p
Note that the AC voltages at drain of M1 and M2 will be quite different
Dr. Navakanta Bhat
First stage Low Frequency Differential Gain
VDD
io = g m ∆v
M3 M4 1
g m ∆v Ro =
g m ∆v 2 io vo Go
g m ∆v
2 1
M1
2
M2
Ro =
vi2=-∆v/2 go2 + go4
vi1=+∆v/2 g m ∆v
vo = io Ro =
go2 + go4
gm1=gm2=gm vo gm
A1 = =
∆v g o 2 + g o 4
Vbias M7
gm g m6
Av (0) = −
go 2 + g o 4 go6 + g o7
W 1 W 1
Av (0) = − µ nCox I d1 µ p Cox 6 I d 6
L I d 1 ( λ2 + λ 4 ) L6 I d 6 (λ6 + λ7 )
1 W 1
Av (0) = − Cox µn µn For Id1=Id6
Id L (λ2 + λ4 )(λ6 + λ7 )
2 2
Av (0) = −
(λ2 + λ4 )(Vgsn − Vtn ) (λ6 + λ7 )(Vgsp − Vtp )
For high gain either use small Id or large device dimension
Small Id impacts slew rate, large W/L impacts area and input capacitance
Dr. Navakanta Bhat
First stage Common mode Gain
VDD For matched devices VDD
Vx=Vy, and hence
M3 M4 we can short these M3 M4
X
vo X
vo
Y Y
vc M1 M2 vc M1 M2
Rs Rs
gm1=gm2=gm gm1=gm2=gm
This brings M1 in parallel M2 and M3 in parallel M4
Dr. Navakanta Bhat
Equivalent circuit for CM response
VDD This configuration now looks like
1 1 common source amplifier with
≈
2 g m3 / 4 + 2 g o 2 g m3 / 4 source degeneration Rs and drain
vc Resistance RD=1/2gm3/4
2gm1/2
RS RD 1
Ac1 = − =−
Rs 2 g m 3 / 4 RS
The second stage simply amplifies this further
The two stage common mode gain is
1 g m6
Ac = Ac1 Ac2 = −
2 g m 3 / 4 RS g o 6 + g o 6
+ +
vi gm1vi gm6v1 vo
GT1 CT1 GT2 C
- T2 -
Also for the single pole response (with p1), the unity
gain frequency is given by
g
ωu = m1
Cc
g m1
Cc =
ωu
Dr. Navakanta Bhat
Feed forward zero
The positive zero location is very close to ωu and
this will degrade the phase margin
g m6
z1 =
Cc
If gm6 ≤ gm1 then z1 ≤ ωu
The RZ is able track 1/gm6 very well in spite of through process variations
Dr. Navakanta Bhat
OPAMP Performance Metrics
Noise
Power
Thermal noise
fc f
covalent bonds
The random trapping and detrapping of carriers from the
channel creates fluctuations in drain current
2 K 1
vn =
CoxWL f
Noise varies as 1/A due to averaging effect
Noise varies as 1/Cox since the fraction of charge is less
Noise varies as 1/f since traps have certain time constant
Dr. Navakanta Bhat
MOSFET versus BJT
The BJT circuits are not affected by flicker noise!
metal
oxide
n+ n+ n+
p p p p
n-
Silicon
p
The current flow path does not The current flow path is abutting
encounter any kinds of defects The interface defects region
since the current flow is entirely
in the bulk of Silicon
For PMOS with p+ gate, Vfb ~ +0.9V, 2φb= -0.7V, the third
term is negative for n- well And hence Vt can be set to low value
For PMOS with n + gate, Vfb ~ -0.1V, 2φb= -0.7V
hence Vt setting on n-well becomes very difficult
Hence in a single gate technologies the PMOS well was typically
counter doped to bring Vt to manageable levels. This process in turn
pushes the inversion layer away from interface
Dr. Navakanta Bhat
Buried vs Surface Channel PMOSFET
Buried channel PMOSFET Surface channel PMOSFET
n+ p+
oxide oxide
p+ p+ p+ p+
n
n
Silicon Silicon
VDD
VGG1 and VGG2 are set such that
M1B and M2B are biased just
vi
M2B above Vt to avoid cross over
VGG2 distortion
vo
VGG1
vi
M1B
vo M2B
M1B
Dr. Navakanta Bhat
Biasing the output stage
VDD
M3B and M4B are diode connected
vi NMOS and PMOS respectivel
M6
Vxy = Vgs3b + Vgs4b
M3B X M2B
Vxy = Vtn3b + Vtp4b+2∆V
vo Choose the sizes of M3B and M4B
such that Vxy is just above the
Y the two Vts of M1B and M2B to
M4B M1B avoid cross over distortion
Vbias M7
M10 M9 VB3
M3 M4 VB2
M1 M2 vo
+ -
M8 M7
VB1 MB
M6 M5
A ( 0) =
( g m ro )
2
Assuming all gm and ro are identical
v
3
The dominant pole is associated with the output
CL provides frequency compensation
Increasing CL improves phase margin
M8
1:K M6
M3 M4
io
vi1 - M1 M2 +vi2
M9 M7
1:K
Vbias M5
Then
io = id 6 − id 7 = K (id 4 − id 9 ) = K (id 2 − id 1 )
vi vi
io = K g m + g m = Kg m vi
2 2
io
Gm = = Kg m
vi
vi2 + io
vi1 -
ωp=Gm/C
jω C
vo Gm
=
vi 1 + jω C
G
m
v3 C2
Filter Input Condition Transfer function
Low-pass v1= vi , v2 = 0 ,v3 = 0 gm
2
2
s 2 C 1 C 2 + sC 1 g m + g m
2
s 2 C 1 C 2 + sC 1 g m + g m
vi R1 vo R2
- vo =−
Av vi R1
+
Non inverting R2
R1 vo R2
- vo = 1+
Av vi R1
vi +
Differentiator
R2
vi C1
- vo dvi
Av vo = − R2C1
+ dt
R1 vi
vo = −VT ln
vi - vo R1 I o
Av
+
Antilog R1
vi
+ vd -
vi
-
Av
vo vo = − I o R1e vT
Advantages of MOSFET ϕ
over BJT as a switch
1. ON but zero current Vo
2. S/D voltages are not (ideal)
pinned to gate voltage
3. Conducts well in both
the directions Vo
(real)
But it is still does NOT perform tH
Ideal Sampling function!
Dr. Navakanta Bhat
MOSFET switch issues
Finite acquisition time
t
CH ϕL
C1
Vo = −Vin From conservation of charge
C2
vi + vo
+ ∫ 1
vo = * ∫ (vi − vL )dt
- RC
τ 1 = R *C
∫ L
τ2 = *
1/τ2 R
vs vo
C2 C4 R5
+ vo
vi
-
vo
vi
Configurations:
High gain amplifier without latch
Latched comparator
Dr. Navakanta Bhat
Selection of Av
The desired resolution and hence vimin sets up the required gain
5
AV = −3
= 10000
0.5 ×10
τ= 1/2π f3dB
τ=160 µsec
f3dB fu
vi
S1 Vc Vos
Vi -
- + + - Vo
+
S2
C Word line
2m Bitline
m Memory
Cell
Address n
Input Column Mux
Column decoder
T1 T2
T5 T6
T3 T4
WL
Voltage Sense
• Input signal comes to gate of MOS transistors
• Input impedance tends to be very large
Current Sense
• Input signal comes to drain/source of MOS transistors
• Ideally zero input impedance
• Low input differential swing lowers interconnect delay
Current Voltage
Cell current is sensed Voltage on bit lines is sensed
Low power for small swings High power for large swings
Current Sensing
• Current conveyor based SA
Other Schemes
• Half latch based SA
• Input decoupled latch SA
Ii RB C RL Io
Iin Iout=Iin
Unity current gain
Rin=0
Column Column
Select Select
R1 R2
SAO
SAO_
MN0 MN1
Vgnd
Sense
Enable MN2
(SAEN)
During sensing
one of the output
falls faster than
the other output
• Single stage
• Powered from the bit-lines
• VM bias gives best performance
• PMOS transistors operate in
linear zone
• NMOS transistors in saturation
at start
• MP1,MP2,MN1,MN2: 2.1/0.7
nominal size
700
600
Sense Delay (ps)
500
Half Latch Vm Bias
400
100
0
0 5 10 15
Number of Rows (Log Base 2)
3-pole 3-zero
response up to 1 THz
For figure shown
Gain=20dB
Bandwidth=802MHz
GBW=8.02GHz
Similar responses for
other two amplifiers
800
600
Time (ps)
1/GBW
400
Sense Delay
200
0
0 1 2 3 4 5
Wp/Wn
600
500
Time (ps)
400
10/GBW
300
Sense Delay
200
100
0
0 2 4 6 8 10
Wn/Wp
2W1 L1 2W2 L2
σ2 is variance, D12 is distance between M1-M2, ap and sp are
Process technology dependent
Dr. Navakanta Bhat
Distinction in variation of a parameter
vs. variation in matching of parameter
Variation in Vt
(long range) Frequency (#)
σ(Vt)
Vt
µ(Vt)
Frequency (#) Frequency (#)
Variation in ∆Vt
σ∆Vt σ∆Vt
(short range)
0 0 ∆Vt
Dr. Navakanta Bhat
Mismatch coefficient
AVT qTox 2 NWd
σ∆Vt = =
WL ε ox WL
σ∆Vt 2/0.18
0.2/4
5mV
0.18µm technology
0
1
WL
The equation is obeyed very well except at the edge of the
Process technology
Dr. Navakanta Bhat
Scaling Trend
VDD
Signal amplitude
σ∆Vt
6σ∆Vt
100
Yield 10 9 8 7
bit bit bit bit
0
6mV
0 σ∆Vt
1.4
1.2 Half Latch Amplifier
Sense Delay(ns)
1
0.8 Input Decoupled Full
0.6 Latch Amplifier
0.4 Ground Biased Full
0.2 Latch Amplifier
0
0 5 10 15
Mismatch(%)
Time
Mpass1
Mpass2
MN1
MN2 Time
Sense Amplifier firing signal
Timing slack
MNAMP
in the design
1
0.8 Input Decoupled Full
0.6 Latch Amplifier
0.4 Ground Biased Full
0.2 Latch Amplifier
0
0 5 10 15
Mismatch(%)
3 99.8650033
• Conservative design compromises the
4 99.9968314
circuit speed (factor of 2 or more!)
5 99.9999713 • This is a typical speed versus yield
6 99.9999999 trade-off which exists universally
Dr. Navakanta Bhat
Conventional solution
# # Delay
Offset compensation
circuitry
σ
Transistor mismatch Transistor mismatch 1 6
Column Column
Select Select
R1 R2
SAO
SAO_
MN0 MN1
Vgnd
Sense
Enable MN2
(SAEN)
C BL × ∆VBL Pdynamic
Tdatapath = + τ SA = C BL ∆VBLVdd
I cell f
Latch type sense amplifier is preferred configuration for high speed
Dr. Navakanta Bhat
Effect of source-substrate bias
Differ
ence Vs=0V
in Ids
(A)
Vs=0.5V
Vs=1V
Vs=1.5V
Vds (V)
50
45
40
35
30
0 100 200 300 400 500 600 700
Rise Time of SAEN (ps)
12 W/L = 1.8u/0.25u
W/L = 5.0u/0.25u
W/L = 1.8u/0.4u
10
W/L = 1.8u/0.5u
Extrinsic Offset (mV)
0
0 100 200 300 400 500
Rise Time of SAEN (ps)
9 W/L = 0.5u/0.25u
8 W/L = 1u/0.25u
W/L = 2u/0.25u
7
Extrinsic Offset (mV)
6
5
4
3
0
0 100 200 300 400 500
Rise Time of SAEN (ps)
W/L = 1.8u/0.5u
55
50
45
40
35
30
0 100 200 300 400 500
Rise Time of SAEN (ps)
W/L = 2u/0.25u
70
W/L = 1u/0.25u
65
W/L = 0.5u/0.25u
60
Latch Offset (mV)
55
50
45
40
35
30
Current uA/Mhz
30 Rows=2048
25 Rows=4096
20
15
10
5
0
0 100 200 300 400 500
Rise Time of SAEN (ps)
0.9
Rows=1024
Access Time (ns)
0.8 Rows=2048
0.7 Rows=4096
0.6
0.5
0.4
0.3
0.2
0.1
0
0 100 200 300 400 500
Rise Time of SAEN (ps)
1 ∆ β ∆ C ∆C KC GS 3a 1
V SIG > ∆ VT + + + 2
( V − V S − V T ) max
2 β C C + C GS β a2
∆C C GS
+ mdec (V − VS − VT ) max
(C + C GS ) 2
0.085
0.08
0.075
0.07
Offset (V)
MN0 MN1 C1
C0 0.065
0.06
0.055
Sense
Enable MN2 0.05
(SAEN)
0.045
0.04
0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2
Rise Time (sec) x 10
-9
Process
Normal Ckt
Parameter
Statistical Extraction
Parameter
Extraction Design/simulation
With normal parameters
PVT, except short range
Statistical
Simulation
Measured
Yield Yield Prediction
IS
The Vcimax will be even greater VDD!
M3 M4
}
vi1 vi2
M1 M2
To summing circuit
using current mirror
IS2
N and P-pair
2gm
P-pair N-pair
gm
For the simple circuit, the first stage gain is not constant
over the common mode input range
Additional circuit is required to maintain the constant gain
M8
vi1 M3 M4 vi2
M1 M2
M5
+ IS2
VR2 M9
- M10
1:3
gm
Possible remedy:
Fix the gate voltage above Vt and apply the inputs
to the body of the transistor (bulk driven)
p+ n+ n+ n+
electron channel
p-well
n-substrate
p+ n+ current n+ n+
path
p-well
n-substrate
Suppress vertical component
through layout technique
Use the lateral BJT between source and drain
Vs=-0.6
Vs=-0.5 Vg=0.8V
Vs=0 Vg≤-1.2V
Vs=-0.2
Vg -0.5 Vs
When the gate voltage is negative,
the Ic-Vs characteristics look like ideal BJT
VTh
V =0B Bhat
Dr. Navakanta
Subthreshold Operation
qκVGS / kT − qVDS / kT
IDS = I 0e (1 − e ) D
ID
Where +
G
κ = (1 + C D / COX ) −1 B
VDS
W q[(1−κ )VBS −VTh 0 ] / kT +
I0 = kx e -
L VGS
- S
For VDS > 50mV
qκVGS / kT
IDS = I 0e VGS < VTh0
Dr. Navakanta Bhat
Subthreshold Operation
• Exponential non-linearity
• Modern Computer
– Pre Programmability
– Repetitive Computation
• Human Brain
– Speech Recognition
– Pattern Recognition
SUBTHRESHOLD OPERATION
IS THE NATURAL CHOICE
n
y = φb ∑ wi xi
i =1
x1 w1
w2
x2 y
Σ
b
xn wn Neuron
Activation
Function (Φb)
n
y = φ ∑ wi xi + b
b i =1
x1 w1
w2
x2 y
Σ
xn wn Neuron
Activation
Function (Φ)
n
y = φ ∑ wi xi
x0 = 1 w0 = b i =0
x1 w1
w2
x2 y
Σ
xn wn Neuron
Activation
Function (Φ)
wih who
x1 y
d
x2 + -
e
• Common choices
– Logsigmoid
1
yj = − λs
, y j ∈ {0,1}
1+ e j
– Tansigmoid
λs j − λs j
e −e
yj = λs j − λs j
, y j ∈ {−1,1}
e +e
x1 w(1) w(2) y1
d1
e1
y2
x2 e2 d2
y3
x3 d3
e3
Φ’
w(2) e1
e2
e3
•Weight update rule
δi(1) δi(2)
wij(l ) (n + 1) = wij(l ) (n) + ηδ i(l ) (n) z (jl ) (n)
Dr. Navakanta Bhat
BP Algorithm
• Derivative computation
′
y = 1− y 2 For tansigmoidal transfer fn
1
I1 = I SS − qκVdiff / kT
1+ e
1
I1 I2 I 2 = I SS qκVdiff / kT
1+ e
Vdiff
2.50E-08
ISS
Branch Currents (nA)
2.00E-08
1.50E-08
1.00E-08
5.00E-09
0.00E+00
-0.4 -0.3 -0.2 -0.1 0 0.1 0.2 0.3 0.4
∆V/2 ∆V/2
I = I (Vdiff + ∆V ) I4 I3
Vin1 + ∆V Vin2
3.00E-08 ISS
Branch Current (A)
2.00E-08
1.00E-08
I1 I2
I = I (Vdiff − ∆V )
Vin1 Vin2 + ∆V
ISS 3.00E-08
1.00E-08
I3 I2 I1 I4
Vin1 M3 M2 M1 M4 Vin2
Vin2 +∆V Vin1+∆V
ISS ISS
GND GND
I = I (Vdiff − ∆V ) I = I (Vdiff + ∆V )
Dr. Navakanta Bhat
Derivative of Neuron Activation
Function (DNAF)
I3 I1 I2 I4
∆V Vin2
Vin1 M3
∆V
M1 M2 M4
ISS ISS
GND GND
I1+I2
INAF IDNAF
IISS/2
SS I1 I2 ISS
I3 I4
∆V ∆V
Vin1 M3 M1 M2 M4
I3 I1 I2 I4
∆V/2 ∆V/2
Vin1 M3 M1 M2 M4
GND GND
Dr. Navakanta Bhat
NAF
VOS
Vdiff M1 M2 Vdiff M1 M2
ISS ISS
GND GND
RL1 RL2 kT I
VGS = ln
κq I 0
VOS M1 M2
Vdiff I1 RL1 = I 2 RL 2
ISS
kT RL 2 (W / L) 2
VOS = ln[ ] + ∆VTh 0
GND κq RL1 (W / L)1
Symmetric differential pair
Dr. Navakanta Bhat
Offset Voltage Vs Asymmetry
~24 mV
∆W / L
Asymmetry =
W /L
Dr. Navakanta Bhat
Asymmetry
1 (I) VNAF= 0 V 1
W + ∆W
MD1 L
∆W
M1
W
L 2
L
VNAF
2 (II) VNAF= 5 V 1
W
L
∆W / L
Asymmetry = 2
W /L
I3 I1 I2 I4
∆V ∆V
Vin1 M3 M1 M2 M4
GND GND
Dr. Navakanta Bhat
Derivative of Neuron Activation
Function (DNAF)
I1+I2
I1 I2
I3 I4
Vin1 M3 M1 M2 M4
VNAF VNAF
GND GND
Dr. Navakanta Bhat
Neuron Circuit (with Asymmetry)
INAF IDNAF
IISS/2 ISS
SS
I1+I2
I1 I2
GND I3 I4 GND
Vin1 M3 M1 M2 M4
VNAF VNAF
Error in DNAF
Error in NAF
With External
Offset Voltage
With
Asymmetry
With
Asymmetry
With External
Offset Voltage
With
Asymmetry
With External
Offset Voltage
Neuron INAF1
∆V
Neuron INAF1
b1 w4 b3
w8
x1 IN1 w0 νh1 w6
w2 y
νo
w1
x2 IN2 w3 νh2 w7
b2 w5
Vb W4 IDNAF INAF2
Vb VNAF W8
Vb W0 W1 Bias W6 IDNAF
Vb
Bias
Input out0 Neuron INAF1
Node out1
Output
Input out0 Neuron
INAF1
Node out1 Neuron
Vb VNAF
Vb W2 W3 Bias W7
Vb VNAF
Vb IDNAF INAF2
W5 Dr. Navakanta Bhat
Synaptic Weights: MDAC
W0 W1 W2 W3 W4 W5
Ii Io _ _ _ _ _ _
I o = W5 W4 W3 W2 W1 W 0 I i
w0 w1 w2 w3 w4
I1 W5 is used
as sign bit
Ii w5 w5
Iout
_ _ _ _ _ _
I out = w5 w4 w3 w2 w1 w0 I i
Dr. Navakanta Bhat
Dr. Navakanta Bhat
The Chip Micrograph
3.20E+00
3.00E+00
2.80E+00
NAF (V)
2.60E+00
2.40E+00
2.20E+00 Measured on Si
2.00E+00
1.80E+00
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
Input Voltage (V)
3.10E+00
2.90E+00
2.70E+00
NAF (V)
2.50E+00
2.30E+00
Measured on Si
2.10E+00
1.90E+00
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
Input Voltage (V)
2.70E+00
2.68E+00
2.66E+00
Measured on Si
2.64E+00
2.62E+00
DNAF (V)
2.60E+00
2.58E+00
2.56E+00
2.54E+00
2.52E+00
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
Input Voltage (V)
1.8
1.6
1.4
1.2
Error (V)
0.8
0.6
0.4
0.2
0
0 5 10 15 20
(28, 0.046)
25 30
Iterations
2.5
2
Error (V)
1.5
0.5
0
0 5 10 15 20 25 30
(40, 0.149)
35 40 45
Iterations
FG
n+ source n+ drain
electron channel
p-substrate
FG FG
Source Drain
n+ p+ p+ n+ n+
n well
p-substrate
This device has been reasonably successful and precision
Adaptive analog circuits have been built using this
Dr. Navakanta Bhat