Essentials of Equipment Design For Electromagnetic Compatibility (EMC) Compliance - 2010

Page
Essentials of Equipment Design for EMC Compliance

1
Essentials of Equipment Design for
Electromagnetic Compatibility (EMC)
Compliance
Elya B. Joffe
EMC/E
3
Engineering Specialist
K.T.M. Project Engineering
e-mail: ebj@netvision.net.il
Instructor
All Rights Reserved
Sponsored by
Who...?
Me???
Copyright 2010
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2
About the Instructor: Elya B. Joffe
JOFFE, Elya B., K.T.M. Project Engineering, Hod-Hasharon, Israel, and Senior EMC
engineering Specialist and consultant.
Mr. Joffe has over 25 years of experience in government and industry, in EMC/E
3
,
Electromagnetic Compatibility/Electromagnetic Environmental Effects, for electronic
systems and platforms, in particular aircraft and aerospace. He is actively involved in
the EMC design of commercial and defense systems, from circuits to full platforms.
His work covers various fields in the discipline of EMC, such as NEMP and Lightning Protection design,
as well as numerical modeling for solution of EMC Problems. Mr. Joffe has authored and co-authored
over 30 papers in the IEEE Transactions on EMC and Broadcasting, as well as in the proceedings of
International EMC Symposia. He is Senior Member of IEEE, Immediate Past President of the IEEE
EMC Society, Member of the BoD and President-Elect of the IEEE Product Safety Engineering
Society, and Chairs several Committees. He is also the Immediate Past Chairman of the Israel IEEE
EMC Chapter and has served as a "Distinguished Lecturer" of the IEEE EMC Society.
Mr. Joffe has received several awards and recognitions from the IEEE and EMC Society for his
activities. In particular, he is a recipient of the prestigious "Lawrence G. Cumming Award of the IEEE
EMC Society for outstanding service", 2002, the "Honorary Life Member Award" of the IEEE EMC
Society, 2004, and the IEEE EMC Society "Technical Achievement Award". He is also a recipient of
the IEEE "Third Millennium Medal". He was recently awarded the very prestigious IEEE Larry K
Wilson Transanational Award.
Mr. Joffe is also a member of the "dB Society". Mr. Joffe has been a member of the CEI-Europe
Faculty since 2004.
The biography of Elya Joffe has been published numerous times in the Marquis Whos Who In
The World .
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3
Module 1: Fundamental EMC Concepts
Module 2: Signals and Coupling Modes
Module 3: Field and Cable Interaction
Module 4: Enclosure Shielding
Module 5: Grounding and Bonding
Module 6: Filtering and Terminal Protection
Module 7: Summary and Wrap-Up
Seminar Outline
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4
In the (Very) Beginning
In the beginning, God created the Heaven and the
Earth
and God Said, Let:
0
D
D
t
H J
t
B
B
E
=
=
= +

And there
was light!
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5
Module 1
Introduction - Fundamental Concepts
Page
6
The U.S.S. Forrestal Incident
July 29, 1967
On July 29, 1967, the US Aircraft Carrier
Forrestal cruised of the coast of North
Vietnam. Its jets had already flown more than
700 sorties and there was no reason to expect
this day to be any different. Not threatened
by enemy aircraft, the A4 Skyhawks on the
deck were loaded with two 1000 lb. bombs, air
to ground and air to air missiles. Fully fueled,
they were ready for takeoff. Somewhere on
the deck of that carrier, attached to the wing
of an aircraft, was an improperly mounted
shielded connector. As the RADAR swept
around, RF voltages generated on that cable
ignited a missile which streaked across the
deck, striking an aircraft and blowing its fuel
tanks apart. Its two 1000 lb. bombs rolled to
the deck and exploded. Wing-tip to wing-tip,
the planes burned and the bombs exploded.
Fire spread below deck, and before it was
extinguished, 134 men were dead or missing.
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7
The Basic Rules in EMC
There are no rules!!!
EMI does -
what it wants!
where it wants!
when it wants!
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8
The Basic Rules in EMC
1. You cant win them all...
2. You cant even break even...
3. If you think you can...
Go to rule no. 1 !!!
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9
Electromagnetic Compatibility
Definition
The ability of the a device, unit of equipment
or system to:-
function satisfactorily satisfactorily in its
intended intended electromagnetic
environment
without introducing introducing intolerable
electromagnetic disturbance to to
anything anything in that environment
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10
Three Aspects of an EMI Problem
Generation of Electromagnetic Energy
Transmission of Electromagnetic Energy
Reception of Electromagnetic Energy
The Solution of any EMI Problem Requires the Removal (or
Neutralization) of At Least One of the Components
Source
[Emitter]
[Culprit]
Medium
Coupling Path
Victim
[Receptor]
[Receiver]
I = Immunity
E = EMI
A potential EMI Problem exists when
I<E
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11
Five Dimensions of an EMI
Situation
Amplitude (A)
EMI Situation
f{F, A, T, (I, D)}
Frequency (F)
Time (T)
Key Parameters to
an EMC Problem
FAT FAT- -ID ID
F
F
requency
requency
A
A
mplitude
mplitude
T
T
ime
ime
I
I
mpedance
mpedance
D
D
imensions
imensions
Impedance (I)
Dimension (D)
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12
The Last Rule in EMC...
Murphy is the Patron Saint of
EMC Engineers...
But remember
Murphy was an
Murphy was an
O P T I M I S T!!!
O P T I M I S T!!!
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13
Module 2
Signals and Coupling Modes
Page
14
Spectral Content of Pulsed Waveforms
Time vs. Frequency Domain
Reconstruction using 7, 15, 27 Harmonics
Radiation efficiency proportional to
electrical length of conductors
max
1 E fl l
I r r
| | | |

| |
\ \
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15
Spectral Content of Pulsed Signals
Effect of Wave-Shape on Spectral
Content
1
1
f
d
=
2
1
r
f
t
=
( )
log f
( )
e f
20 dB/dec
40 dB/dec
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16
Real World Circuit Elements
Nothing is like it seems Nothing is like it seems
At high frequencies, where the performance of reactive component At high frequencies, where the performance of reactive components is most s is most
needed (e.g., for filters) needed (e.g., for filters) - - they may not perform as anticipated they may not perform as anticipated
The INVISIBLE CIRCUIT must be considered in hi The INVISIBLE CIRCUIT must be considered in hi- -speed circuit design speed circuit design
Nothing is like it seems Nothing is like it seems Nothing is like it seems Nothing is like it seems Nothing is like it seems Nothing is like it seems Nothing is like it seems Nothing is like it seems
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17
Path of Least Impedance Principle
Visualize Return Currents
Currents always return
To ground??
To battery negative??
Where are they?
They are all here flowing to their source!!
All the rivers flow to the sea, but the
sea is not full
(Ecclesiastes 1:7)
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18
Which Path will the Return Current follow?
Currents always take the path of least
Distance? Resistance? Impedance!!!
Page
19
Equivalent Circuit
or:-
1
( ) 0
S S S
I R j L I j M + =
S
L M =
1
S S
S S
I j L
I R j L
=
+
1 1
,
S
g S
S
R
I I I I
L
<< >>
S
S g
S
R
I I
L
>> >>
In In tightly tightly coupled coupled
conductors: conductors:
1
C
21
B
2
S
ds
1
I
11
B
2
C
1
2 12
dI
V L
dt
=
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20
2 1
1 2
Vs
I Z
Z Z
=
+
1 2
1 2
Vs
I Z
Z Z
=
+
1 2 2 1
1 1
1 1 1 1 1 1
1 1 1 1
If Z >>Z I >>I (Ohm's Law)
min{ } min{ }
If Z , min{Z } min{R +jX }
If R << X min{Z } min{ X }
I Z
R jX
= +

second law that refers to entropy directly is as follows:
In a system, a process that occurs will tend to increase the total entropy of the universe.
The Second law of Thermodynamics: In a system, a
process that occurs will tend to increase the total entropy
of the universe.
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21
At LOW FREQUENCIES LOW FREQUENCIES, the current will follow the path of LEAST LEAST
RESISTANCE RESISTANCE, via ground (I
G
)
1

/
S
S S
j
I I
R L j
=
+
0
| | @
| | @
S S S
S
S S S
Z R R j
Z R j M
Z L L R
L

= + =

>>
>>
M
Source
Cable Load
R
S
L
S
R
L
I
g
I
1
I
S
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22
At HIGH FREQUENCIES HIGH FREQUENCIES, the current will follow the path of
LEAST INDUCTANCE LEAST INDUCTANCE, via the return conductor (I
S
)
| | @
|

| @
S S S
S S
S
S
Z R R j
Z L L
M
R
L
Z R j

>>
>>
= + =


1

/
S
S S
j
I I
R L j
=
+
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23
Experiment Set-Up
Page
24
When is Inductance Minimized?
Definition of Total Loop Inductance
For I=constant, F
min
implies A
min
( )
min min min
, ...
A
B da
L
I I
B B I thus L A
=
=

, B
Current I
Magnetic Flux
X X X X X
X X X X X
X X X X X
L
I
=
Loop Area, A
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25
High frequencies are well behaved; Low frequencies
are the bad boys
Implications of the Rule
The principle of Path of Least
Impedance apply in EMC design in:
Grounding design and topologies
Filtering and Terminal Protection Schemes
Transmission line (cable) design and shielding
Etc
Few principles in EMC are as important as Few principles in EMC are as important as
this one this one
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26
EMI Control Design Techniques
EMC design incorporates efforts, techniques and
know-how
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27
Module 3
Field and Cable Interactions
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28
Common- & Differential-Mode Signals
I
I I
C
=
+
1 2
2
I
I I
D
=

1 2
2
I
D
I
D
d
I
C
I
C
d
I
D
-Differential Mode
Current
I
C
-Common Mode
Current
Excellent flux
cancellation
No flux
cancellation
Contradictions do not exist. Whenever you think you are facing a
contradiction, check your premises. You will find that one of them is wrong
Atlas Shrugged
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29
Some Sources of Common-Mode Signals
Ground Loops External Radiated Field
Or Capacitive Crosstalk
Electric Flux
D
V
in
- 2 I
CM
V
G
+I
DM
+I
CM
-I
DM
+I
CM
A
I
1
I
2
I
3
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30
Differential-mode radiation efficiency:
2
14
max
2.632 10 V/m
E f A
I r
| |
=
|
\
Common & Differential Mode Signals
Source: Ott, H., Noise
Reduction Techniques
in Electronic Systems,
1988
Current [mA] Frequency
[MHz]
1000 100 10 1
1,320 132 13.2 1.32 10
11,900 1,190 119 11.9 30
13,200 1,320 132 13.2 100
Computed E[V/m]
for r=1 m, A = 10 cm
2
I
r
A
X
Y
Z
r H
r P E H =

, A r <<
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31
Common-mode radiation efficiency:
Current [mA] Frequency
[MHz]
1000 100 10 1
630k 63k 6.3k 630 10
1,890k 189k 18.9k 1.89k 30
6,300k 630k 63k 6.3k 100
Computed E[V/m]
for r=1 m, = 10 cm
6
max
1.26 10 V/m
E fl
I r
| |
=
|
\
Common & Differential Mode Signals
I
r
X
Y
Z
r E
r P E H =

, L r <<
L
Source: Ott, H., Noise
Reduction Techniques
in Electronic Systems,
1988
Page
32
Common Mode Current Field Strength:
An Illustration
Radiation efficiency at a distance R from two close
wires carrying Common Mode Current, I
C
:
At f=30MHz, MIL-STD-461F, the RE102 requirements
for Aircraft (AF) Internal Equipment is 34dBmV/m, or
50mV/m at r=1 meter.
For L=2 meter, the above formula yields that...
A common current as low as I A common current as low as I
C C
=656nA is sufficient to =656nA is sufficient to
exceed the above MIL exceed the above MIL- -STD STD- -461E, RE102 Method 461E, RE102 Method
E f L I
r
C
=
2 6 28 10
1
7
. ( ) ( ), V/ m
Page
33
Low Frequency Radiated Emissions
from Cables
B
r
I
0
2
I
B
r
u
Single Wire
( )
0
2
I d
B
r r d
u

=
+
B
Y
I
Parallel
Pair
I
d
r
x
B
X
Twisted
Pair
( )
2
0
0
;
r
p
I d d
B q I q e q
p r p

= =
p (pitch of twist)
r
B
d (separation of wires)
I
I
I
0
(q)=0
th
order modified Bessel Function of 1
st
kind
Correction to B for parallel wire line of
same spacing to obtain twisted pair B
Page
34
Reduction of Low Frequency
Magnetic Field Emissions from Cables
Twisting of the cable pair provides two contributions:
Reduction of loop area between conductors
Effective cancellation of magnetic flux from adjacent mini-loops
Twist Factor
Source Load
I
+
I
-
Loop j Loop j+1
dl
j
dl
j+1
r
j
r
j+1
Observation point,
O
1 j B +
j B
s
~
~
~
~
d
p
1
20 1 2 sin ;
2 1
60 @ 100 for 30 40 Twists/m
T
T
R Log nl dB
nl n
R dB f kHz

| | | |
= +
`
| |
+
\ \

)

Page
35
Reduction of Low Frequency
Magnetic Field Emissions from Cables
Common errors in twisted circuits resulting in no magnetic
flux cancellation
Twisting is only effective in differential, balanced pairs differential, balanced pairs
Unbalanced Circuit: Part of the Signal
Current Returns through the Signal
Reference Structure (I
G
)
Twisting Separate Single-Ended
Signal Wiring: Return Currents of
Both Circuits (I
G(1+2)
) Return
through the Signal Reference
Structure
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36
Cable 1 meter long/0.1 meter high Cable 10 meters long/1 meter high
Cable resonance frequency proportional to cable Dimensions
Max. induced current proportional to cable height above ground plane
Interaction depends on circuit topology
Electromagnetic Fields Coupling into
Cables
20 dB
Page
37
Coupling of Low Frequency Magnetic
Fields onto Cables
The most efficient method for
controlling magnetic field coupling is
reduction of loop area reduction of loop area:-
between wires in balanced loops balanced loops
between wires to ground to ground
Induced
EMF Into
Loop
Loop Area Frequency
Magnetic
Flux Density
2 V A f B =
C A
B
E dl d a
t
Page
38
Why Shield Cables?
Shielding reduces coupling of external EMI to the cable
Shielding reduces radiated EMI from the cable
In coaxial cables only coaxial cables only - the shield also serves as the
return path for the signal
"The mathematical theory of wave propagation along a conductor with
an external coaxial return is very old, going back to the work of
Rayleigh, Heaviside and J. J. Thomson"
(S. A. Schelkunoff, 1934)
Page
39
How Does the Shield Work ?
In a non non-shielded cable:-
Z
S
Z
L
Signal Reference
Structure
R
e
tu
rn
C
u
rr
e
n
t P
a
th
E-field
H-field
Page
40
In a shielded cable, grounded at one one
end end:-
E-field terminates at the shield (@ Low f)
H-field penetrates the shield
Z
S
Z
L
Signal Reference
Structure
R
e
tu
r
n
C
u
rr
e
n
t P
a
th
E-field terminated
on Shield
H-field penetrating
the shield
Shield
Page
41
In a shielded cable, grounded at both both
ends ends:-
E-field terminates at the shield (@ Low f)
H-field cancelled by opposite shield currents
Z
S
Z
L
Signal Reference
Structure
H
ig
h
F
re
q
u
n
c
y
R
e
tu
rn
C
u
rre
n
t P
a
th
E-field terminated
on Shield
H-field confined
in the shield
Shield
L
o
w
F
re
q
u
n
c
y
R
e
tu
rn
C
u
rre
n
t P
a
th
Page
42
Design goal:-
Cancellation of magnetic flux emerging from
oInternal conductor current and
oOpposite shield current
Magnetic flux from both currents cancels out
Goal achieved by:
Limiting ground current
How Does the Shield Prevent
Magnetic Field Emissions?
Shield Grounded One End, at
Most; Circuit is Still Balanced
Shield Grounded Both Ends;
Unbalanced Circuit
Current, if not obstructed,
will always follow the path
of least impedance
In Balanced Shielded Cables, the Shield
Does not Carry Intended Signal Current
Page
43
Shield Surface Transfer Impedance
Definition
{ }
i CM S
E f I I = =
1. An external incident field external incident field (E
I
) induces
CM currents CM currents on the shield (I
S
)
2. 2. CM voltage, CM voltage, dV dV, due to I , due to I
CM CM
is is
induced between the shield and the induced between the shield and the
inner conductor (per dl of cable) inner conductor (per dl of cable)
3. 3. Shield Surface Transfer Shield Surface Transfer
Impedance, Z Impedance, Z
T T
, is the transfer , is the transfer
function between the two function between the two
Signal Reference
Structure
dx
0
(0)
S
I I =
0
( )
S
I
I x I dx
x
= +
(0)
i
V
(0)
i
I
( )
i
I dx
x
( )
i
V dx
0
(0)
S
V V =
0
( )
S
V
V x V dx
x
= +
S T
I Z dx Zdx
T
Y dx
i
I
i
i
I
I dx
x
i
i
V
V dx
x
S T
V Y dx
i
V
0
1
; /
T
S
i
i
I
dV
Z m
I dl
=
| |
| |
=
|
|
\
\
Page
44
Effect Of Frequency On Transfer Impedance
The Transfer Impedance, Z
T
, consists of two
components:-
Resistive component, R
T
Inductive component, L
T
Z R j L m
t t t
= + , /
| |
T
Z m
10
2
T
c
L
| |
|
\
2
T
c L

Page
45
Effect of Shield Configuration
Shield Transfer Impedance for Various Shield Configurations
Adding a second shield layer adds ~6 dB of attenuation
For most cable shields, the
Surface Transfer Impedance is
inductive at F>1MHz,
approximately
R
T
becomes negligible
L
T
dominates
Page
46
Shield Termination and Grounding
Effect Of Shield Termination: Pigtails
An improperly-terminated shield will often be a significant cause of
EMI problems, emission and coupling
It performs almost like no shield is present
0
10
20
30
40
50
1
2
.
5
4
.
0
5
.
5
7
.
0
8
.
5
1
0
Frequency [GHz]
S
h
i
e
l
d
i
n
g

E
f
f
e
c
t
i
v
e
n
e
s
s

[
d
B
]
360
0
Shield Termination
2 (*) Pigtail
(*) (*) 2 2 Pigtail is the Pigtail is the absolute maximum absolute maximum
length length recommended recommended
Terminal
Strip
Center
Conductor
Dielectric
Braided
Shield
Outer
Sheath
Page
47
Shield Termination
Proper Outer Shield Termination
Conductive Shrinkable
Boot Termination
The shield must be terminated at both ends, at least!
Use a peripheral shield termination (EMI Backshell) in
order to ensure acceptable shielding effectiveness
EMI Backshell Termination Backshell
Ground
Hooks
Adapter
Strain
Relief
Individual
Wire
Shields
Plug
Individual Wire Shield
Termination
D-Type Shield
Termination
Source: Glenair
Page
48
Shield Termination
Grounding of Peripheral Shield
360
0
Shield Termination
External Pigtail
Internal Pigtail
Pigtail to Signal Ground
Best
Worst
Page
49
Module 4
Enclosure Shielding
Page
50
Objectives of Shielding
The technique may be
old
but it provides me
full protection from
EMI...
Page
51
A (Absorption) R (Reflection)
Reflection Coefficient
Propagation Coefficient
Transmission Coefficient
E
Y
H
Z
E
Y
H
Z
E
Y
H
Z
E
Y
E
Y
H
Z
Reflected
Wave
Attenuated
Transmitted
Wave
Propagating
Wave
Internally
Reflected
Wave
Incident
Wave
l
H
Z
Shielding Mechanisms of Metallic
Enclosures
B (Secondary Reflections)
( ) ( )
2
1
20 1 20 20
l l
dB
Log Log e L e SE og

| |

|
\
+
= +
Page
52
The Wave Impedance
At Near & Far Field Regions
The electromagnetic field impedance:
In the vicinity of the source, the wave impedance depends
on the source characteristics:
High-Z source: Z
W
> 120p W
Low-Z source: Z
W
< 120p W
In the far field:
Z
W
= 120p W
Z
E V m
H A m
W
[ ]
[ / ]
[ / ]
=
Distance, normalized to
l/2pr
Wave
Impedance, W
Page
53
Reflection Losses (R)
And When The Wave Hits The Surface...
In a perfectly conducting
plane, reflection would have
been complete
Induced surface currents
neutralize the incident field
In a practical conducting
plane, conductivity is finite
Induced surface currents
penetrate the shield and can
induce internal fields
Reflection loss for an EM wave will Reflection loss for an EM wave will
depend on the ratio of the free depend on the ratio of the free
space impedance Z space impedance Z
W W
to the surface to the surface
impedance impedance \ \of the shield Z of the shield Z
s s
Page
54
Reflection Losses (R)
Plane WaveLow Z Waves High Z Waves
3 2
[ ] 322 10
f r
r
e
r
R dB Log

u
| |
= +
|

\
[ ] 168 10
f
r
p
r
R dB Log

u
| |
= +
|
\
2
f r
[ ] 14.6 10
r
h
r
R dB Log

u
| |

= +
|
\
Page
55
Absorption Losses (A)
An EM wave penetrating through a
metallic medium is attenuated due
to Ohmic losses
Absorption loss in a screen
decreases exponentially and is
reduced by 1/e at a distance d
equal to the penetration depth
Skin-Depth: The depth where the
field/surface current is attenuated
to e
-1
(37%, approx.) of its value on
the surface
u
=

2
( )
0
t
J t J e

=
Page
56
Absorption Loss in a shield 1 Absorption Loss in a shield 1 (one skin depth) thick is 9dB (one skin depth) thick is 9dB
Absorption Losses are independent of the field characteristics a Absorption Losses are independent of the field characteristics and nd
are dependant on thickness of the shield only are dependant on thickness of the shield only
Absorption Losses (A)
Or:-
20 log 8.69 ,
t
t
A e dB
| |
| |
= =
|
|
\
\
131.4 ,
Hz r r
A t f dB u =
Absorption Loss for 1mm Shield
of Steel & Copper
Page
57
Reflection & Absorption Combined
Iron Metal Sheet
Page
58
Apertures: The Inevitable Necessities
Violating Shielding Integrity
Knobs
Lamp Holes
Ventilation
Openings
Lamps
Slot
Page
59
Shield Compromises
Previously we assumed a perfect, infinitely large & planar shield
in practice, shielding is compromised:
Holes & apertures for: Holes & apertures for: Connectors, components, cable entries, ventilation,
displays
Seams Seams, e.g., Mating members (screwed, riveted, welded, etc.)
Doors and access covers Doors and access covers
Vents Vents, e.g., Ventilation, heating
Non Non- -homogenous areas homogenous areas, e.g., Screens, meshes
Shielding performance is typically dominated by aperture
leakage
As those are, usually, inevitable necessities, the As those are, usually, inevitable necessities, the
enclosure design will focus on aperture control enclosure design will focus on aperture control
Page
60
Leakage From A Single Aperture
Aperture Reflection Losses vs. Shield Attenuation
Page
61
Induced currents flow as long as there
are no obstacles in their path
Any and all apertures must be arranged
in such a way as to minimize their effect
on the currents
o An H-field, which is predominantly
tangential close to a metallic screen,
may penetrate through an opening and
introduce an induced current into an
underlying cable or circuit
o An E-field, which hits a metallic
screen at right angles, may penetrate
through an opening and enable an
induced voltage to run along an
underlying cable or circuit
Page
62
Aperture Reflection Losses
From Babinets Slot-Dipole Reciprocity Theorem:
and:
we derive the following expression for Aperture Reflection Loss:
2
4
W
Slot Dipole
Z
Z Z =
2
120
Dipole
W W
Z j Ln Cot
S S
| | | |
=
| |
\ \
(*) For a circular aperture circular aperture, add 2 dB add 2 dB
[~ ~20log(/4)]
( )
( )
[ ] 97 20log 20log 1 ln , W
2
mm
mm MHz
mm
a
W
R dB W f
S

| |
= + +
|
\
Page
63
Leakage From Multiple Apertures
Effect of Shield Discontinuity on
Magnetically- Induced Shield Current
Multiple small openings are preferable to
a single large one
o Note that multiple small holes may be very
effective in stopping fields at higher
frequencies
Multiple Apertures
o Small Holes
o High Cutoff
Frequency
o __?_ Coupling
o __?_ Shielding
Single Aperture
o Large Hole
o Low Cutoff
Frequency
o Large Coupling
o Little Shielding
Page
64
Leakage From Multiple Apertures:
Many, smaller apertures are preferable, compared to a
single, large aperture
Higher cutoff frequency
Higher attenuation at the same frequency
Area of each hole, a
Number of holes
per unit square, N
Total Number
of holes, n
K K
1 1
should be considered should be considered
only if the source is far only if the source is far
from the aperture, i.e., from the aperture, i.e.,
r >> d, W r >> d, W
1
10 log(1 ) 10log( ) 10log( ), K a a n dB = =
Page
65
What If The Shield Is Deep ?
A deep aperture: t/W>>1, t/d >>1 acts like a
waveguide below cutoff (WGBC) waveguide below cutoff (WGBC)
Effect considered as Aperture Absorption Losses Aperture Absorption Losses
Page
66
Aperture Absorption Losses - WGBC
A
p
e
r
t
u
r
e

A
b
s
o
r
p
t
i
o
n

L
o
s
s
e
s

A
a
,

d
B
For t/W > 3, For t/W > 3, Aa Aa>100 dB >100 dB
Page
67
The most common application of The most common application of
honeycomb panels is for ventilation and honeycomb panels is for ventilation and
cooling air entry, without compromising cooling air entry, without compromising
the shielding integrity of the enclosure the shielding integrity of the enclosure
Applications of Waveguide Below Cutoff
(WGBC)
Honeycomb Panels & Cooling Vents
Shielded
Enclosure
Honeycomb
Honeycomb
Page
68
Equipment and System Shield Design
Thin Film Coating
The primary shielding mechanism: Reflection (R)
Shielding Effectiveness of
Conductive Glass to High-Z
Fields
Page
69
Screen Mesh: More (Shielding) for less (Visibility)
Application of wire mesh
shield for displays
Shielding mesh placed
in front of the display in front of the display
EMI Proof
Metal Case
Conductive Glass
or Wire Mesh
Feedthrough
Filter
Panel
Wire mesh
Gasket
Page
70
Slots and Seams
The first law in shielding practices:
There is no perfect bond There is no perfect bond
If not properly closed, EMI leakage will occur
through seams & slots in the enclosure
Attributing for emissions and coupling at
frequencies above 300MHz, typically
Proper treatment must be implemented
to slots & seams for maintaining shielding integrity
Use of overlapping seams
Use of multiple screws
Use of conductive gaskets
And And Surface Treatment Surface Treatment
Page
71
Overlapping seams:-
Increase the capacitance between the conductors
Reduces seam impedance (increases reflection losses)
Increases the effective depth of the waveguide between the
conductors, improving absorption losses
Slots and Seams
Use of Overlapping Seams
Page
72
Slots and Seams
Use of Screws To Fasten Mating Panels At
Seams
W
S
Gap
Gap
Dimension
This solution is good, but:-
Minimum Seam Width = 5 x Gap Dimension
Fastener spacing - W, not greater than
l/50, @ military systems
l/20, @ commercial systems
Page
73
Solutions For Increasing Mating
Member SE
SE Requirements SE Requirements Comments Comments
SE SE 30 dB 30 dB and and f f 1 GHz 1 GHz Stiffen cover, avoid EMI gaskets Stiffen cover, avoid EMI gaskets
30 < SE 30 < SE 50 dB 50 dB & & f f 1 GHz 1 GHz Twilight region, stiffen and lap Twilight region, stiffen and lap
over flanges over flanges
50 < SE 50 < SE 60 dB 60 dB & & f f 1 GHz 1 GHz Same as 30 Same as 30- -50 dB, but excessive 50 dB, but excessive
number of screw required and number of screw required and
extremely rigid cover extremely rigid cover
SE > 60 dB SE > 60 dB or or f > 1 GHz f > 1 GHz Use EMI gasket Use EMI gasket
?
Page
74
Conductive EMI Gaskets
Conductive (EMI) gaskets are
used for:
Filling the aperture with
conductive material
obtaining electrical bonding
between the mating members
Gaskets must be used when...
Excessive SE requirements
(SE >40dB @ 1GHz) are
specified
Aperture sized cannot
be reduced significantly from l/2
Emission or interference
frequencies exceed 100 MHz
Mating members are of dissimilar metals
Gasket
Page
75
Maintaining Shield Integrity
Penetrating Objects
Grounding Grounding
Conductors Conductors
Groundable Groundable
Conductors Conductors : :
Pipe, Cable Pipe, Cable
Shield or Shield or
Waveguide Waveguide
Insulated Insulated
Conductors Conductors
Proper Proper Compromising Compromising Serious Violation Serious Violation
Filter/Surge
Arrester
Page
76
Module 5
Grounding and Bonding
"Ground is where potatoes and carrots thrive"
(Dr. Bruce Archambeault)
Page
77
Purposes for Grounding
Safety: Prevention of shock hazard to personnel
Due to lightning strokes or power line short circuits to enclosure
Traditionally
Path for return current in particular vehicles (e.g.,
aircraft)
Vehicle serves as return conductor
Page
78
The voltage across the
finite ground
impedance, Z
G
due to
noisy circuit (Circuit
#2) is:
Ground Related Interference
Common Impedance Interference Coupling (CIIC)
2
2 2
2
2 2
2 2
;
G S
G
S L G
G S
G S L
S L
Z E
E
Z Z Z
Z E
Z Z Z
Z Z
=
+ +
<< +
+
The interference voltage coupled across the load Z
L1
of the sensitive
circuit (Circuit #1) is:
Thus
1
1 1
1 1
;
L G
i G S L
S L
Z E
V Z Z Z
Z Z
<< +
+ ( ) ( )
1 1 2
1 1 1 1 2 2
L G L G S
i
S L S L S L
Z E Z Z E
V
Z Z Z Z Z Z

=
+ + +
( ) ( )
1
1 1 2 2
20
L G
dB
S L S L
Z Z
K Log
Z Z Z Z

=

+ +

Page
79
Objectives of Practical Grounding Objectives of Practical Grounding Objectives of Practical Grounding Objectives of Practical Grounding
Grounding may not be the Solution; rather it could be
Part of the Problem
The objective of grounding system design could be
stated as follows:
"Design the system such that in spite of the need for in spite of the need for
grounding, system performance will not be degraded grounding, system performance will not be degraded due
to ground-coupled interference".
"Grounding Systems are "Grounding Systems are
Interference Interference
Distribution Devices" Distribution Devices"
(Dr. Carl E. Baum)
Page
80
Lower the impedance of the common return path (Bonding)
Reduces the ground voltage drop below the sensitivity levels of the victim
circuits
Limit other currents I I
X
circulating in the return path used for
circuit X
Isolating currents from difference circuits, reducing coupling between
currents flowing in the same path
So, We Have A Practical Ground...
What Do We Do???
... ...
Design a noise tolerant system
Using differential circuits with high common
mode rejection, for instance
The choice of each technique (or their
combination) depends on feasibility,
system/circuit size, cost, frequency and
safety aspects
Page
81
Optimizing Ground System Design
Goals of Equipment and System Level
Grounding System
The grounding scheme inside a system must accomplish the
following goals:
Analog, low level circuits must have extremely noiseless dedicated
returns; typically wires are used, dictating a single point, star grounding
scheme
Analog, high frequency circuits (RF, video, etc.) must have low
impedance, noise free return circuits, generally in form of planes or their
extensions (e.g., coaxial cables)
Digital, logic circuit returns, especially high speed digital circuit returns, must have
low impedance over the entire bandwidth (determined by the edge rates ), as power
and signal returns share the same paths
Returns of powerful loads (e.g., solenoids, motors, relays, lamps, etc.) should be
separated from all the above, even if they end up at the same power supply output
terminal
For signals that communicate between parts of the equipment or system, the
grounding scheme must provide a common reference with minimum ground shift (low
common mode noise) between system parts
Page
82
Ground System Topologies
A Floating System
Page
83
Single Point Ground (SPG)
Daisy Chain Single Point Ground

Page
84
Single Point (Star) Ground

Page
85
At higher frequencies, where the length of the ground
conductors approaches l/4, the SPG is ineffective
Distance along
GND Conductor
/4
Z
S
0
This circuit should ideally be grounded This circuit should ideally be grounded
every every /10 /10 /20! /20!
S
Signal Reference
Structure
GRP="0V"
V
x
I
x
x
V
x
,

I
x
in
Z
x=8 88 88 88 88 88 8
x=8 88 88 88 88 88 8
A standing wave (black) depicted as the sum of two
propagating waves traveling in opposite directions (red and
blue).
Page
86
Multi-Point Ground (MPG)
Page
87
Video Processor
Main CPU
I/O Circuit
Aux .Rx
Active
Antenna
Tx/Rx
Power Supply
5VD
15VA
5/3.3VD
15VA
5VA
5VD
5VD/RF
15VA/RF
15VA/RF
28VA/RF
CGP
DC/DC Module
5VD
3.3VD
15VA
5VA
5VD/RF
15VA/RF
5VD/RF
15VA/RF
15VA/RF
28VA/RF
Equipment-Level
Ground Tree
Design Process
CGP
3.3V / 5 VD
15VA
15VA/RF
5VD/RF
15VA/RF
28VA/RF
5VD
? ? ?
Aux .Rx
Tx/Rx
Main CPU
Video
Processor
5VA
5VD
I/O Circuit
Enclosure Chassis
15VA
5VD
Page
88
A model for illustrating the effect of grounding topology on system
performance
C
A
d
=
0
9
1 36 10 = F m /
C=Capacitance of PCB to Ground
Ground Loops
SPG vs. MPG
Circuit #1 Circuit #2
I
CM #1
I
CM #2
V
SRS
=V
CM
Transmission
Line
C
d
A
C
A
d
V
S
Z
S
Z
2
Z
1
Z
CM
R
1
R
2
Z
L
h
S
Page
89
Ground Loops
SPG vs. MPG
Longitudinal Conversion Loss factor, LCL Longitudinal Conversion Loss factor, LCL:
Constant
20
'
CM
dB
DM
V
o
V
LCL Log
V
=
| |
=
|
\
Page
90
Ground Loops
SPG vs. MPG
At Low Frequencies
Capacitances, C, are dominant
Circuit impedance reduces with
Frequency (f)
CM current increases with f
DM voltage increases with f
At High Frequencies
Low Pass Characteristics of the
transmission line are dominant
Circuit impedance increases with f
Termination impedance limits line
currents
Both sides floated
Floated Both Ends
Frequency [Hz]
L
o
a
d

D
M

V
o
l
t
a
g
e
Page
91
Ground Loops
SPG vs. MPG
At Low Frequencies
Circuit series impedance, due
to the capacitances, C, is
reduced
CM current (and DM voltage)
increases
At High Frequencies
No change from previous case
One side grounded
Floated One End
Frequency [Hz]
L
o
a
d

D
M

V
o
l
t
a
g
e
Page
92
Ground Loops
SPG vs. MPG
At Low Frequencies
Circuit series impedance, is
independent of capacitances, C
Circuit impedance determined
by wiring & Load resistance (R)
CM current (and DM voltage)
independent of f
At High Frequencies
No change from previous
cases
Both sides grounded
Grounded Both Ends
Frequency [Hz]
L
o
a
d

D
M

V
o
l
t
a
g
e
Page
93
SPG vs. MPG
Low frequency circuits
Single point grounding only
Floating provides marginal improvement and increased risk
Low frequency performance is strongly dependent on the circuit grounding
topology
Low frequency performance significantly degraded with multipoint grounding
High frequency circuits
Multipoint grounding only
High frequency performance independent of grounding topology
Ground
Loop
Page
94
Ground Loops
Techniques for Opening Ground Loops
Isolation Transformer
Signal is coupled magnetically, thus the transformer inserts a high longitudinal
impedance in series with the CM current path
Common Mode decoupling of 100 Common Mode decoupling of 100- -140 dB can be achieved @ f=1kHz 140 dB can be achieved @ f=1kHz
Expensive, frequency limited, and not always practical for signa Expensive, frequency limited, and not always practical for signal circuits l circuits
Page
95
Ground Loops
BALUNs (Common Mode Chokes)
Alternative Symbols
S
Signal Reference
Structure
E
G
Z
GS
Z
GL
V
N
,

V
L
Z
S Z
LB
Z
G
E
S
Z
LA
C
P
I
S
I
CM2
I
CM1
L
2
L
1
M
CM
Current
Signal DM
Current
Core
Hi u
CM-Generated
Flux
DM-Generated
Flux
Inserts high-Z for CM signals, while passed unnoticed by
DM currents - A mode-selective filter
CM rejection > 80 CM rejection > 80- -100 dB can be achieved @ high 100 dB can be achieved @ high- -f f s s
Bulky; can be implemented by Ferrite beads Bulky; can be implemented by Ferrite beads
Page
96
Ground Loops
Optical Isolator/Optocoupler
Signal is coupled optically, thus the opto-isolator inserts a high
longitudinal impedance in series with the CM current path
Common Mode decoupling of 60 Common Mode decoupling of 60- -80 dB can be achieved 80 dB can be achieved
For digital circuits only
Page
97
Ground Loops
Isolation Amplifier
Grounds isolation within the two stages of the buffer amplifier
Each stage referenced to its associated ground
Common Mode decoupling of 60 Common Mode decoupling of 60- -80 dB (*) can be achieved 80 dB (*) can be achieved
(*) 120 dB in special applications (*) 120 dB in special applications
Page
98
Ground Loops
Circuit Bypassing
Basically a HF filtering mechanism, shunting CM noise to ground
Care to be paid not to kill the intended signal
Performance depends on value of capacitors, often requiring Performance depends on value of capacitors, often requiring
combination of several approaches combination of several approaches
Page
99
Ground Loops
Example: 10/100BaseT Interface
Typical 10/100BaseT Receive and
Transmit Interfaces Circuit
Consists of Balancing Magnetics and
Bypass Capacitors
Transmit
Interface
Receive Interface
Page
100
Bonding: Definition
Bonding Bonding: The establishment of a low impedance low impedance path between two metal
surfaces, e.g.,
Between two points on a ground reference plane
Between the ground reference plane and a component, circuit or structural
element
etc.
Purposes of bonding:-
Avoid development of electric potentials between metallic parts, which could
produce interference
A good bond:-
Enables the design objectives of other EMI control methods, e.g.,
grounding, filtering, shielding, etc.
Minimizes RF voltage differences and ground current loops
Deters the electrostatic charge buildup
Protects from lightning & shock hazards
Page
101
Implementation of Direct Bonds
Bonding Area
(Clean both members over entire
mating surface + 1/8 perimeter
Bolted Members
Bonding of Connector
Bracket Installation: Rivet or Weld
Page
102
Direct and Indirect Bonds
Direct (Hard) Bond
Indirect (Jumper) Bond
Bonding Area
(Clean both members over
entire mating surface + 1/8
perimeter
Page
103
Indirect Bond Impedance
Bonding Impedance of a
Bonding Strap
1
2
S C
r
f
L C
=
S
S C
r
L
Z
R C
=
Page
104
In DC, resistance is given by:
Resistance increases with frequency increase due to skin
effect
d
A
r
L=length of
conductor
2
, 0 ( ), r
DC
L
f z D
r
L
R
A
H C
=
Lowering Bond Impedance
Resistance of Conductors
( )
( )
2
1
4
2 1
4
2 1 , 0,
4
DC
r r
D
D
C
C
C
A
R
r f
R
r f f r
R r
R u
+

| |
= +
>
\
>
|
+ <<
Page
105
Reduces with frequency
BUT Reactance INCREASES with frequency
A grounding conductor as a
transmission line with a ground
plane
Ground Plane
Equipment
Case
Grounding
Conductor
Z
in
Z
0
=(L/C)
1/2
Z
L
=0
Ground
Plane
Cable
Ground
L
o
g

|
Z
|
Log f
Series
Resonance
Parallel
Resonance
Lowering Bond Impedance
Intrinsic Inductance of Conductors
2 2
;
P
AC
P
AC
L
Z Q L Q
R
L
Z
R
= =
=
0
1
2
tan( )
in
f
LC
Z jZ x LCx
=
=
( )
;
S
AC
S AC
AC
L L
Z Q
Q R
L
Z R
L R

= =
= =
S AC
Z R =
L
AC
R
X
Page
106
Surface Treatment
Surfaces must be maintained
as smooth as possible
Remove dirt, paints and non-
conductive protective coatings
from the bond area
Select the mating metals
according to the
electrochemical chart
(dissimilar metals
considerations)
Apply conductive protective
coatings
Page
107
The rate of (galvanic) corrosion depends on the separation betwe The rate of (galvanic) corrosion depends on the separation between en
the mating metals in the electromotive Force (EMF) Series the mating metals in the electromotive Force (EMF) Series
Corrosion is minimized if the combined potential difference does Corrosion is minimized if the combined potential difference does not not
exceed: exceed:
0.3V: in harsh environments 0.3V: in harsh environments
Exposure to salt spray/weathering Exposure to salt spray/weathering
0.5V: in benign environments 0.5V: in benign environments
Interior, salt free condensation only Interior, salt free condensation only
Corrosion results from a compatible conductive
elastomer and a pure silver-filled elastomer
mated with aluminum, after 168 hours of salt-
fog exposure
Compatible
gasket
Silver-filled
gasket
Electromotive Force Series & Corrosion
Control
Page
108
Corrosion Control
Page
109
Copyright 2008
Anodic
Cathodic
Cathodic
Anodic
Cathodic
Anodic
POOR POOR BETTER BETTER BEST BEST
Surface treatment is the only assurance of a long lasting (and
effective) bond
Select the mating metals according to the electrochemical chart
(dissimilar metals considerations)
Apply conductive protective coatings
Steel: Plate with tin, zinc or conductive cadmium
Copper, bronze: Plate with tin
Aluminum: Alodine or Irridite
(
*
)
conversion treatment
(
*
) Irridite #14 is the best selection
With dissimilar metal contacts, coating just one of the electrodes is
insufficient
Complete coating, or at least edge sealing is required Complete coating, or at least edge sealing is required
Application Of Protective Coatings
Page
110
Module 6
Filtering and Terminal Protection
Page
111
Sources & Types of Conducted EMI
Conducted EMI can be generated within a system (CE)
Switch-mode power supply emissions
Low Frequency (due to power line harmonics)
Typically Differential mode
High Frequency (due to switching and rectification)
Common and Differential mode
Transient emissions due to the switching if Inductive loads
The The threat threat : Interference to sensitive loads sharing the power : Interference to sensitive loads sharing the power
system system
Signal line emissions
Mostly high frequency common mode emissions
Due to coupling (crosstalk and radiated EMI coupling to I/O
lines)
The The threat threat : Radiated EMI and crosstalk : Radiated EMI and crosstalk
Page
112
Sources & Types of Conducted EMI
Conducted EMI can be coupled into the system (CS)
Power and signal line EMI and transients
Low Frequency
Due to magnetic induction
Due to power line harmonics, and voltage variations/fluctuations
(power lines only)
Typically Differential mode
High Frequency EMI
Due to radiated fields pickup
Typically Common mode
Transients and surges
Due to switching of Inductive loads
Due to lightning induced surges and transients
Page
113
EMI Filters: Definition
A filter is a simple method for attenuating conducted (and
subsequently - radiated) emissions and
IL Log
E
E
Log
E
E
L
L
L
L
( )
( )
( )
( )
( )
f
f
f
f w / Filter Inserted
f w / o Filter Inserted
= = 20 20
1
2
A filter is simply a two-port device, with the following transfer function, H(f):
Page
114
Low-Pass Filters (LPF)
Low pass filters are the most commonly used filters for
EMC Applications
Power Line Filters
Low Frequency Signal Line Filters
Filters typically consist of reactive elements, for loss
reduction
Discrete Filters Discrete Filters Symmetrical Filters Symmetrical Filters
Shunt Capacitor p (Pi)-Filter
Series Inductor T-Filter
A A- -Symmetrical Filters Symmetrical Filters
L-Filter
IL dB Log k
i
i
i
[ ] [ ( ) ] = +
=
10 1
1
2
f
f
0
Page
115
Passive EMI Filters
Shunt Capacitor
0
10
20
30
40
50
0.0001 0.001 0.01 0.1 1 10
Frequency [MHz]
I
n
s
e
r
t
i
o
n

L
o
s
s

[
d
B
]
Insertion Loss Curve
Z
S
=Z
L
=50, C=0.1uF
( )
20 log ;
1 << ,
S L
S L
S L
Z Z
IL f C dB
Z Z
C Z Z

+

A current divider!!!
Page
116
Passive EMI Filters
Series Inductor
( )
20 log ;
>> ,
S L
S L
L
IL f dB
Z Z
L Z Z

+

0
10
20
30
40
0.0001 0.001 0.01 0.1 1 10
Frequency [MHz]
I
n
s
e
r
t
i
o
n

L
o
s
s

[
d
B
]
Z
S
=Z
L
=50, L=100H
A voltage divider!!!
Page
117
Passive EMI Filters
Symmetrical Filters: -Filter
p
( )
2 2 4 6
1
3
0
2 2
3
10 log 1 2 ;
1 1 2
; ; ;
2 2
IL f f D f D f dB
d L
D d damping factor f Hz
CR RLC
d

+ +

| |
= = =
|
\
0
10
20
30
40
50
60
70
0.1 1 10 100
Frequency [MHz]
I
n
s
e
r
t
i
o
n

L
o
s
s

[
d
B
]
Z
S
=Z
L
=50, C=0.5nF, L=2H
Both current & Voltage
divider!!!
Page
118
Passive EMI Filters
Symmetrical Filters: T-Filter
T
( )
2 2 4 6
1
2
3
0
2
3
10 log 1 2 ;
1 1 2
; ; ;
2 2
IL f f D f D f dB
d CR R
L L C
d

+ +

| |
= = =
|
\
0
10
20
30
40
50
60
70
80
0.01 0.1 1 10
Frequency [MHz]
I
n
s
e
r
t
i
o
n

L
o
s
s

[
d
B
]
Z
S
=Z
L
=50, C=100nF, L=2H
Ditto!!!
Page
119
Passive EMI Filters
A-Symmetrical Filters: L-Filter
L
L
0
10
20
30
40
50
0.01 0.1 1 10
Frequency [MHz]
I
n
s
e
r
t
i
o
n

L
o
s
s

[
d
B
]
( )
2

20 log ;
S L
L
Z Z
L
IL f LC dB
Z

+

<<
( )
2

20 log ;
L S
S
Z Z
L
IL f LC dB
Z

+

<<
Z
S
=5, Z
L
=50 ,C=3nF, L=10H
Z
L
=5, Z
S
=50 ,C=3nF, L=10H
( )
2 2
4
1
2
0
2
10 log 1 ;
2
1 1 2
; ; ;
2
f D
IL f f dB
d L
CR LC
d

+ +

| |
= = =
|
\
Ditto!!!
Page
120
Common- & Differential-Mode Filtering
Z
S
Z
L
e(t)
Z
S
Z
L
e(t)
Z
S
Z
L
e(t)
Z
S
Z
L
e(t)
Differential-Mode
Topology
Common-Mode
Topology
p-Filter
T-Filter
Page
121
Common-Mode Filtering
Common Mode Chokes
Circuit #1 Circuit #2
CM Current
CM Current
DM
Current
Common Mode Chokes:...
Provide high CM losses, compensating for smaller capacitors
Affect CM signals only with virtually no effect on DM signals
Have high-m (m =2,500- 10,000) cores (high inductance, e.g., 1- 2mHy), without
saturation
(Almost) zero inductance for power line (net) current
CM
Current
Signal DM
Current
Core
Hi u
CM-Generated
Flux
DM-Generated
Flux
Page
122
Power Line Filters
Power line filters are intended to suppress EMI emissions and EMI
interference, coupling via power lines
Power line filters contain:
Common and Differential mode filters
Often - a series inductor on the Protective earth line to eliminate chassis
noise emissions
Z
P.E.
must be < 0.1 @ f
PWR
(safety)
Select the filter according to required
suppression, current and voltage
rating, safety criteria and space
available
Available for:
DC power
AC 1-phase power
AC 3-phase power
Page
123
Ferrite Beads
Losses in inductors is a disadvantage
Power dissipation at in-band frequencies
Reduction of filters Q
In Ferrite-based filters, these parameters are an...
advantage
Also...
Ferrites are a simple, easy to implement and cost-effective high frequency filtering
solution
Ferrites are inert ceramics containing granulated iron compounds
Ferrites are free of organic matter and are not degraded by most environments
Page
124
At low frequencies, the inductor shorts out the resistor
At high frequencies, the inductor represents a high
impedance, thus EMI flows through the resistance, R
and is dissipated as heat
Symbol
Equivalent Circuit
R
L
Ferrite Beads
A dB Log
Z Z Z
Z Z
S SB L
S L
[ ] =
+ +
+
20
Page
125
Application of Ferrite Beads
Ferrites are easily installed on cables (snap-
on) which makes them ideal for
troubleshooting and EMC fixing
V
DM
V
CM
e
S
Z
S
Z
L
V
DM
V
CM
e
S
Z
S
Z
L
Differential-Mode Suppression
Common-Mode Suppression
Page
126
L: Lead Inductance
R: Lead to Foil Contact Resistance
R
1
: Resistance of Metalized Foil
C: Capacitance
L
1
: Foil Inductance
R
S
: Shunt Resistance
Effect of Capacitors Lead Inductance
E
S
Z
S
=50
1V Z
L
=50 V
L
L=2uH R
L
=1m
R
C
=3m
C=0.5nF
-Section Low Pass Filter
Poor Bond Impedance, Z
B
}
Z
B
L
B
=0.5nH
R
B
=1m
Intended Path Unintended
Path
1 2
0
10
20
30
40
50
60
70
80
90
0.01 0.1 1 10 100 1000
Frequency [MHz]
I
n
s
e
r
t
i
o
n

L
o
s
s

[
d
B
]
Effect of bad
filter grounding on
Insertion Loss
Page
127
Effective Filtering - How ?
Standard capacitors suffer from disadvantages for EMC
(high frequency) applications
Series inductance of the capacitors leads
Parallel capacitance between the runs of an inductor
The Rabbit out of the hat...:
Feedthrough Filters
Page
128
Feed-Through Filters
Feedthrough Feedthrough devices devices
are also available in are also available in
filter configurations, filter configurations,
e.g., L, T, e.g., L, T,
Page
129
Transient Suppression Devices
The Transient Phenomena
Transients are special phenomena of EMI
Very high levels (kVolts, kAmps)
Very short durations (nSecs to u uu uSecs)
Very short rise times (nSecs to u uu uSecs)
Transients may damage the equipment!
Page
130
Max V (Into Large Z) Max I (Into Small Z)
ESD 15 kV + 10's to 100's of Amp's
EFT kV's 10's of Amp's
Surge kV's kAmp's
These levels are slightly higher than, say, TTL levels...
Duration:
pSec
nSec
mSec
(10s - 100s)
(1 - 10s)
(0.1 - 10)
Surge
(10s - 100s) mSec
EFT
(10s) nSec
ESD
(10s - 100s) nSec
1/Risetimes
J
mJ
(10s - 100s)
(10s - 100s)
(1 - 10s)
ESD EFT Surge
mJ
Energy
Content [J]
Large Vs
in cks
Fields from
Switch Arcs
to 4 kV/m
15 A/m, @ 10 cm
Characterization of Transients
Page
131
Typically, Open Circuit Output Voltage Open Circuit Output Voltage from the generator, and
sometimes the impedance, are specified
Thevenine-Norton conversion cannot be used, due to the non-linear
characteristics of the loads/protection devices (e.g., spark-gaps,
avalanche- diodes, MOVs, etc.), which typically clamp to a constant
voltage, independent of current
Therefore, Short Circuit Output Current Short Circuit Output Current of the generator should also
be specified
Transients and EOS Waveform
Characteristics: Current vs. Voltage
Open Circuit Voltage (V
OC
)
Z
Source
+
V
-
V
Open Circuit
Short Circuit Current (I
SC
)
Z
Source
I
I
Short Circuit
Page
132
Transient Waveform Characteristics
a/b mSec Notation
Sec Front Time (t
f
)
Sec Time to Half Value (t
d
)
t t t
front
1 25
2 1
. ( )
t t t
rise

3 0
0
100
200
300
400
500
600
700
800
900
1000
0.00 10.00 20.00 30.00 40.00 50.00
Time [uSec]
V
a
l
u
e

[
V
/
A
]
90%
10
% t
1
=t
10%
t
2
=t
90%
50%
50%-
Time to
Half Value
- t
d
8/20 Sec per IEC-61000-4-5
1.2/50 Sec per IEC-61000-4-5
Examples
Page
133
0
100
200
300
400
500
600
700
800
900
1000
0.00 10.00 20.00 30.00 40.00 50.00
Time [uSec]
S
.
C
.

C
u
r
r
e
n
t

[
A
]
Standard Transient Waveforms
8/20 Sec Unidirectional Current Surge
Front Time T Sec
Time to Ha Sec
f r
: T
lf Value
= =
=
125 8 20%
20 20%
. u
u
An approximate expression
t=3.911 mSec
A=0.01243 (mSec)-3
I
P
=Peak Current (from standard)
I t A I t e
p
t
( )

3

Page
134
Blocking Blocking the current surge current surge by a series high series high- -impedance impedance
device device
Series resistors & inductors
Limiting Limiting t the voltage surge voltage surge by a non non- -linear protection device linear protection device
Varistors
Avalanche Diodes (Tranzorbs
TM
)
Diverting Diverting the surge current surge current by a shunt low shunt low- -impedance impedance
device device
Spark Gaps
Or
Or
Transient Protection Principles
Page
135
Transient Protection Principles
Page
136
Stand-Off Voltage (V
R
) Highest reverse voltage at which the Device will be
non-conducting.
Should be greater than circuits max. operating voltage
Min. Breakdown Voltage (BV
MIN
) Reverse voltage at which the Device conducts 1mA.
This is the point where the Device becomes a low
impedance path for the transient.
Should be lower than circuits min. vulnerability level
Max. Clamping Voltage (V
C MAX
) Maximum voltage drop across the Device while it is
subject to the Peak Pulse Current, usually for 1mSec
Determines Devices voltage overshoot
Should be lower than circuits min. vulnerability level
Primary Parameters of Non-Linear TSDs
Page
137
Peak Pulse Current (I
P
) Maximum allowable pulse current which does not
modify performance parameters of the device by
more than 10%
Device should be able to handle the Peak Pulse Current
Peak Pulse Power (P
P
) Clamping Voltage Peak Pulse Current
Device should be able to handle the Peak Pulse Power
Shunt Resistance(R
S
) Resistance of the Device while not conducting.
In most Devices, excluding Varistors, R
S
10
10
Should be as high as possible

Shunt Capacitance (C
S
) Capacitance between the electrodes of the Device
@ 1 kHz
Determines bandwidth of the Device, and
maximum usable frequency
Should be as low as possible
Primary Parameters of Non-Linear TSDs
Page
138
Spark Gap/Gas Tube Devices
Active, non-linear device, constructed of 2-3
electrodes typically encased in a ceramic case
filled by an inert gas (Ar, Ne)
Or
Three-Electrode
Spark Gaps
Two-Electrode
Spark Gaps
Or
Page
139
Spark Gap/Gas Tube Devices
Breakdown Voltage
DC Sparkover Voltage
dV
dt
V Sec 100 /
Impulse Sparkover
Voltage
dV
dt
kV Sec 1 / u
Page
140
Primary advantages
Low voltage when conducting
Can conduct high currents (5 to 20 kAmp
for 10mSec)
Low shunt capacitance (< 2 pF)
Negligible leakage current during normal
operation
Primary disadvantages
Relatively slow response
Ignition (conduction) voltage varies
Follow current during discharge
May not extinguish in DC power circuits
Spark Gap Devices
Page
141
Metal Oxide Varistor (MOV)
Passive, non-linear device, acting
as a non-linear resistor:
V=I R(I or V)
I K V =

Non-linearity Factor
Geometry Constant of the Device
Varistor: >> (25 - 60)
Resistor: = 1
Page
142
Line to Line
& Line to Ground
Applications
Primary advantages
Relatively fast response
High energy absorption
Can conduct wide range of currents (up to 20 kAmp)
Wide selection
Large parasitic capacitance (1 to 10 nF)
Limits signals bandwidth to 1 MHz
small leakage current during normal operation
Degrade when exposed to current surges
Page
143
Primary consideration: Energy dissipation in the device
Energy in the surge:
Selection of Device
5S 50S
50A
100A
t
I
E K V I J
C P
= = =
0 5 500 100 5 10 0 13
6
. .
E K V I J
C P
= = =
1 4 500 100 50 5 10 3 15
6
. ( ) .
Total Energy
3.28J
E K V I
C P
=
Clamping
Voltage
Peak Current
k=0.637
I
P
t
k=0.5
k=1.4
k=1.0
I
P
/ 2
Page
144
Avalanche/TVS Diodes
Or
Passive, silicone diode,
with high doping
Capable of very low
clamping levels
min
dV
dI
Avalanche Diodes are especially fit
for board level protection
Available in a 3V to 400V range, so
they can protect semiconductors or
other sensitive components
Page
145
Primary advantages
Relatively fast response (1 pSec)
Unidirectional or bidirectional devices
Wide range of reverse standoff voltage (5.5
V to 700 V+ )
Wide maximum clamping voltage ranges(7 V
to 500 V)
Capable of handling surge currents levels of
0.6 to 0.9 kA
Large shunt capacitance (50 to 1000 pF)
Limits signals bandwidth
Handles relatively small transient currents
(< 500 A)
Avalanche Diodes/TVS Diodes
Page
146
Such devices are
Such devices are
commercially available
commercially available
Avalanche Diodes/TVS Diodes Avalanche Diodes/TVS Diodes Avalanche Diodes/TVS Diodes Avalanche Diodes/TVS Diodes
Reduction of Reduction of Reduction of Reduction of Diode Diode Diode Diode s Capacitance s Capacitance s Capacitance s Capacitance
Page
147
Composite TVS Circuits
Often, discrete devices cannot provide acceptable
protection
One protection stage is insufficient
Surge level differs significantly from circuit signal level
In those cases, composite circuits may be used
Series
Control
Element
Filter
Network
High Energy
Dissipator
Series
Control
Element
Series
Control
Element
Filter
Network
Low Energy
Dissipator
Hazard
Input
Protected
Equipment
Page
148
The spark gap will divert most of the surge current,
after its ignition after its ignition
The fast suppression devices will respond
immediately to the fast front time of the transient
The series element will limit the incident surge
current and ensure the ignition of the spark gap
Composite TVS Circuits
Page
149
Installation of Filters and Transient
Protection Devices
The installation of filters has utmost importance for ensuring their
performance
Filters & TSDs must be installed with maximum separation between
input to output leads, preferably - in a Feedthrough manner
Input to output coupling may dissolve the filters suppression effectiveness
IRON RULE IRON RULE
SEPARATE PROTECTED AND NON SEPARATE PROTECTED AND NON- -PROTECTED LINES PROTECTED LINES
Page
150
Filter/TSD Connectors
"RF Dirty Area"
"Clean" Input
Noise
sources
When multiple lines must be filtered, a filter connector
offers a cost effective, compact and efficient solution
Filter connectors are available both as plugs and
receptacles
Page
151
Installation of Filters and Transient
Protection Devices
Effects of Non-Ideal Properties of Y
Capacitors
Adverse Effect of Lead Inductance on
Protection Level Provided by a MOV TSD
0
10
20
30
40
50
60
70
80
90
0.01 0.1 1 10 100 1000
Frequency [MHz]
I
n
s
e
r
t
i
o
n

L
o
s
s

[
d
B
]
Page
152
Installation of TSDs
Inadvertent Transformer Effect
The spark gap fires and generates a fast transient
current in the loop A-B-C-D
This current will induce a magnetic field into the loop E-
F-G-H which will induce a voltage source in that loop
This is a parasitic transformer which should be avoided
V
d
dt
dB
dt
ds
EFGH
= =

S
Page
153
Module 7
Summary and Wrap-Up
Page
154
Just tell me what rules I need to
follow to ensure that I dont have
EMC-related problems.
Just tell me what rules I need to
follow to ensure that I dont have
health-related problems with my
brain surgery.
Courtesy: Prof. T. Hubing
University of Missouri-Rolla
What are the Most Important EMC Design
Guidelines?
Page
155
Thank you for your
attention!!!
Summary and Wrap-Up

Essentials of Equipment Design For Electromagnetic Compatibility (EMC) Compliance - 2010

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Essentials of Equipment Design for EMC Compliance

Path of Least Impedance Principle

Should be as high as possible

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