D a t a S h e e t , V 1.

1 , M ay 2 00 8

SMM310
S i l i c on M E M S M i c r op h o n e

S m a l l S i g n a l D i s c r et e s

Edition 2008-05-28 Published by Infineon Technologies AG 81726 Mnchen, Germany Infineon Technologies AG 2008. All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics (Beschaffenheitsgarantie). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.

SMM310

SMM310 Revision History: 2008-05-28, V1.1 Previous Version: 2007-08-31, V1.0 Page 4 9 11 Subjects (major changes since last revision) Halogen-free package Typical measurement of output impedance added Marking layout example removed

Data Sheet

V1.1, 2008-05-28

SMM310
Silicon MEMS Microphone

Silicon MEMS Microphone

Features SMD MEMS microphone for automated surface mount assembly Reflow soldering up to 260 C (lead free) High long-term temperature stability Stable sensitivity over power supply range of 1.5 - 3.3 V Low current consumption of 80 A Excellent power supply rejection of -55 dB High integrated immunity to EMI RoHS-compliant, halogen-free package with small footprint and low height of 1.25 mm

Applications The SMM310 is designed for Mobile Phones (Handsets, Headsets) Consumer (Game Consoles, PDAs) Computer (Personal Computers, Notebooks) Cameras (Digital Still Cameras, Video Cameras)

Product Description Miniature Silicon MEMS (Micro Electro Mechanical System) omni-directional Microphone with single-ended analog interface designed for automated reflow soldering assembly as SMD (Surface Mounted Device) component. It is an alternative to conventional ECMs (Electret Condenser Microphones). Due to its robust design with a metallic lid and monolithic integrated EMI-blocking capacitors and utilization of Silicon MEMS technology, the SMM310 shows high immunity to EMI (Electromagnetic Interference) and heat. The capped Chip-On-Board package solution contains the micromechanical sensor chip and an amplifier chip. The RoHS-compliant halogen-free device has a size of 4.72 x 3.76 x 1.25 mm3.

VDD (4)

OUT (1)

GND (2,3)

Figure 1 Type SMM310

Block Diagram Package HG-MMA-4-2 Marking S310

Data Sheet

V1.1, 2008-05-28

SMM310
Silicon MEMS Microphone Pin Definition and Function Table 1 Pin No. 1 2 3 4 Maximum Ratings Table 2 Maximum Ratings Pin Definition and Function Symbol Function Output Ground Ground Power

OUT GND GND VDD

Storage Temperature Operating Temperature Range Operating Voltage Range ESD robustness Table 3

TSTG TA VDD

-40 C - 125 C -40 C - 85 C 1.5 V - 3.3 V

Typical robustness to electrostatic discharge

ESD capability all pins (HBM, JESD22-A114) ESD capability all pins (MM, JESD22-A115) Acoustical and Electrical Characteristics Table 4 Parameter Sensitivity 1 kHz Relative Sensitivity 4 kHz Relative Sensitivity 240 Hz Equivalent Noise Level Signal-to-Noise Ratio Total Harmonic Distortion Current Consumption

VESD_HBM VESD_MM

4 kV 400 V

Unless otherwise noted, typical test conditions are TA = 23 C, VDD = 2.1 V and R.H. = 50 % measured in a pressure chamber test setup. All voltages refer to GND node Symbol Min. Values Typ. -42 Max. -39 +4 +1 29.5 35 61.5 64.5 59 0.1 80 -55 1.2 7 0.5 140 -40 32.5 dB(V/Pa) dB dB dB(pso) dB(A) dB(pso) dB(A) % A dBr V 1 kHz, 94 dB SPL Relative to sensitivity 1 kHz Relative to sensitivity 1 kHz CCITT-weighted1) A-weighted2) CCITT-weighted A-weighted 104 dB SPL, 1 kHz -45 -1 -1 Unit Note / Test Condition

S1kHz S4kHz S240Hz ENL SNR

THD ICC Power Supply Rejection Ratio PSRR

DC Output Voltage Output Impedance

VDD = 2.1 V
100 mV superimposed on VDD = 2.1 V, 1 kHz DC Voltage at Pin 1 1 kHz

VOUT ZOUT

1) Psophometrically weighted noise measurement with CCITT-filter (ITU-T Rec. P.53) 2) Noise measurement with A-weighting filter (IEC 651)

Data Sheet

V1.1, 2008-05-28

SMM310
Silicon MEMS Microphone Typical Measurements Results

10 8
Sensitivity relative to 1kHz [dB]

6 4 2 0 -2 -4 -6 -8 -10 100 1000 10000 -1 +1 -1 +4

Frequency [Hz]

Figure 2

Typical frequency response curve relative to the sensitivity at a frequency of 1 kHz

5 4

Sensitivity relative to TA=23 C

4 3 2 1

Equivalent Noise Level relative to T A=23 C [dB]

-40 -20 0 20 40 60 80 100

3 2 1 0 -1 -2 -3 -4 -5 -40 -20 0 20 40 60 80 100

[dB]

0 -1 -2 -3 -4 -5

Temperature / C

Temperature / C

Figure 3

Typical change of sensitivity at 1 kHz and equivalent noise level over temperature relative to

TA = 23 C

Data Sheet

V1.1, 2008-05-28

SMM310
Silicon MEMS Microphone

-39 -40 -41 -42 -43 -44 -45 1.4 1.7 2 2.3 2.6 2.9 3.2
Equivalent Noise

32.5 31.5

90 85
DC Output Voltage

1.5 1.4 1.3 1.2 1 0.9 0.8

Current Consumption

ENL [dB(pso)]

S [dBV/Pa]

30.5 29.5 28.5 27.5 26.5

80

75 70 65 60 1.4 1.7 2 2.3 2.6 2.9 3.2 3.5

Sensitivity

0.7 0.6 0.5

VDD [V]
Figure 4

VDD [V]

Typical measurement of sensitivity, equivalent noise level, current consumption and DC output voltage over power supply VDD

2 1.8 1.6 1.4 THD [%] 1.2 1 0.8 0.6 0.4 0.2 0 90 100 110 Sound Pressure [dB SPL]
Figure 5 Typical total harmonic distortion over sound pressure level (1 kHz, VDD = 2.1 V)

120

130

Data Sheet

V1.1, 2008-05-28

Vout [V]

ICC [A]

1.1

SMM310
Silicon MEMS Microphone

1000

Noise densitiy (nV/Hz )

A-weighted

0.5

100

CCITT-weighted

10

1 100

1000

10000

Frequency [Hz]
Figure 6 Typical noise density measurement with A-weighting and CCITT-weighting filter

-30 -35 -40 -45 -50 -55 -60 -65 -70 10 100 1000 10000 100000

PSRR [dBr]

Frequency [Hz]

Figure 7

Typical power supply rejection ratio (relative to 100 mV sinewave superimposed on the supply voltage VDD)

Data Sheet

V1.1, 2008-05-28

SMM310
Silicon MEMS Microphone

-10

Demodulated RF-signal relative to acoustical sensitivity [dB]

-20 -30 -40 -50 -60 -70 -80 100

WCDMA GSM850/900 GSM1800/1900

300

500

700

900

1100 1300 1500 1700 1900 2100 2300 2500

Frequency of RF disturbance [MHz]

Figure 8 Typical RF demodulation relative to the microphone signal (1 kHz, 1 Pa). RF disturbance (100 MHz - 2.5 GHz, 80%-AM-modulated with 1 kHz) is directly injected in the power supply

100 90

Output Impedance [Ohm]

80 70 60 50 40 30 20 10 0 10 100 1000 10000 100000

Frequency [Hz]
Figure 9 Typical output impedance measurement (VDD = 2.1 V)

Data Sheet

V1.1, 2008-05-28

SMM310
Silicon MEMS Microphone Package Outline
1.25 0.1
0.1 4x 0.84 0.1
4 3

3.76 0.1

1) 1

1.32 0.2 4.72 0.1

0.15 TYP.

0.15 TYP. (2.97)

1.45 TYP.

1) Area for acoustic seal diam. 1.64 mm typ.

GHG01248

Figure 10 Table 5 Item Height Length Width

Package outline Dimensions Dimension (mm) 1.25 4.72 3.76 0.84 Tolerance (mm) 0.1 0.1 0.1 0.1

Sound Port Diameter

Recommended Customer Land Pattern

1.45

1.24

2.22

2.97 4.42
HLGF1250

Figure 11

Recommended customer land pattern

Data Sheet

10

3.45

1.24 TYP. (2.22)

1.88 0.2

V1.1, 2008-05-28

SMM310
Silicon MEMS Microphone Solder Reflow Table 6 Solder Reflow Conditions Compliant to J-STD-020-C 260 C 3 times reflow soldering Board washing can damage the microphone if the sound inlet hole is uncovered MSL 2 classified

Solder Reflow Profile Maximum Peak Temperature Number of Reflow Board washing after Reflow Moisture Sensitivity Level Recommended Vacuum Handling

0.5 mm MIN

Figure 12

Recommended minimum distance between sound port hole and vacuum pick tool opening is 0.50 mm

Data Sheet

11

V1.1, 2008-05-28

SMM310
Silicon MEMS Microphone Tape Outline

Figure 13 Table 7 W 120.3 E2 10.25 MIN

Tape Outline, 1) Cumulative tolerance of 10 sprocket holes is 0.2 mm Tape Dimensions (mm) P0 40.1 F 5.50.05 P1 80.1 D1 1.5 MIN P2 20.05 T 0.30.05 D0 1.50.1 T1 0.050.015 A0 4.10.1 T2 2.10.2 B0 50.1 G 1.95 NOM E1 1.750.1 K0 1.750.1

Data Sheet

12

V1.1, 2008-05-28

SMM310
Silicon MEMS Microphone Reel Outline

Figure 14 Table 8 A 330 Reel Dimension (mm) and Quantity per Reel W1 12.41.5 W2 18.4 MAX N 100 Quantity per Reel 4000

Data Sheet

13

V1.1, 2008-05-28