Cng ngh vi in t T phin silicon n chp thnh phm (Phn I)

Nm 2006, Intel quyt nh u t 1 t la M vo Vit Nam xy dng nh my ng gi v kim tra cht lng chp ti Khu Cng ngh cao Si gn (www.shtpvn.org) sau Cng ty ny quyt nh nng s vn u t ln 2 t la M, v nh my ca Intel chnh thc c khi cng ngy 28/3/2007. Tp on Hng Hi (Hon Hai Precision Industry Co., Ltd.), tn thng mi l Foxconn rt s vn ln n 5 t vo hai tnh Bc Ninh v Bc Giang v cng ngh vi in t th s quan tm ca x hi Vit nam dnh cho ngnh cng ngh ny cng tr nn si ng hn bao gi ht, iu ny cng cho thy c s dch chuyn v th trng lao ng ti Vit Nam t gia cng, gin n n lao ng i hi cht xm v s u t bi bn. Lot bi vit ny s dnh m t cho c gi c ci nhn r rng hn v ngnh cng ngh ny. phn u tin chng ti s gii thiu s lc v cng ngh vi in t c tin hnh trong phng sch (clean room). T nhng cui nhng nm 1960 cc mch in t c ci thin mt cch r rt c v hiu nng, v chc nng v n nh khi tch hp cc vi bng bn dn trn mt chp. iu ny m bo cho vic h gi thnh sn phm, tng cng sut sn xut. V cng chnh l kt qu ca cuc cch mng thng thng tin. T ti nay mt t hp ca bng bn dn tng ln nhanh chng c bit vi s h tr ca ca cng ngh chn khng, c kh chnh xc, quang hc, ngnh cng ngh vi in t vn l ngnh cng ngh lm thay i th gii. Tm silicon - vt liu ban u dng trong ngnh cng ngh vi in t l cc phin silicon (silicon wafer) c b dy c 400 micro-mt vi ng knh khc nhau (tm silicon c ng knh ln nht m ngi ta c th ch to l 12 inch, ngha l tng ng mt chic piza ln). Tm silicon c ng knh cng ln th cng kh ch to, thit b dnh cho cng ngh tm ln cng tn km nhng s linh kin thu c trn mt tm li c nng cao. Phng sch - Mi qu trnh cng ngh ch to mch t hp c tin hnh trong phng sch. l ni con ngi cn phi x l cc thng s mi trng nh nhit , m v lu thng kh sao cho s ht bi c trong mt n v th tch l nh hn rt nhiu so vi mi trng bnh thng. sch ca phng sch khi c ch to phi tun th nhng tiu chun ISO khc nhau (t ISO 1 n ISO 9 trong ISO 1 c sch cao nht tng ng vi 10 ht bi kch thc nh hn 0.1 micron trong mt pht khi) sch cng ln th chi ph vn hnh cng tn km. c gi c th tham kho nhng phng sch loi ny ti Intel Coporation hoc AMD. X l b mt - l viic u tin ngi lm cng ngh cn thc hin trong phng

sch. Cng on lm sch b mt phin (silicon) thng c thc hin nh cc axit mnh, cc cht c tnh xi ho nh HNO3, H2SO4 H2O2 v HF. Vic x l b mt s gip chng ta loi b nhng tp v c, hu c hoc sai hng trn b mt tm silicon trc khi chuyn n vo nhng bc cng ngh tip theo. xi ho ~ 4, c tc dng bo v b mt cc linh kin bn dn di tc dng ca mi trng bn ngoi, che chn b mt Si trong qu trnh khuch tn nh x cc tp cht nh P v B. Ngoi ra lp SiO2 cn c s dng lm cc (gate) ca cho bng bn dn (transistor). C nhiu phng php to ra lp SiO2 nhng phng php c s dng rng ri nht nhn lp SiO2 l phng php xy ho nhit cao (khong 10000C -11000C).- trong qu trnh ch to mch tch hp ngi ta thng phi dng lp SiO2 trn b mt tinh th Si.. Lp SiO2 ny c h s dn n nhit gn bng h s gin n nhit ca Si, vi hng s in mi Khuch tn - l k thut c s dng trong cng ngh bn dn to cc vng chuyn tip ca transitor. C nhiu phng php khuch tn tp to vng chuyn tip P-N khc nhau nh phng php khuch tn nhit cao, phng php cy ion... Tu thuc vo silicon v mc ch ca vic pha tp ngi lm cng ngh s phi dng hai loi tp ph bin nht l Boron (B) hoc phtpho (P) cho qu trnh ny. Quang khc (photolithography) - l tp hp cc qu trnh quang ho nhm to ra cc chi tit trn b mt phin silicon c kch thc v hnh dng ging nh thit k. lm c iu ny cn phi c nhng b mt n (mask), cht cm quang (photoresist) ngun sng UV v dung dch hin hnh (developer). Mt n thng l mt tm thu tinh hu c c ph mt mng crm trn khc ho nhng chi tit ph hp vi thit k ca cm bin hoc mch tch hp (IC). Ngi ta ph ln trn b mt phin silicon c tnh cht nhy sng c bit gi l cht cn quang (photoresist) thng c gi l cht cm quang. Cht cm quang phi bo m hai tnh cht: - Nhy quang; Bn vng trong cc dung mi axt hoc kim. Cht cm quang c nhim v l lp bo v c hnh dng cn thit cho b mt khi b tc dng ca cc dung mi ho hc. Ngi ta phn loi cm quang thnh cm quang dng v cm quang m da vo c ch phn ng xy ra trong cm quang khi b chiu sng v s thay i tnh cht trong qu trnh chiu sng. Cm quang m khi b chiu sng tr nn khng b ho tan trong cc dung mi tng ng. Cn cc cm quang dng th ngc li, khi b chiu sng s ho tan trong cc dung mi.

Dung dch hin Developer cho php hin hnh nhng chi tit to ra trn lp cm quang do tc dng ca ngun UV. Qu trnh ny ging nh qu trnh ra nh trong k thut nhip nh. mt n u tin qu trnh quang khc c thc hin kh n gin: t phin silicon ln g, thit lp cc iu kin cn thit nh chn khng, kh nn, ch tip xc, cng sut UV, thi gian chiu sng v chiu sng. Tuy vy ch to mt mch t hp ngi ta phi dng ti nhiu b mt n khc nhau. cc chi tit trn mt n, trn phin silicon ca ln ch to trc (vi mt mt khc trong c b) trng kht ln nhng chi tit ca mt n hin ti ngi ta phi dng mt k thut gi l k thut ng chnh (so mask hay mask aligner). K thut ny c thc hin thng qua nhng du hiu gi l du so (mask marks) vi s tr gip quang hc (knh hin vi, CCD camra) v h vi chnh c kh theo cc chiu X,Y v chnh mo. Thng qua nhng du so c bit ny ngi ta c th chc chn c rng mi chi tit trn phin silicon nhn c t cc mt n khc nhau l trng kht ln nhau. Trong qu trnh ch to photoit chng ta s s dng mt b 03 mt n. Hin nay mt bng bn dn trn mt chp ngy mt tng nn ngoi k thut quang khc cn nhiu k thut khc cho php khc ln trn lp cm quang nhng chi tit vi phn gii v mc tinh vi tt hn rt nhiu nh k thut e-beam lithography (k thut khc dng chm in t), hoc tia X. n mn - trong cng ngh vi in t trn c s silicon l mt k thut rt hay c s dng. C hai phng php n mn chnh l : n mn t v n mn kh. n mn t - y l k thut thng dng nht trong cng ngh bn dn. Ngay t cng on phin va mi c ca ra khi thi silion t nh my sn xut phin, cc ha cht c s dng mi nghin v nh bng cui cng chng ta thu c mt tm silicon phng v nhn. i vi nhng thit b n l hoc mch tch hp c kch thc ln (> 3 m), ho cht n mn c s dng khc nhng ho tit v m ca s trn lp vt liu in mi. n mn kh - trong k thut n mn kh, tm silicon c a vo trong bung

chn khng, sau hn hp kh dng cho n mn c a vo trong bung phn ng. chn khng thch hp, di tc dng ca ngun cao tn, kh n mn b ion ho v chng ta thu c hn hp plasma ca kh ni trn bao gm cc ion F+ do SiO2 hoc Si b n mn v to ra cc sn phm phn ng tng ng. Nh k thut ny m chng ta c th mang li k thut n mn vt liu vi h s t l d/w (su/cao) rt ln. Tu theo dy v vt liu m ngi ta chn cc ch n mn khc nhau. Vi k thut ny cc hng sn xut ln c th phn on thit b dnh ring cho qu trnh n mn nng vi mt vi micromet chiu su cho ti thit b c th n mn qua tm silicon (c 400 micr-mt) ch trong hai gi. Thng tin thm v l thuyt hoc k thut n mn kh c th tm thy tiwww.stsystems.com v www.adixen.com l hai nh sn xut thit b n mn kh ni ting nht hin nay. K thut mng mng ch yu to nhng lp vt liu c b dy nh mong mun ln trn mt lp vt liu khc. y l qu trnh i hi kh nhiu kin thc b xung nh k thut chn khng, cu trc vt liuCc k thut c bn to mng mng y gm hai phng php vt l v ho hc. Phng php vt l bao gm: phn x (sputtering), bc bay nhit (evaporation), phng php phun tnh in. Trong khi phng php ho hc c: lng ng ho hc pha hi (CVD), lng ng ho hc pha hi p sut thp (LPCVD), v Sol-gel. o c v kho st thng s cng ngh - y l giai on sau khi phin silicon i qua cc bc cng ngh trong phng sch. khu ny ngi k s cn xc nh cc c tuyn I-V, C-V hoc in tr (R), dng d, ch lm vic.ca linh kin. Lc ny, cc chp vn nm trn phin. c th tin hnh cc bc tip sau, ngi k s phi ct ri cc chp trn tm silicon, v giai on ny chp cn c gi l die. Nh vy, chng ta i qua mt s bc c bn nht ca qu trnh ch to chp trong phng sch. phn sau chng ti s trnh by khu ng v, mt trong nhng cng on quan trng trong c quy trnh ch to chp bn dn. Mai Ty Phong

Sch 1. W. Whyte, "Cleanroom Design" Second Edition, John Wiley, 1999 2. P. R. Gray and R, G, Meyer, "Analysis and design of analog integrated circuit", John Wiley, New York, 1984.

3. S. M. Sze, "Physics of Semiconductor Device", Wiley, New York, 1981. 4. S. M. Sze, "Semiconductor devices, physics and technology", Wiley, New York, 1985. 5. "Semiconductor Devices", University Twente, 1998. Trang thng tin www.intel.com www.chips.ibm.com www.stsystems.com www.adixen.com Cng ngh vi in t - K thut hn dy v hn chp (Phn II)

Nh ni phn trc, IC sau khi c ch to nm trn tm silion, c ct ra v gn ln trn cc thnh phn mch tch hp. Lc ny mi chp n c gi l DIE (tm gi l chp trn). Trong nh l mt chp trn ca mt cu trc MOS (Metal-OxideSemiconductor), mt cu trc transistor rt ph bin trong ch to vi mch in t, (ngun www.vlsi.uwaterloo.ca) cc chn chp bng Au hoc Al mu sng pha ngoi. R rng nhng thit k rt nh vi mi chiu khong 1 mm n vi trm micrmt, vic ni dy cho cc chp ny ly tn hiu ra l iu khng d dng cht no. hiu thm v phn ny chng ti xin trnh by mt cht hiu bit ca mnh bn c chia s. Cng ngh thay i hng thng, hng tun thm ch hng ngy, m t ton b qu trnh ng v trong mt vi trang giy l iu khng th. bi ny chng ti ch mn php c a ra nhng thng tin n gin nht trong qu trnh ng v chp l hn chp v hn dy. c th ni dy, cp ngun cho chp hot ng (ngha l c chp thnh phm) chng ta phi i qua cc cng on: 1. Hn chp trn (die attach); 2. Hn dy (wire bonding); 3. Kim tra cht lng ca mi hn (pull test). Nh vy c th hiu y l ba bc c bn chng ta c th "giao tip c vi chip mt cch d dng".

Hn chp trn (Die attach) Chp trn, sau khi ct ri khi tm silicon, c xp vo trong cc khay v sau c hn trn cc khung ch to sn (leadframe-nh bn l Leadframe ca Alcatel Microelectronics) m thng qua chng ta c th tho lp chp trn cc mch in t mt cch d dng . cng on ny mi nh sn xut s la chn

cho mnh nhng dy truyn cng ngh ph hp vi cng sut sn xut cng nh kh nng kinh t. Tr nhng nh ch to ln, phn ln cc cng ty nh v va thng la chn cc thit b hn die nhn cng (manual) hoc bn t ng. cng on ny, chp trn c gp bng bt chn khng hoc kp chn khng (nh). K thut ny cho php gi chp mt cch chc chn ng thi khng lm tn hi n b mt chp.

mt s thit b (nh ca hng WESTBOND), k s ch to my tch hp thm mt ng c vo u gp chn khng, cho php t chp vo ng v tr ca leadframe bng cch chnh mo di knh hin vi quang hc hoc CCD camra. Hai k thut thng c s dng gn die ln trn leadframe l k thut eutectic v k thut dng keo dnh. (nh bn: Qu trnh gn chp bao gm nht chp ln bng bt chn khng, nh v v hn)

K thut hn dng cht keo dnh - k thut ny ngi ta hay s dng cc hp cht c tnh cht bm dnh tt nh polyimide, epoxy hoc keo bc lm vt liu hn khi gn chp ln leadframe. Sau khi xc nh c v tr tng thch gia die v cu hnh trn leadframe, die s c y ra khi bt chn khng, nn ln trn b mt ca epoxy v qu trnh hn kt thc. K thut hn eutectic, thng c ng dng trong ng gi kn, s dng hp kim cng tinh gp die ln trn leadframe. K thut hn tin tin ny da trn vic s dng vt liu hn to ra hp kim cng tinh mt iu nhit c bit no , v im nng chy ca hp

kim thng thp hn khi n dng kim loi n l. Hp kim Au-Si, Au-Sn hoc PdSi thng c s dng rng ri trong k thut ny. gn c die ln leadframe u tin ngi ta ph mt lp vng vi dy ph hp ln trn b mt leadframe hoc die). Trong qu trnh hn, nhit cao s lm khuch tn cc phn t silic t b mt die ln lp vng ca leadframe, to ra cng tinh Au-Si (v d, hp kim Au-Si vi 2.85% Au c im nng chy 3630C). Khi hn ngi ta s nng nhit cao hn Tm mt cht, thng l c 10C so vi nhit eutectic dn n s lin khuch tn gia cht rn v cht lng b mt phn cch. Hp kim eutectic sau ho rn v c lm lnh. Hp phn, im cng tinh ca mt mt s hp kim c lit k trong bng di y. Bng 1 Hp phn v im nng chy ca mt s hp kim c gn sn trn leadframe Hp phn 80% Au, 20% Sn 92.5% Pb, 2.5% Ag, 5% In 97.5% Pb, 1.5% Ag, 1% Sn 95% Pb, 5% Sn 88% Au, 12% Ge 98% Au, 2% Si 100% Au Nhit (C) Th lng Th rn 280 280 300 309 309 314 310 356 356 800 370 1063 1063

ti u ho vic hn chp, ngi ta a thm vo ch 'mi' c thc hin bi mt b pht siu m, tc dng ln trn cn hn, dao ng vi bin c vi micrmt. iu ny lm tng c xt gia chp vi lp vng trn leadframe lm cho qu trnh to cng tinh din ra d dng hn. n y, chip c gn chc chn trn b mt ca leadframe, iu chng ta cn lm hin nay l ni dy t chn cc chp ny ra chn ca leadframe. K thut hn dy (wire bonding) Khng ging nh hn dy thic trn cc linh kin in t, hn dy chp l mt vic lm i hi tnh kin nhn v s hiu bit v cu trc IC. Vt liu hn y thng l hp kim Au hoc Al c ng knh mt ct ngang tiu chun c 25 micromt, C hai phng php gn si dy ln nhng mi hn v cng nh b l: phng php hn p nhit (thermocompression

bonding - TC) v phng php hn dng diu m (ultrasonic bonding- US). Phng php TC c pht trin ti phng th nghim Bell (Hoa K) phc v cho ngnh vi in t t 1957, v mi n nhng nm 1960 mi c thay th bng phng php hn dng siu m. Phng php hn TC dng lc nn khi hn, nhit cao trong iu kin chn khng hoc kh tr (N2, hoc Ar) to ra mi hn.

K thut hn dng siu m (Ultrasonic Technique) Mi hn, trong phng php ny, nhn c nh tng tc ca cc yu t: lc chn khng, p sut, nhit v thi gian. Khi hn, dy hn c t ln trn mi hn (bonding pad). Tn s siu m cng, lc nn cng vi s c st im u hn tip xc vi mi hn u tin lm sch im tip xc gia hai vt liu cn hn (ty b lp oxt b mt) sau l lm tng nhit khu vc dn n c s khuch tn vo nhau gia cc vt liu. V d my hn ca cng tyWESTBOND s dng mt b pht siu m knh i, hot ng tn s 63 KHz c iu khin bi vi x l Motorola 68000 cho cc loi my hn nhn cng (hay vi x l Intel Pentium IV theo h iu hnh Microsoft Windows XP Professional cho cc loi my hn t ng), thi gian pht xung v cng sut xung c th thay i mt cch n gin, bin dao ng ch c st (scrubs mode) c vi chc micromet xung quanh v tr cn hn. Trong k thut hn dng siu m, hnh dng mi hn s quy nh cu hnh ca u hn l cc php hn trn (ball bonding mi hn c dng cu) v php hn dt (wedge bonding mt hn c dng dt). Di tc dng ca xung siu m v lc nn, dy hn b nn dt v dnh vo im hn.

Mi hn dt

Mi hn trn

Trong k thut hn trn, trc tin ngi ta phi to ra u dy hn thnh dng hnh cu bng cch a qua bn di u dy mt thanh qut, chnh lch cao v in th gia thanh qut ny vi u dy s to ra mt tia la in mt u mi hn c c nh, dy hn c lm nng chy v to hnh di dng cu. Sau kim hn c mang n b mt hn c gia nhit to ra mi hn th nht. Mi hn th hai c hon thnh ging nh k thut hn dt. K thut hn trn c u im l cho php hn trn nhng IC c kin trc phc tp, nhiu lp v sau mi hn th nht, ngi k s c th quay si dy hn theo hng anh ta mun m khng s lm t dy hn, ng thi phng php i dy k thut hn trn l theo chiu thng ng (90) s trnh c hin tng t dy khi hn. Ngoi hai k thut trn cn c nhiu k thut khc nh Flip-Chip (hn lt), hoc TAB (Tape-automated bonding - thut ng m k s Vit Nam hay dng l: chp dn). Chng ti hy vng s c gii thiu vo mt dp khc. Kim tra mi hn (Pull Test) m bo cht lng mi hn ngi k s lun phi kim tra xem tip xc gia dy hn v mi hn c tt hay khng. Phng php kim tra mi hn thng dng nht l phng php ko (Pull Test). Mt mc c a vo di si dy hn gia hai mi hn, mt di iu khin ca vi x l s ko mc cu ny ln vi lc tc dng c th thay i c. D liu li ra trn my tnh s cho ngi k s bit c mi hn c tt hay khng. Hai ch kim tra c th s dng y l ch ph hu (cn gi l destruct) v khng ph hu (cn gi l non-destruct) mu. ch kim tra khng ph hu mu, da vo lc lin kt mi hn trn nhng vt liu bit trc nh Au hoc Al, ngi ta s t lc ko vo mc cu vi gi tr nh hn lc lm t mi lin kt . Nhng cng on tip theo l ng v trong mi trng chn khng hoc kh him (trong giai on ny, chng ta c th s dng cc sn phm nh ca cng ty Polaris), kim tra n nh ca chp v mt s cng on th nghim khc trc khi a vo s dng. Thay cho li kt Vi hai bi vit ngn ngi tc gi hy vng s mang n cho qu c gi mt ci nhn tng i tng quan v cng ngh ch to chp t phin silicon n vic hn dy ng v. Cng ngh cao ny khng phi l iu m c m tr thnh hin thc ti Vit Nam, trc kia l nh my Z181, nay l s hin din ca nhng cng ty khng l trong lnh vc ny nh Intel, HonHai Foxconn. S xut hin ca rt nhiu nh phn phi trong lnh vc ny nh cng ty ACROSEMI

(www.acrosemi.com), WESTBOND, SEMICONDUCTOR EQUIPMENT, AMI-PRESCO, POLARIS, hoc NEUTRONIX-QUINTEL cho thy nghnh cng nghip ny ang l ngnh mang li nhiu li ch cho tt c cc bn tham gia. Chng ti cng hy vng nhn c s chia s ca qu bn c. Mai Tu Phong Ti liu tham kho: 1. Goerge Harman, "Wire Bonding in Microelectronics. Materials, Process, Realibility and Yeild", Second Edition, McGraw Hill 1997. 2. Glenn R. Blackwell, "Electronics Packaging Handoobk", CRC Press 2000 3. Cng ty WestBond

Cng ngh vi in t - K thut hn dy v hn chp (Tip theo phn II) Nhm to iu kin thun li cho khch hng khi la chn cc mt hng ph hp vi nhu cu, chng ti xin a ra di y mt vi kin thc c bn ca cng ngh hn dy v chp do West Bond pht trin. Kin thc c bn v cng ngh hn. 1. K thut hn dng siu m (Ultrasonic Technique) K thut hn s dng siu m gm hai lp vt liu di xung siu m. Tn s siu m cng vi lc nn to ra nhit sinh ra do c st im u hn tip xc vi mi hn. Westbond s dng mt b pht siu m knh i, K~Sine men 27-EC, c di bc sng, hot ng tn s 63 KHz vi cng sut c v c iu khin bi mt vi x l (Motorola 68000, b nh 256 KB). Thi gian pht xung v cng sut xung c kiu chnh mt trc ca my. 2. K thut hn dng nhit (Eutectic Technique) K thut hn tin tin ny da trn vic s dng vt liu hn to ra hp kim cng tinh mt iu nhit c bit no . Cc h nh Au-Si, Au-Sn hoc Pd-Si thng c s dng rng ri trong k thut ny. V d, hn hp Au-Si, u tin ngi ta ph mt lp vng vi dy ph hp ln trn mt trong hai phin cn hn. Lp Si c th nhn t phin silc hoc bng cch to mng. nhit eutectic 3630C, hp kim lng Au-Si (3%-97%) c hnh thnh. Nhit hn thc cht cao hn c 10C so vi nhit eutectic dn n s lin khuch tn gia cht rn v cht lng b mt phn cch. Hp kim eutectic sau ho rn v c lm lnh. 3. K thut hn dy Dt-Dt (Wedge-Wedge Wire Bonding)

Di tc dng ca xung siu m v lc nn, dy hn b nn Dt v dnh vo im hn (hnh a).

(a) K thut hn dt 4. K thut hn Trn Dt (Ball-Wedge Wire Bonding) Trong k thut ny, mt u mi hn c c nh, dy hn c lm nng chy v to hnh di dng cu. Mi hn th hai c p v to hnh di dng dt (hnh b).

(b) K thut hn trn dt

Cng ngh hn dy - Nhng iu cn ch u hn V tr Lc kp Tnh cht Kh nng hn iu kin b mt hn B mt a l Din tch b mt hn hn Nhit Kh nng truyn nhit cng Mi trng hn n nh chnh xc ca php nh v S ng ho

Dy hn Kch thc dy

Mi hn S hnh thnh mi hn trn

Loi dy Chu ti ca dy (ti lm t dy) S ko di tinh khit (vt liu lm dy) ng u Vn/Xon iu kin b mt Kh nng hn

S hon tinh ca dy hn Tip xc u hn/Dy hn Hnh thi b mt Quy trnh hn ti u V tr hn xon dy Tip xc lin kim loi Thi gian/ Nhit lm vic iu kin b mt tip xc ca mi hn Hiu sut hn

My hn S chun ho my Quy trnh hn ti u K nng ca ngi vn hnh Hiu sut hn Thi gian Nhit Nng lng siu m S ng b ho Kh nng hn p sut lc hn

B mt hn sch ca kim loi ng u ca kim loi B dy ca lp kim loi sch b mt Hnh thi b mt Kh nng hn kim loi Thi gian sau khi hn kim loi/Nhit hn

______________________________________________ Cng ngh ng gi b mt (SMT) Xu hng pht trin khng th khc ti Vit nam u thng 5/2008, ti H Ni s din ra hi ch trin lm v cng nghip in t. Khch tham quan trin lm s c c hi din kin nhng c my, nhng cng ngh ang ngy m gp phn vo s pht trin ca nn cng nghip in t ton cu. Theo thng tin do TH nhn c, cc hng sn xut thit b cho nn cng nghip in t s tp trung vo gii thiu cc dy truyn hn linh kin b mt. Nhn s kin ny chng ti xin gi ti qu c gi mt s khi nim v cng ngh tin tin ny vi mong mun rng chng ta s c nhng khi nim c bn khi tip xc vi cc c my lm nn s thnh cng cho bao tp on in t hng u th gii. Khi nim v cng ngh hn linh kin b mt (SMT) Cng ngh hn linh kin b mt l phng php gn cc linh kin in t trc tip ln trn b mt ca bo mch (PCB). Cc linh kin in t dnh ring cho cng ngh ny c tn vit tt l SMD. Trong cng nghip in t, SMT thay th phn ln cng ngh ng gi linh kin trn tm PCB xuyn l theo linh kin in t c c nh trn b mt PCB bng phng php xuyn l v hn qua cc b ch nng.

Lp rp linh kin trn PCB theo cng ngh xuyn l

Theo cng ngh SMT

Cng ngh SMT c pht trin vo nhng nm 1960 v c p dng mt cch rng ri vo cui nhng nm 1980. Tp on IBM ca Hoa k c th c coi l ngi i tin phong trong vic ng dng cng ngh ny. Lc linh kin in t phi c gia cng c kh nh thm mt mu kim loi vo hai u sao cho c th hn trc tip chng ln trn b mt mch in. Kch thc linh kin c gim xung kh nhiu v vic gn linh kin ln trn c hai mt ca PCB lm cho cng ngh SMT tr ln thng dng hn l cng ngh gn linh kin bng phng php xuyn l, cho php lm tng mt linh kin. Thng thng, mi linh kin c c nh trn b mt mch in bng mt din tch ph ch rt nh, v mt kia ca tm PCB linh kin cng ch c c nh bng mt chm kem hn tng t. V l do ny, kch thc vt l ca linh kin ngy cng gim. Cng ngh SMT c mc t ng ha cao, khng i hi nhiu nhn cng, v c bit lm tng cng sut sn xut. K thut gn chp - Cc hng khc nhau s hu nhng b quyt v c quyn cng ngh khc nhau khi ch to cc loi my gn chp trn dy truyn SMT. Tuy vy, nhng cng on t lc np liu cho ti lc thnh phm (bo c gn chp) th tng i ging nhau. Cc cng on bao gm: 1) qut hp kim hn (kem hn) ln trn bo mch trn vo cc v tr trn c m sn chn hn bng vng, thicch, bc2) gn chp, gn IC 3) gia nhit lm mt 4 ) kim tra v sa li. Qut hp kim hn

Trn b mt mch in khng c l, nhng ni linh kin c gn vo, ngi ta m sn cc lp vt liu dn in nh thic-ch, bc hoc vng nhng chi tit ny c gi l chn hn (hay lp m hn). Sau , kem hn, thng thy di dng bt nho l hn hp ca hp kim hn (c thnh phn khc nhau, ty vo cng ngh v i tng hn) v cc ht vt liu hn, c qut ln trn b mt ca mch in. trnh kem hn dnh ln trn nhng ni khng mong mun ngi ta phi s dng mt dng c c bit gi m mt n kim loi (metal mask hoc stencil) lm bng mng mng thp khng g trn ngi ta gia cng, c thng nhng v tr tng ng vi ni t chp trn bo mch-bng cch ny, kem hn s c qut vo cc v tr mong mun. Nu cn phi gn linh kin ln mt cn li ca bo mch, ngi ta phi s dng mt thit b iu khin s t cc chm vt liu c tnh bm dnh cao vo cc v tr t linh kin. Sau khi kem hn c ph ln trn b mt, bo mch s c chuyn sang my t chp (pick-and-place machine). Gn chp, gn IC

(mu mt n kim loi)

Cc linh kin SMDs, kch thc nh, thng c chuyn ti ti dy truyn trn bng cha (bng giy hoc nha) xoay quanh mt trc no . Trong khi IC li thng c cha trong cc khay ng ring. My gp chip c iu khin s s g cc chip trn khay cha v t chng ln trn b mt PCB ni c qut kem hn. Cc linh kin mt di ca bo mch c gn ln trc, v cc chm keo c sy kh nhanh bng nhit hoc bng bc x UV. Sau bo mch c lt li v my gn linh kin thc hin nt cc phn cn li trn b mt bo.

Gia nhit lm mt Sau khi qu trnh gp, gn linh kin hon tt, bo mch c chuyn ti l sy. u tin cc bo tin vo vng sy s b ni m nhit ca bo v mi linh kin tng i ng u v c nng ln mt cch t t. Vic ny lm gim thiu ng sut nhit khi khi qu trnh lp rp kt thc sau khi hn. Bo mch sau tin vo vng vi nhit ln c th lm nng chy cc ht vt liu hn trong kem hn, hn cc u linh kin ln trn bo mch. Sc cng b mt ca kem hn nng chy gip cho linh kin khng lch v tr, v nu nh b mt a l ca chn hn c ch to nh thit k, sc cng b mt s t ng iu chnh linh kin v ng v tr ca n. .

(thit b gn chp SM421 ca Samsung)

C nhiu k thut dng cho vic gia nhit, bo mch sau qu trnh gp, gn. Nhng k thut m ta thng gp s dng n hng ngoi, kh nng. Trng hp c bit ngi ta c th s dng cht lng CF4 vi nhit si ln. k thut ny c gi l gia. Phng php ny khng cn l u tin s mt khi xy dng cc nh my. Hin nay ngi ta s dng nhiu kh nit cho hoc kh nn giu ni-t trong cc l i lu. D nhin, mi phng php c nhng u im v nhc im ring. Vi phng php dng IR, k s thit k phi b tr linh kin trn bo sao cho nhng linh kin thp hn khng ri vo vng ca cc linh kin cao hn. Nu ngi thit k bit trc c cc chu trnh nhit hoc qu trnh hn i lu th anh ta s d dng hn trong vic b tr cc linh kin gn trn bo. Vi mt s thit k, ngi ta phi hn th cng hoc lp thm cc linh kin c bit, hoc l t ng ha bng cch s dng cc thit b hng ngoi tp trung. Sau qu trnh hn cc bo mch phi c ra g b nhng phn vt liu hn cn dnh trn v bt k mt vin vt liu hn no trn b mt bo cng c th lm ngn mch ca h thng. Cc vt liu hn khc nhau c ra bng cc ha cht khc nhau c ty ra bng cc dung mi khc nhau. Phn cn li l dung mi ha tan c ra bng nc sch v lm kh nhanh bng khng kh nn. Nu khng ch trng ti hnh thc v vt liu hn khng gy hin tng ngn mch hoc n mn, bc lm sch ny c th l khng cn thit, tit kim chi ph v gim thiu nhim cht thi. Kim tra v sa li Cui cng bo mch c a sang b phn kim tra quang hc pht hin li b st linh kin hoc sa cc liv tr ca linh kn. Trong trng hp cn thit, chng

ta c th lp t thm mt s trm kim tra quang hc cho dy truyn cng ngh sao cho c th pht hin li sau tng mi cng on..

(hnh nh kim tra sn phm sau qu trnh hn nhit bng X-ray) cng on ny chng ta c th s dng cc my AOI (automated Optical Inspection) quang hc hoc s dng X-ray. Cc thit b ny cho php pht hin cc li v tr, li tip xc ca cc linh kin v kem hn trn b mt ca mch in. Li im khi s dng cng ngh SMT

Linh kin nh hn Cn phi to ra rt t l trong qu trnh ch to PCB Qu trnh lp rp n gin hn Nhng li nh gp phi trong qu trnh ng gi c hiu chnh t ng (sc cng b mt ca kem hn nng chy lm lch v tr ca linh kin ra khi v tr ca chn hn trn bo mch) C th gn linh kin ln trn hai mt ca bo mch Lm gim tr v khng ca lp ch tip xc (lm tng hiu nng ca cc linh kin cao tn) Tinh nng chu bn b hn trong iu kin b va p v rung lc Gi linh kin cho cng ngh SMT thng r hn gi linh kin cho cng ngh xuyn l Cc hiu ng cao tn (RF) khng mong mun t xy ra hn khi s dng cng ngh SMT so vi cc linh kin cho dng cng ngh hn ch, to iu kin thun li cho vic d on cc c tuyn ca linh kin.

Cng ngh SMT ra i, thay th dn dn cng ngh ng gi xuyn l, iu ny khng c ngha l SMT hon ton l tng. Nhng im cn phi khc phc cng ngh ny l qu trnh cng ngh ch to SMT cng phu hn nhiu so vi vic s dng cng ngh ng gi xuyn l, u t ban u tng i ln v tn thi gian trong vic lp t h thng.

Do kch thc linh kin rt nh, phn gii ca cc linh kin trn bo l rt cao nn vic nghin cu, trin khai cng ngh ny mt cch th cng s lm cho t l sai hng tng i ln v tn km. Hin nay cc sn phm SMT tng i a dng p ng cc nhu cu t th cng ti t ng ha hon ton. Hu nh cc hng sn xut thit b SMT hng u th gii u tham gia trin lm ln ny nh Samsung-SMT, Speedline (M) hay Juki (Nht bn). Vi s xut hin ca sn phm SMT, vi xu hng dch chuyn u t, Vit Nam chc chn s tr thnh nhng quc gia c nn cng nghip in t pht trin trong khu vc v trn th gii trong tng lai khng xa.

ACROSEMI Nhm nghin cu v khoa hc v k thut vt liu ti trng khoa hc v k thut ng dng McCormick s dng cng ngh nhum hunh quang to ra mt cng ngh xem hnh nh mi ca graphen mc chiu dy mt nguyn t. Graphen c coi l loi vt liu mng nht th gii v rt kh c th nhn c. Hin nay, mt s cng ngh c s dng xem nh graphen l rt t v tiu tn thi gian. Cng ngh c s dng nhiu nht hin nay l knh hin vi lc nguyn t (AFM), n c th quan st b mt vt liu bng cch qut trn b mt ca n vi mt u tp rt nh. Nhng cng ngh ny mt rt nhiu thi gian c th xem c hnh nh ca graphen v ch c th quan st c mt din tch rt nh. Knh hin vi in t qut c th qut trn b mt graphen vi mt chm in t c nng lng cao, vi iu kin mu o c t trong bung chn khng. Cng ngh nh du hunh quang thng c s dng xem cc hnh nh ca vt liu sinh hc. y l phng php s dng cht nhum hunh quang cho vt cht sinh hc cn c nghin cu, sau n s c quan st trn knh hunh quang nhng cng ngh ny khng c s dng cho vt liu graphen do c ch dp tt hunh quang. Vy lm sao c th xem graphen theo c ch ny? Huang v cc cng s ca ng ph mt lp ln lp graphen mt cht hunh quang sau quan st loi vt liu ny bng mt thit b c gi l knh hin vi dp tt hunh quang (FQM). Kt qu ca phng php ny cho hnh nh ca vt liu graphen r nt nh khi quan st chng trn knh hin vi lc nguyn t hoc tnh hin vi in t qut. Cng ngh ny cng c th xem c mu graphen trong dung dch. Hnh nh ca graphen trn silc c chp bng knh hin vi lc nguyn t (AFM), knh hin vi in t qut (SEM), knh hin vi quang hc ch phn x (OM), hin vi hunh quang dp tt (FQM).( i hc Northwestern). Theo Science daily
Tun trc, trong din n cng ngh thng nin, IMEC cng b cng ngh ch to pin mt tri dng cng ngh phun ph vi hiu sut ln 3% so vi tm mt tri c sn xut bng cng ngh quay ph. Cc tm pin mt tri trn vt liu hu c thng c sn xut bng vic quay ph cc lp hu c v bc bay chn khng kim loi ln mt trn. y l kt qu quan trng hin thc ha vic sn xut pin mt tri gi r v din tch ln.

iu rt quan trng cho cng ngh ct cnh trong thi gian ti l cc hot ng R&D ang a chng ta ti giai on hin thc ha quy trnh sn xut pin mt tri vi chi ph thp, nng sut cao. Cu trc ca tm pin mt tri dng cng ngh phun ph (a) nh SEM (b), cu trc ngang chp bng FIB/TEM ca pin mt tri hu c vi lp keo bc trn (c). Hiu sut chuyn i cho pin mt tri dng vt liu hu c thp hn nhiu so vi nhng vt liu khi hin nay cng nh i vi cc cng ngh mng mng khc. Hin ti, hiu sut cho pin mt tri hu c ch t c ~6%, nhng c th t hn 10% vi thi gian sng lu hn, ng thi cng nghip s tha nhn cng ngh ny nhanh chng hn do kh nng lm gim gi thnh v tng cng sut. Tuy nhin, iu ny ch thnh hin thc khi mi lp ca pin mt tri c to nn t dung dch bng cc phng php ph hp. Cc nh khoa hc cho rng cng ngh phun ph ang l cng ngh mang tnh ha hn cao nht dng ch to pin mt tri trn c s vt liu hu c k c lp tip xc kim loi. Hin ti, IMEC s dng dung dch P3HT v PCBM to ra lp hot ha cho tm pin mt tri, v to ra mt dung dch cha ht nano bc to lp tip xc bn trn. Thch thc cng ngh l vic ph lp tip xc b mt m khng lm ha tan lp bn di, hoc khng lm hng lp vt liu khi dng nhit lp nano bc. Phng php phun ph cho php lm gim ng k chi ph so vi cc k thut khc. Cc ht nano bc c th c nhit T=150C, nhit tng ng vi qu trnh cc loi mm.

Tiu th nng lng hiu qu S rt hu ch nu chng ta xc nh c gin tiu th nng nng lng t kho st tnh hnh tiu th nng lng ( hnh 1) Mc d gin ny c xy dng mt nc pht trin (M), ch khng phi in hnh cho gin tiu th nng lng ton cu nhng chng ti tin rng n cng c th ng cho cc nc c nn kinh t mi ni. Phn na tng nng lng tiu th c dng trong cng nghip v thng mi, 1/3 cho vn ti v cn li l dng cho cc h gia nh. C 2 yu t lm gp phn lm gim lng nhin liu tiu th. Mt l bn thn mi con ngi thay i li sng, li t duy, h tr nn c thc hn v quan tm nhiu hn ti phn nng lng b tiu hao, tht thot nh: chy xe t hn, tt nYu t th hai l gim nng lng tiu th cho cc sn phm u cui. Yu t th nht l cn thit nhng cha bi nng lng l nhu cu thit yu ca con ngi trong cuc sng. Con ngi s dng nng lng ngy cng nhiu, nht l khi c iu kin v kinh t h sm sa thm cc vt dng thit yu hoc gii tr nh t lnh, my git, tivi hoc xe hi. Xem ra vic tiu th nng lng ch c nc tng ch khng h gim, ngay c khi

con ngi c thc rt r v tm quan trng ca tit kim nng lng. V th, bi ton t ra y chnh l vic gim nng lng tiu th trn cc thit b u cui. Lm c iu ny, chng ta s gii quyt c nhng thch thc v tiu th nng lng ni chung. Cng nghip v thng mi Khong mt na nng lng sinh ra c dng trong cng nghip v thng mi. Cng ngh bn dn c tc ng ti tnh hnh s dng nng lng bng nhiu cch khc nhau. Mt trong s cc tc ng l ci tin hiu qu ng c in, chim khong 2/3 lng in tiu th ca ngnh cng nghip trn th gii. Chp bn dn c kh nng iu chnh tc ca ng c, lm cho mc tiu th c nng lng ch bng 1/8 nng lng cn phi b ra sinh cng mt cng ng c c tc khng i. Hin ti mi ch c 5% ng c in s dng h thng bin tc, mi ch th thi nhng nng lng tit kim c tng ng vi sn lng ca 10 nh my in. Nh vy, nu 100% ng c c ci tin th nng lng m chng ta c th tit kim c tng ng vi 200 nh my in. Tc ng ti mi trng cng c ngha quan trng tng ng. Nhng ng c hiu qu tit kim c 68 triu tn kh nh knh.

Hnh 1. Gin phn b tiu th nng lng ti M Cng ngh s tr thnh 1 phn ca i sng c nhn v ngh nghip ca mi ngi trn ton th gii. iu ny, dn ti tng nhu cu nng lng cho cc thit b s. V d, nm 2006 ti M, h thng my ch v cc trung tm d liu tiu th 61 t KWh gp i lng tiu th nm 2001. Vic s dng nng lng ca trung tm d liu s li tng gp i trong 5 nm na nu chng ta khng c bt k 1 gii php no. Tuy nhin, nh nhng pht minh trong cng ngh chip bn dn v cng ngh thit k h thng, chng ta c th gim c phn na lng nng lng tiu th cho d nhu cu vn s tng gp i. Cng nghip bn dn c b dy lch s v i trong vic gim thiu nng lng. V d nh My in ton u tin ENIAC nng hn 30 tn vi cng sut tiu th 200 KW. Gi y, nu thc hin chc nng tng t, ngi ta ch cn dng ti thit b cm tay nng vi gam v tiu th cha ti 1 W. Vn ti Chip gi vai tr chnh gip cho vic s dng nng lng trong cc ng c ca my bay, tu ha , xe hi mt cch hiu qu. V d, nhng chic xe cng ngh cao c tch hp cc thit b in t gp li xe an ton hn, kinh t hn, v tin nghi hn. Nhng chic xe ny tiu th nng lng hiu qu hn v hon ton c li vi mi trng. Cc ci tin v cng ngh nh thit b li bng in, b phn tch hp, bm nhin liu khng chi, h thng chng trt v chng b phanh. y l 1 h thng in hnh c vn hnh bi t hp bao gm cc cng ngh cm bin, chip x l v chip nh. Mt s phng tin c ti 100 chip in tan (b vi x l) ngha l nhiu hn c mt h thng my tnh mnh. Vic gim gi chip nh cng ngh bn dn lm cho cng ngh ch dnh cho xe i cao dn xut hin cc dng xe thp hn, iu ny ng ngha vi vic kch cu trong ngnh cng nghip t.

Hnh 2. Cng ngh cm bin, vi x l, cn bng li, chng lt c a vo xe hi ng dng cng ngh bn dn trong nhng i xe chy in hay ng c lai c mt ngha to ln. Ngoi nhng b phn in t tr thnh tnh nng chun trong xe hi ngy ny, nhng chic xe chy in hoc ng c lai cn phi c s iu chnh v in th. iu ny c th thc hin c thng qua cc IC cng sut iu m cc b phn R&D ca cc hng xe hi ng gp nhng kt qu rt quan trng. Nhng chic xe ny tiu th nhin liu hiu qu hn nhiu so vi loi t chy bng xng du, iu ny ng ngha vi vic gim c 33% lng C02 thi ra. Vi tin b cng ngh hin nay, hiu sut ny thm ch s cn c ci thin rt nhiu. Mt cch gin tip, chip bn dn gim thiu c tiu th nng lng trong vn chuyn bng cch cho php phng thc lm vic t xa. Ngha l, vi tin b v cng ngh thng tin v in t, ngi ta c th ngi nh lm vic thay v phi di chuyn ti vn phng. Hin nay, gn 4 triu ngi M thng xuyn lm vic ti nh qua mng vin thng v tit kim c khong 840 galn xng mi nm tng ng. iu ny cng gp phn tit kim c 14 t KWh in nng hng nm cp cho 1 triu h gia nh M. V mt tc ng ti mi trng, ch tnh ring ti M, cng gim c ti 14 triu tn C02 hng nm. H dn c Cui cng nhng khng km phn quan trng l chip bn dn ang bt u c tc ng n vic tiu th nng lng trong cc h gia nh, mc d ch chim 22% trong tng s nngn lng tiu th nhng con s ny cng tng ng vi 1/3 tng lng in tiu th ti M. Mc s dng nng lng trn th gii s nhanh chng tng ln bi ngi dn l nhng ngi tiu th cc dch v v hng ha trc tin. Bng bn dn ng vai tr chnh trong ci thin c hiu qu in chiu sng nh iu chnh sng ca n hunh quang v n LED. Bn thn n LED l sn phm ca cng ngh bn dn. Cng ngh bn dn cng gip gim tiu th nng lng d tr cho cc thit b gia nh v mc d tt cc thit b nhng vn duy tr ngun nui ti thiu cho h thng bin p khi c cm vo hay cho cc in thoi khng dy V ngun nui ti thiu phi c duy tr thng xuyn 24 gi/ ngy cho cc thit b hin i trong nh, nn d c rt nh nhng cng chim ti 5-10% lng in tiu th trong cc h gia nh.

Hnh 3. Nh thng minh vi v vn kt ni. Mc tc ng ca Cng ngh bn dn cng thy r khi c ngy cng nhiu nh thng minh. Ngy nay, nhng ngi nh thng minh tng chng ch c trong vin tng ca con ngi xut hin vi nhng tnh nng u vit nh : tit kim nng lng, thit b trong nh u c iu khin. Ngi nh thng minh thng c lp t cc h thng in t khp

ni c kt ni Internet vi my tnh, PDA hay mng khng dy. Ngi nh thng minh cng s c Chip o tng tc vi h thng in li hin i. S tng tc ny gip tit kim nng lng, gim hao ph, ng dng tt cc b iu khin. Chng hn nh khuyn khch s dng in ngoi gi cao im, gim c nhu cu v ti sut ti a. i vi 1 s m hnh, ngi tiu dng tt bt cc thit b in trong gi cao im ch phi tr chi ph in mc gi thp hn. i vi m hnh khc, mc gi in thay i ty vo thi im th ngi tiu dng s ch bt cc thit b tiu th in c cng sut ln vo lc gi in thp. Nu ngi nh thng minh c cung cp in bng ngun nng lng thay th nh nng lng mt tri ch cp in cho h thng in li vo thi im mnh cn, theo cn bng cung cu s tt hn. Hng ti ngun nng lng thng minh tng lai Trong 2 thp k ti, chip bn dn s ng gp rt nhiu cho vic thc hin cuc cch mng ha qu trnh sn xut, phn phi v tiu th nng lng. S i mi s v cng c ngha. Cng ngh bn dn ng vai tr quan trng khi cp ti thch thc ca nng lng ton cu v ngy cng cn bng chui cung cu theo hng c li cho mi trng. Tuy nhin, vic tip tc i mi chip bn dn c th b gin on nh ngun nng lng thay th, h thng in li thng minh, phng tin chy bng in ngy cng pht trin v ngy cng tr nn thit thc, ph bin. ng dng cng ngh nhanh chng gii quyt c nhng i hi mang tnh thch thc i vi ngun nng lng d tr, ng h vic nghin cu h sinh thi cng ngh cao, u t i mi thng qua cng tc cht ch gia cc ngnh cng nghip, chnh ph v trng i hc. S tht sng sut nu chng ta duy tr nghin cu v nng lng thng minh, bi n s to ra bc t ph trong lch s ging nh pht minh ng c chy bng hi nc, ng c t trong, v ph bin thit b in ti tng nh. SMT Vit Nam

Tnh ti thi im ny, phn ln cc nh sn xut pin mt tri ang tp trung u t cho cng ngh trn nn silicon. Nm 2008, nhng tm silicon n tinh th hoc a tinh th c kch thc 125mm x 125mm hoc 156mm x 156mm hin ang chim gi ti 85% tng cng sut sn xut v lp t ca cc nh my. Tnh sn sng ca h thng thit b, c s h tng v vic sn xut phin silicon vi hiu sut chuyn i cao l nhng yu t chnh quyt nh s thnh cng ca cng ngh ny. Ngi ta tin rng cc nh khoa hc ang c pht kin nhng tin b mi nhm tm ra mc chung ca cc cng ngh khc nhau, p ng nhu cu ngy cng cao ca nng lng th gii. trnh hin tng nt gy, cng ngh pin mt tri da trn nn silicon khi s dng cc tng i dy, v vic s dng mt lng ln silicon trong sn xut l nguyn nhn lm cho gi thnh ca cng ngh ny vn cn cao vi

ngi tiu dung. Mc nhng c gng ca cc nh sn xut s dng nhng tm silicon mng hn (~ 500 micron, 1979 v cha ti 200 micron ngy hm nay), ngi ta vn a d tm nhng cng ngh thay th vi gi thnh thp hn. D nhin, ci g mi cng kh c th c chp nhn khi ci c ang vn hnh tt (phn ln mang li ngun li cho nh sn xut). Nhng cng ty sn xut pin mt tri trn c s silicon th cho rng h s lm gim gi thnh trn mt n v nng lng bng cch tng hiu sut v gim gi silic a tinh th. Cc nh sn xut PV trn cng ngh mng mng tuyn b vt liu gi r v khn nng sn xut tm ln s khc phc c bt li v hiu sut chuyn i lm gim chi ph sn xut. Hin ti, hiu sut chuyn i tt nht ca pin mt tri trn c s silic l 25%, trong khi mng mng trn c s silic v nh hnh c 12% v cc tm pin mt tri da trn cc hp cht bn dn khc nm trong khong 16% 20%), [1]. PV trn c s mng mng c coi l tng lai ca ngnh sn xut pin mt tri. Vic ph nhng lp mng mng ln cc loi nh thy tinh, thp khng g hoc nhm, ang dn dn thay th nhu cu ca silic a tinh th. Trong khi cng ngh silicon cn phi dng nhiu tm ghp li trn , to ra nhng k h mp tm pin th cng ngh mng mng c th gii quyt c tn ti vi mt tm panel c kch thc hng mt. im yu ca cng ngh mng mng, cho ti ngy hm nay, chnh l hiu sut chuyn i thp hn. V th, nhng ni din tch hn ch cng ngh trn c s silicon vn chim u th. Vo nm 2008, cc tm pin trn c s mng mng vn cha t c mc gi/ot thp hn so vi pin mt tri trn c s silic (1,38 la/watt silic so vi 1,51/watt cho mng mng, th nm nay t s ny c cn bng [2]. T l ny c th thay i, nhng rt nh, gia vic t vn v cch tip cn ca cc cng ty phn tch v nh gi. Phn tch cho thy, vn cn nim tin rng vi s tin b ca k thut cng ngh mng mng s chim u th so vi cng ngh silic truyn thng v ti nm nay cng ngh mng mng gn nh gii quyt c vn Da trn c s ca cc nh sn xut tm pin mt tri ton cu chng ta thy c s tng trng rt mnh ca ngnh sn xut tm pin mt tri mng mng t 15% (2008) ln 31% nm 2012 ( mt s cng ty nh gi l 34%). Cng sut sn xut ln nht cho pin mt tri trn c s mng mng da trn silic v nh hnh, v c d on l c mc tng trng ti hn 5 ln nhng loi vt liu v nh hnh khc vo nm 2012. Nhng vt liu ang l i th ca silic v nh hnh l hp kinh ng indi sunphua (CIS) cho hiu sut chuyn i ln hn. Ngoi ra cn c Telua-Cadimi (CdTe) mc du hiu sut cha cao bng vt liu CIS. Nhng hot ng R&D cho hai loi vt liu ny ang thu ht rt nhiu hng sn xut v cc trng i hc, vin nghin cu sao cho hiu sut chuyn i ngy cng gn vi silic khi. Ti thi im ny, cn kh sm ni rng cng ngh no s chim u th hon ton hoc s phi l kt hp ca nhiu cng ngh. C iu, chng ta hiu r, l nn cng nghip ang t cc vo cng ngh mng mng nhm ginh ngy cng nhiu th phn t tay vt liu silic dng khi.

Tp th k s ca i hc Buffalo gn y chng minh bng c lng t rng ng nano ccbon n si (SWCNTs) c tnh cht lm ngui tt hn rt, rt nhiu so vi tnh cht ca kim loi trong ngnh in t. Nh vy, nu c th a vo sn xut, SWNTs c th thay th rt nhiu kim loai ang c s dng trong IC hin nay.Mt dng cao c th dn ti s chuyn in v chuyn in, hin tng ny c th lm phng hi ti vt dn kim loi v sinh nhit thng to ra sai hng sm ca thit b in t.

Bn nm qua, phng th nghim ng gi in t , trng H Buffalo (Buffalo, N.Y.), do TS. Cemal Basaran lm ch nhim tin hnh cc tnh ton c hc in t chng minh rng SWNTs mt dng cao khng khng gy ra nhng hin tng nh trn do lng nhit ta ra ch bng 1% lng nhit sinh ra so vi vt liu kim loi truyn thng nh Cu. CNTs c nghin cu trong rt nhiu cng trnh khc v c cng b vi rt nhiu tnh cht c bit. Nhiu nh khoa hc cho rng c th dng CNTs thay th kim loi trong nhiu ng dng trong in t. Tuy nhin, nhiu nh khoa hc cng cho rng qu trnh nhit in trong SWCNTs tun theo nh lut Joule ngha l tr trong mch chuyn nng lng in thnh nng lng nhit. Basaran v ng nghip chng minh bng ton hc, s dng cc cng c c hc lng t chng minh SWCNTs khng tun theo nh lut Joule. S khc nhau gia kim loi v SWCNTs l cch chng dn in. Mc d, SWCNTs l cht dn in, chng khng c bt k lin kt kim loi no, nh vy chng khng dn in ging nh cch kim loi thng thng, ngha l thng qua s tn x in t trong mng tinh th ca vt liu sao cho khi in t chuyn ng, chng s tng tc vi cc nguyn t. iu ny gy ra lc ma st v sinh nhit. Cch dn in trong SWCNTs rt khc, chng dn in trong cu trc 1 chiu. in t c dn thng trong vt liu v rt t va chm, tng tc vi nguyn t. Lc ma st ti thiu trong SWNTs gii thch ti sao dn ca vt liu ny cao hn rt, rt nhiu so vi kim loi thng thng. Tnh cht duy nht ny ca SWCNTs s cho php cc k s hin thc ha vic ch to cc thit b nh hn, nhanh hn v tiu tn t nng lng hn so vi cc thit b hin nay khi m chng ta c th loi b phn ln cc tip xc kim loi trong h thng. Trn quan im ng gi chp, cho ti nay, mi vt liu chng ta s dng cho qu trnh to tip xc hoc lin tip xc u l kim loi hoc hp kim. Ro cn khuch tn (nhit) c khuynh hng l Niken v ro cn n mn thng l vng. Tuy nhin ngi ta phi ng vi nhau mt iu rng khng th ch to kim loi vi kch thc nh v cng vi mt dng cao. Chng ta khng th ngn c lc khuch tn do s chnh lch v nhit v mt dng qu ln. Basaran v nhm ca ng tm thy, WCNTs, mt tnh cht rt quan trng l chng khng c biu hin g lin quan ti hng ro khuch . Trc mt khng th thay th cc im tip ni trong mch in PCB, nhng Basaran hy vng rng c th lm iu ny i vi lin tip xc trong lp ng gi ban u. Ban u, h mun th nghim cng trnh ca mnh trn ng gi h thng trn chip (SoC) chng minh nhng tnh cht c bit ny. Mt trong nhng u im ni tri ca SWCNTs l chng c th hot ng nhit cao. Rt nhiu ng dng in t b hn ch vng nhit cao. Nu bn dn trn c s Silic-Ccbua s dng lin tip xc l SWCNT, h thng c th hot ng nhit cao hn tm 600C khng phi l nhim v bt kh thi trong tng lai gn. Chng ta c th mc CNTs trn mt bn dn vi chi ph rt thp mc d cn phi lm nt mt s cng on khc nh khng ch hnh dng ca n v cch m chng ta cun n li s quyt nh CNTs l bn dn hay kim loi. Tng hp v c nh CNTs m khng c sai hng cng l mt b quyt na. Khi c th tri CNTs

thnh mt mng mng, b dy ca n s c nguyn t, nu ch cn khuyt mt nguyn t s gy ra sai hng ln. Trong lnh vc ny cc nh khoa hc Nht Bn ang ng u danh sch. Vit Nam cng c rt nhiu nhm nghin cu ng dng ca CNTs trong vic ci tin tnh cht ca vt liu. V d, pha tp CNTs vi si nano Sn c th lm gim nhit hot ng ca cm bin kh t c T>2000C xung nhit phng. Hoc, CNTs c th c nghin cu trong nghin cu vi cu trc khi gn trn cc u d ca knh hin vi in t. Hy vng rng, vi s gp mt ca Intel Vit Nam v cc cng ty bn dn khc cc nghin cu v CNTs ng dng trong ng gi chp in t s c sm trin khai.

Tm tt: Con quay vi c ch to da trn cng ngh vi c in t (MEMS) hin c s dng rng ri trong cc h qun tnh phc tp. Nhm p ng nhu cu ch to v ng dng con quay vi c trong thc t, bi bo ny cp ti vic thit k mt cu trc hot ng theo c ch dao ng c ch to trn vt liu silic. Cm bin TFG c u im l cu trc n gin v d dng tch hp mch x l tn hiu. Cc thit k vit trn MATLAB cho php kho st cu trc ba chiu v cc thng s ca cm bin. M U Con quay vi c hay cn gi l cm bin vn tc gc c dng o vn tc gc quay. Vi gi thnh ngy cng h, kch thc ngy cng thu nh, con quay vi c c dng rng ri trong cng nghip t (cn bng, iu khin phanh, tng tc); in t dn dng (my nh, my git, thc ti o); robot v c bit l trong qun s [1]. Ngoi ra, con quay vi c c s dng kt hp vi cc cm bin gia tc phc v dn ng cho my bay, tn la Hnh 1. Nguyn l ca cm bin vn tc gc TFG Bi bo ny cp ti mt loi cm bin vn tc gc hot ng theo c ch dao ng c dng m thoa. y l mt trong nhng cu trc d ch to v d dng tch hp mch in t. Cu trc c hc ca cm bin s c ph cc lp in cc cm bin v in cc truyn ng. Mch in t bn ngoi c kt hp nh cng ngh CMOS. Nhng thit k c hc c thc hin theo phng php phn tch trong mi trng MATLAB. Cc thng s ca cm bin TFG (tn s cng hng, nhiu, nhy...) c nh gi v phn tch chi tit trong cng trnh ny. NGUYN TC HOT NG S nguyn l ca mt cm bin vn tc gc c m t trong hnh 1. Khi gia trng m c gn trong mt khung c nh gm bn l xo n hi v bn b suy hao. H s n hi ca l xo tng ng l kx/2 v ky/2. H s suy hao tng ng l bx/2 v by/2. Gi s rng l xo v b suy hao c khi lng khng ng k gn vo khung c nh nh 4 bnh xe c th trt khng ma st trn khung. Gi Qx v Qy ln lt l h s phm cht theo trc x v y. v tng ng l tn s cng hng

ca TFG theo trc x v y. Khi cm bin chu mt vn tc gc quay quanh trc z, ta c phng trnh ng hc: (1.a) (1.b) Chn trc x l trc truyn ng tc l t mt dao ng: (2)

Vi l tn s truyn ng v x0 l bin dao ng. Trc y s cm nhn c vn tc gc thng qua bin dao ng y0 trn trc y [2]. S dng cng thc tnh lc CORIOLIS, ta c: (3) Vi mc tiu thit k cm bin c h s cht lng l 1000, vn tc gc ti a = 200 o/s=3.5 rad/s v tn s cng hng c 2 ch khong 30kHz th t s y0/x0 l rt nh. iu ny c ngha l nh hng ca dao ng trn trc y ln trc x c coi bng 0. H phng trnh c n gin ho thnh : (4.a) (4.b) Phng trnh (4.b) cho ta phng trnh ng hc ca mt cm bin gia tc vi gia tc ngoi lc l. THIT K CM BIN VN TC GC TFG Thit k cc cm bin vn tc gc kiu t s dng chng trnh m phng Sugar hot ng da vo phn tch nt gii cc phng trnh vi phn phi tuyn [3]. Chng trnh c thc hin trong mi trng MATLAB vi chnh xc cao, tng ng vi nhng m phng truyn thng [4]. Cc tham s u vo c th dng thay i cc tnh cht vt l v hnh hc nh Hnh 2. Thng s hnh hc ca TFG h s Young, h s Poison, hng s in mi, rng thanh dm iu ny rt thun li khi thay i thit k cc cm bin khc nhau v y cng l u im ln so vi cc cng c m phng khc (ANSYS, MEMSCAP). Hnh 2 m t cc thng s hnh hc ca cm bin TFG trn mt phng xz.

Bng 1. Thng s vt l v hnh hc ca cm bin vn tc gc TFG

Bng 2. Thng s in cc ca t in

Bng 3. Cc thng s truyn ng v cm bin ca TFG l khi lng ring ca silic.Bng 1 m t cc thng s chi tit ca cm bin. y E l module Young, v l h s Poisson v Hnh 3 biu din bn ch dao ng cng hng c m phng bng SUGAR. Da vo chuyn ng tng i ca hai thanh dm m c th k hiu cc ch cng hng l xl, xchn, yl v ychn. Trong bn ch ny th xl v yl c la chn bi h s phm cht trong hai ch cng hng ny l ln nht [5]. T nhng tnh ton l thuyt v m phng bng SUGAR thy rng cc thng s b1, c2 v dy h nh hng rt ln ti cc tn s cng hng. Ta bit rng sai s trong qu trnh ch to s lm thay i c tnh mong mun ca cm bin. iu ny c th khc phc bng phng php iu chnh tn s [6]. Trong bi bo ny, cc Hnh 3. Bn ch cng hng ca TFG in cc ca t in c kch thc nh trong bng 2: Cc thng s ch truyn ng v cm bin c tnh ton v lit k nh trong bng 3. Cm bin c di tn hot ng l 30 Hz v nhiu nhit Brownian l 0.010/s/Hz1/2. Trong bi bo ny cha cp n vic tnh ton nhiu ca ton b cm bin vn tc gc cn thit k (l tng ca nhiu Brownian v nhiu do mch in t). Gi tr ny s xc nh phn gii ca cm bin TFG. KT LUN Trong cng trnh ny, mt cm bin vn tc gc n gin vi nhng u im ni bt nh cu trc n gin v d dng tch hp mch in t c tin hnh thit k. Cm bin c ch to bi s kt hp gia cng ngh MEMS v cng ngh CMOS. Cc thng s chi tit ca cm

bin c m phng v tnh ton trn c s cng c SUGAR. Nhng kt qu ny ht sc quan trng v cn thit ch to thnh cng cm bin vn tc gc ph hp vi cc yu cu ra.