B. E.

(E & TC) (200 3 Co ur se )

EL ECTR ON IC PRO DU CT DE SIG N

TEACHERS MANUAL AND GUIDELINES FOR TEACHING

NOTES: (X)- means .pdf of original is on CD.

(N)- means Notes are on CD.
Italicized matter indicates instructions to teachers.

UNIT I: Product Design and Development

1. An overview of Product development stages- See CD (N). Scope and approach is limited
to what is mentioned in the note.
2. Assessment of Reliability –See CD (N). Scope and approach is limited to what is
mentioned in the note. R4 – Chapter 1- Sections 1.2, 1.3, 1.4, 1.5 (X).
3. Ergonomic and Aesthetic Design Considerations- CEDT Notes (X). Condense the notes to
1 lecture only.
4. Quality Assurance- R1- Section 11.6.13- (X).
5. Packaging and Storage- See CD- http://www.fieldlabeling.com/pages/ip.htm - Ingress
protection Standards. R3- Extracts from Chapter 5. Condense to 1 lecture only.
6. Estimating Power Supply Requirements- See CD- Fairchild Semiconductors
http://www.fairchildsemi.com Application Note AN-303 HC-MOS Power Dissipation. Texas
Instruments- http://application-notes.globalspec.com/ Document No. SCAA 035, June 1997.
Cover considerations in theory class and assignment in Prcaticals.
7. Power supply protection devices- See CD- Vishay - http://www.vishay.com Application
Note Hardening Power Supplies To Line Voltage Transients. R3- Extracts from Chapter 6.
T1- Extracts from Chapter 68- Sections 68.1, 68.2, 68.3, 68.4 (X). Condense to 2 Lectures.
8. Noise reduction, Grounding, Shielding and Guarding techniques- See CD- Analog
Devices- http://www.analog.com Application Note AN-208 Mixed Signal Circuit Techniques-
Pages 24-69 to 24-84. T1- Extracts from Chapter 142 (X). R3- Extracts from Chapter 6. T1-
Chapter 74 Sections 74.1, 74.2, 74.3. (X). Condense to 2 lectures.
9. Thermal Management- Philips Semiconductors-
http://www.semiconductors.philips.com/acrobat_download/applicationnotes/APPCHP7.
pdf Pages 567 to 573, T3- Extracts from Chapter 10. T1- Chapter 75 Sections 75.1,
75.3, 75.4 (X). Condense to 1 lecture.

UNIT II: PCB Designing

1. General Considerations- See CD- Lattice Semiconductor Corporation-

http://www.latticesemi.com Extracts from Application Note 6012 (Sept 1999)- Analog
Layout and Grounding Techniques, Lattice Semiconductor Corporation-
http://www.latticesemi.com Technical Note TN 1068 (May 2004)- Power Decoupling and
Bypass Filtering for Programmable Devices. Maxim- http://www.maxim-ic.com/an637
Application Note 637 Getting the Most from Your Sensor & Conditioning Electronics.
Analog Devices- http://www.analog.com Application Note AN-208 Mixed Signal Circuit
Techniques- Pages 24-69 to 24-84. Cover material in UNIT II- 1 and 2 in 3 lectures.
 Coverage to include- Gneral component placement guidelines ,Analog and digital signal
grounding, grounding practices, ground planes, thermal and heat flow considerations.
2. Layout considerations- R3- Sections 8.3, 8.4, 8.5. R2- Sections 4.1, 4.2, 4.3, 4.4, 4.8 (X)
3. Study Of Packages for Discrete Devices and ICs- T1- Chapter 55 (X), R1- Section 2.9 (X).
Cover in 1 lecture.
4. Calculation of Parasitic Elements in PCB- See CD-Analog Devices- Application Note AN-
208 Mixed Signal Circuit Techniques- Pages 24-54, 24-55, 24-58 to 24-68. T1- Section 71.4
(X). R2- Section 3.4 (X). Cover numerical based on formulae given in Analog devices
application note.
5. High Speed and EMI/EMC Considerations in PCB Designs- See CD- Altera Corporation-
Application Note AN 75- High Speed Board Designs.
http://www.icd.com.au/articles/emc.html - EMC Design for High Speed PCBs. R3- Chapter
7- Section 7.5
6. Mounting in presence of vibrations- R3- Section 5.5. Self study.
7. SMD assemblies - T1- Chapter 73 (X). R2- Sections 13.9.2 (X). Self study
8. Testing of Assembled PCBs- R2- Chapter 14- Section 14.4.3 (X). Self study

UNIT III: Hardware Design and Testing Methods

1. Use of Logic Analyzer- See CD- Extracts from- Tektronix Application Note- XYZs of Logic
Analyzer. T1- Chapter 133 (X). R4- Chapter 3. Sections 3.3, 3.3.2, 3.3.3, 3.4 (X).
2. Use of DSO, MSO and DPO- See CD- Extracts from- Tektronix Application Note- XYZs of
Oscilloscopes
Draw extracts form application notes where teaching material cover basic understanding of
new generation oscilloscopes. The focus should be on understanding limitations of each type
of oscilloscopes and improvements done in next type. Teach how to USE these oscilloscopes
and not theory behind them.
3. Signal Integrity issues-
4. DC or Operating Point Analysis, AC Analysis, Transient analysis, Monte Carlo Analysis-
See CD (N).

UNIT IV: Software Design and Testing Methods

1. Software design- (X). See Xerox supplied.

2. Use of Simulators, Emulator, Assemblers, Cross-compilers- R8- Extracts from Chapter 8
and 10. R9- Chapter 4, Section 4.2 (page 98) and Section 4.5. Approach is to make students
aware of different types of Assemblers, Compilers and Cross-compiler, simulators and In-
circuit emulators; with focus on How to use them for software development. Aspects like-
When to use Assembly language and when to use High level language should be covered.
Development of system software is NOT implied. Development of product software is implied.
3. ASM/ FSM Design- Draw extracts fromR7- Approach should be- How method is used for
digital designs and VLSI designs.
Scope of software design and testing is limited to product related software development. To
this extent, programming PLDs should also be covered. System software development is not
implied.

UNIT V: Product Testing

1. Environmental Testing- See CD (N). Limit scope to what is indicated in notes.

2. UL/CE Marking- See CD.
3. EMI/EMC Compliance testing- See CD. Limit scope to creating awareness about- What is
conducted EMI, Radiated EMI. Why EMI/EMC tests are important. What are different tests
carried out on products and what is the typical test set up.
UNIT VI: Documentation

1. PCB Documents- R2- Chapter 3, Section 3.12 (X)

2. Bare Board Testing- See CD. R2- Chapter 14- Section 14.4.2 (X)
3. Product Test Specifications- See CD (N).
4. Interconnection Diagrams- See CD (N). Give an assignment in the class to prepare
interconnection diagram for Mini-project done.
5. Software documentation practices- Scope should be limited to standard practices of
documenting assembly and C language programmes for product development. Standard C
temlpatae is to be used for illustration.

List Of Text Books, Handbooks and Reference books-

T1- J. C. Whitaker, The Electronics Handbook, CRC Press, IEEE Press

R1- Handbook Of Electronic Package Design- Michael Pecht, Mercel Dekker Inc., ISBN 0-8247-7921-5
R2- Printed Circuit Boards Design, Fabrication, Assembly and Testing- R. S. Khandpur, Tata McGraw
Hill
R3- Electronic Instrument Design, Architecture for life cycle, Kim R. Fowler, Oxford University Press
Inc.
R4- Handbook Of Analytical Instruments- R. S. Khandpur, Tata McGraw Hill
R5- Software Engineering- Pressman, Prentice Hall India
R6- Design with Microcontroller- J. B. Peatman
R7- Art Of Digital Design- Winkel, Prossor
R8- Programming and Customizing the 8051 Microcontroller- Myke Predko, Tata McGraw-Hill
Publication
R9- The 8051 Microcontroller- Kenneth J. Ayala, Second Edition, Tata McGraw-Hill Publication
 ELECTRONIC PRODUCT DESIGN
Instructions/Guidelines to teachers (CONFIDENTIAL) (NOT FOR STUDENTS)

1. Since the subject matter is covered in large number of references including websites, a
copy of CD should be made available to students. This will act as substitute for TEXT.
All students must be made aware of scope of each sub topic defined in this document or
Teachers Manual supplied. Xerox copies from relevant Text and Reference books are
supplied. The same should be made available to students for reference. Similarly, all
sections supplied in the form of notes (on CD) should be given to students in the hard
copy form.
2. Teachers are requested to go through all material on CD and suggested reference books
and make their own course notes that will be used for teaching in subsequent years.
3. Rather strict adherence to guidelines suggested will ensure uniformity in teaching.
4. Numericals are expected to be covered for following- Techno-commercial feasibility
study, MTTF calculations, Heat sink designs, Calculation of PCB parasitics,
Transmission line effects in high speed PCBs.