Professional Documents
Culture Documents
By
Mr. Ishita Sinha
Roll No –
Reg. No -
1
ACKNOWLEDGEMENT
I convey my sincere thanks to the Head of the department of Nano Science &
Technology Prof.S.Mukherjee for kindly assigning my M.Tech project work in the I.C
Centre. I am also thankful to the faculty members, technical and non technical staffs of
I am also grateful to Dr. U.Ganguly and Mr. Ashok Mondal for their immense
help during the experiment. My sincere thanks also goes to Mrs.Chirasree Pramanick
Research Advisor I.C Design & Fabrication Centre, Jadavpur University, Kolkata, for
project work.
I would also like to pay my gratitude to Mrs. Joyita Das, Mr.Palash Basu,
Mr. Biplob Mondal, and my all my friends of IC Center, Department of electronics and
Last but certainly not the least, I would also pay my heartiest thanks to my
parents, my husband , my respected teachers and my friends and colleagues for their
2
CONTENTS
Chapter : 1 Introduction
References
2.2.1 Micromachining
References
3.2.1 Cleaning
3.2.2 Oxidation
3.2.3 Photolithography
3.2.4 Micromachining
3
3.3 Flowchart For Fabrication of Silicon MEMS
References
References
5.1 Summary
5.2 Conclusion
4
Chapte1: Introduction
Micro Electro Mechanical systems (MEMS) are integrated micro devices or systems
millimeters. These systems can sense, control and actuate on the micro scale and
build sensors and actuators on the same microscopic level with the processor chip.
Measured in microns, thermal sensors, pressure sensors, inertial sensors, flow and
valves, pumps, motors, can be batch produced together on the same chip with the
sensitivity while polysilicon MEMS suffer from lower piezosensitivity .To overcome
both these limitations, the idea of porous silicon based MEMS pressure sensor has
porous silicon nanostructure, the ease of its formation and control of its surface
5
Chapter 1: Introduction
Following the invention of bipolar transistor in 1947, a great deal of effort was put into
characterizing the properties of single crystal semiconductors .In 1954, smith reported
sensors.
Silicon strain gauge, metal diaphragm sensors were first introduced commercially in
diaphragm. For thin diaphragms and small deflections, the resistance change is linear
with applied pressure[7]. In these early sensors high-cost, low-volume biomedical and
started with metal diaphragm sensors with bonded silicon strain gauges. The strain
gauges were bonded by epoxies, phenolics, or eutectics [8]. These first designs had
6
Chapter 1: Introduction
low yield and poor stability due to such factors as thermal mismatch with the metal–
epoxy–silicon interface[9].
Metal diaphragms were quickly superseded by single crystal diaphragms with diffused
piezoresistors. These new types of sensor had many advantages related to the
and creep associated with metal diaphragms were eliminated. At low temperatures
(<500° C), silicon is perfectly elastic and will not plastically deform [9], but instead will
increase over common metal alloys . Also, the ultimate tensile strength of silicon can
be three times higher than that of stainless steel wire [10]. As a piezoresistive material,
silicon has gauge factors that are over an order of magnitude higher than those of
Some of the first silicon diaphragms were created by mechanical milling spark
machining followed by wet chemical isotropic etching, to create a cup shape. These
C). While this technique of fabrication had the advantages of increased sensitivity and
reduced size, cost was still high, and diaphragms were created one at a time, rather
7
Chapter 1: Introduction
In 1960 the invention of the planar batch-fabrication process tremendously improved
the reliability and cost of semiconductor devices. In addition, the planar process
allowed for the integration of multiple semiconductor devices onto a single piece of
silicon (i.e., monolithic integration)[2]. This invention heralded the beginning of the IC
industry. Although the early planar process produced relatively large devices (>mm), it
number of devices. Micromachined pressure sensors were available in 1963 [7] and
available today.
By the late 1960s and early 1970s, three key technologies were being developed:
anisotropic chemical etching of silicon , ion implantation, and anodic bonding [13,2].
Ion implantation was used to place strain gauges in single-crystal silicon diaphragms.
Ion implantation is generally better than diffusion for doping because both the doping
concentration and doping uniformity are more tightly controlled. Anisotropic etching
(i) diaphragm sizes and locations were now well controlled by IC photolithography
techniques;
(iii) anisotropic etching was well suited to batch fabrication, allowing hundreds of
Anodic bonding, which uses voltages (500–1500 V) and heat (400–600 C), was used
to bond finished silicon diaphragm wafers to Pyrex glass supports[19]. Several types
8
Chapter 1: Introduction
Anisotropic etching and anodic bonding are batch techniques, and hence hundreds (or
Novasensor) that produced parts for the automotive industry. The microsensor
landmark article . It has high strength, high stiffness, high mechanical repeatability,
in large quantities with high purity and low defect densities[10].Piezoresistive gauge
factors in silicon are higher than in metal, but temperature coefficients of resistance
(TCRs) are high. Because of high TCRs, silicon microsensors often require
In 1984 Howe and Muller at the University of California, Berkeley (UCB) developed the
integrated circuits [15]. This technology has served as the basis for many MEMS
products[1].
9
Chapter 1: Introduction
The direct bonding method was first reported in 1985[23]. This method was first used
diaphragms. These sensors decrease required die size and may simplify integration
with electronics, but at the cost of reduced sensitivity and reproducibility of mechanical
properties[16,21].
applications (too many to mention individually) has greatly expanded the sphere of
So this period is often called the micromachining period [2], since diaphragm
dimensions are shrinking to hundreds of micrometres and minimum feature sizes are
being improved[2].
polysilicon process so that large structures could be assembled out of the plane of the
10
Chapter 1: Introduction
During the last decade the interest of researchers to silicon, which was considered
before as quite well-known material, has grown enormously. The triggering point was
the paper by Dr Leigh Canham (Defence Research and Evaluation Agency, UK) who
by a treatment of Silicon wafers in hydrofluoric acid solutions was known since the
fifties due to the works by Uhrlir, Turner , Memming and Schwandt [17]. The material
impurities, sacrificial layers, etc.) but never in relation with optical applications. Energy
gap of silicon (1.1 eV) corresponds to the infrared region and is indirect that makes
sensation (although the first publication on the visible light emission from porous
silicon was made in 1984 by Pickering et al. pose of building Si-based Light-Emitting
Devices (LEDs). In 1990, Canham [18] reported that if porous silicon is further etched
in HF for hours after preparation, it emits bright red light when illuminated with blue or
UV light. Efforts of scientific community undertaken during the years 1991 to 1996
brought many useful results about the aspects of PS formation and its physical and
chemical properties(19).
11
Chapter 1: Introduction
The latest piezoresistive pressure sensors are up to ten times more sensitive than
old transducers and with response times as rapid as a millisecond. These sensors are
sensors have been identified and silicon thin-diaphragm piezoresistive sensors are
responsible for many of these system needs. These sensors are used in vehicles to
control the ignition and the composition of the petrol mixture, in audio systems
to compensate for loudspeaker resonance and in medical for dialysis, middle ear
diagnosis, and disposable blood pressure meters[25]. But these sensors also show
based temperature sensor is often integrated with the silicon pressure sensor for
commercial applications[24].
12
Chapter 1: Introduction
References
[6] Anisotropic etching of silicon IEEE Trans. Bean K E 1978 Electron Devices
ED-25 1185–93
13
Chapter 1: Introduction
[17] Electrode design and planar uniformity of anodically etched large area
porous silicon S M Hossain, J Das, S Chakraborty, S K Dutta and H Saha
[21] Fabrication techniques for integrated sensor Guckel H and Burns D W 1986
microstructures Tech. Digest IEEE Int. pp 122–5
14
Chapter 1: Introduction
[26] A Silicon Piezoresistive Pressure Sensor Ranjit Singh, Low Lee Ngo,Ho Soon
Seng, Frederick Neo Chwee Mok
15
Chapter 2: Overview of Silicon Micromachining
2.1 Introduction
piezoresistive sensors, the resistivity and the geometrical dimensions of the sensor
capacitive sensors, on application of stress the deflection of the diaphragm affects the
distance between the metal plates of a parallel plate capacitor, which in turn changes
2.2.1 Micromachining
Development of silicon microsensors often required the fabrication of
areas of the silicon substrate away selectively to leave behind the desired geometries.
microprocessors.
The following properties of silicon have made micro machining feasible [1]:
(a) Silicon can be readily oxidized by exposing it to steam or dry oxygen. It allows
16
Chapter 2: Overview of Silicon Micromachining
(b) Single crystal silicon is brittle and can be cleaved like diamond but it is harder
than most metals. It is resistant to mechanical stresses and the elastic limit of
(c) A single crystal silicon can withstand repeated cycles of compressive and
tensile stresses.
(d) The crystal orientation of single crystal silicon wafer decides the rate of chemical
Bulk micromachining and surface micromachining are the two distinctly different
Isotropic and anisotropic etching of silicon has been used for realizing micro
mechanical parts from bulk silicon wafer and forms the basis of “bulk
machining”, the silicon substrate is primarily used as a mechanical support upon which
the micro mechanical elements are fabricated. The bulk of the silicon wafer itself is not
etched in surface micro machining. There are no holes through the wafer and no
cavities on the backside. When bulk micro machining silicon, the backside of the wafer
windows are opened where the micro mechanical structures are to emerge. An
proper position with respect to the photolithographic patterns at the front. In surface
17
micro machining a sacrificial layer is deposited on the silicon substrate, which may be
coated first with an isolation layer. Windows are opened in the sacrificial layer and the
micro structural thin film is deposited and etched. Selective etching of the sacrificial
There are two main methods of etching – wet etching and dry etching. Wet etching is
done with the use of chemicals. A batch of wafers is dipped into a highly concentrated
pool of acid and the exposed areas of the wafer are etched away. Dry etching refers to
any of the methods of etching that use gas instead of chemical etchants. Bulk
micromaching of silicon uses wet and dry etching techniques in conjunction with etch
masks and etch stops to sculpt micromechanical devices from silicon substrate. The
selective etching of silicon can be carried by using isotropic and anisotropic etchant.
The isotropic etchant under-etch large area in lateral direction than the area defined
by mask opening. On the other hand, anisotropic etchant, which are also known as
rates in different directions in the crystal lattice. They can form well-defined shapes
technique is the anisotropic etching of crystalline silicon, where etch rate is a function
groove structures for example, useful for the passive alignment of optoelectronic
18
devices are easily fabricated using an anisotropic etchant like KOH or
tetramethylammonium hydroxide[4].
nada good surface finish. Mostly used technology for bulk structuring for microsensors
and actuators is the anisotropic etching with KOH. Specifications for the etched
structures (such as high etch rate ratios of <110> and <100> to <111> planes, short
etch times and minimum roughness) can be obtained by optimization of the etch
Anisotropic etchants of silicon such as EDP, KOH and hydrazine are orientation
dependent. This means that they etch the different crystal orientations with different
etch rates. Anisotropic etchants of silicon etch the <100> and <110> crystal planes
significantly faster than the <111> crystal planes. The etch rate for <110> surfaces lies
between those for <100> and <111> surfaces. Figure 1 demonstrates the basic
For example for a <100>-silicon substrate etching proceeds along the <100> planes
while it is practically stopped along <11> planes. Since the <111> planes make a
54.75Ο angle with the <100> planes, the slanted walls (Fig.1.1) result. Due to the
slanted <111> planes, the size of the etch mask opening determines the final etch
result. If the etch masks openings are rectangular or square and the sides are aligned
with the <110> direction, no undercutting of the etch mask feature takes place[3].
19
Wb = Wo – 2 t cot(54.75Ο ) (1)
where Wo is the width of the etch mask window on the wafer back surface, and t is the
etched depth. If <110> oriented silicon is etched in KOH water etchant, essentially
straight walled grooves with sides of <111> planes can be formed. The anisotropic
etch rate in the <100> direction of monocrystalline silicon of <100> oriented wafers
conditions are anisotropic direction selectivity, speed and surface roughness of the
pattern. In isotropic etching all orientations or planes etch at the same rate, hence a
square hole would get rounded corners. In anisotropic etching, because of the
differences in rates [5], some planes grow while others disappear. There are two main
classifications that describe how the initial mask shape will evolve into the final etched
shape. Firstly, etched shapes may be classified as either pegs or holes. Holes are
lower than the surface of the wafer and pegs are higher than the wafer, Holes enlarge
After long times, holes are dominated by slow planes, while pegs become dominated
by fast planes. Secondly, within a shape (be it a peg or a hole) there can be two
corners: convex (peg like) and concave (hole like). While etching convex corners, fast
planes dominate: fast planes increase in length while slow planes decrease in length.
20
Chapter 2: Overview of Silicon Micromachining
21
Chapter 2: Overview of Silicon Micromachining
b) Etch rate
c) Anisotropic etch rate ratio (only for anisotropic etchants, 1:1 to 400:1 for
<100>/<111> planes
d) Dopant dependence/selectivity
Direction dependency
The most important feature in classifying silicon etchants is their ability to have
different etch rates in different directions of the crystal lattice that is exposed to them.
Isotropic etchants etch in all directions with the same etch rate, resulting in rather
rounded shaped pits and also previous sharp edges and corners. The result of
the crystal planes. This makes it possible to fabricate sharply formed structures or
narrow gaps, whose borders have to coincide with the crystal planes. Depending on
Etch rate
Basically the etch rate can vary with temperature, mix of ingredients, sometimes
optical circumstances (light intensity), or it can be stable over a wide range [9].
22
If an anisotropic etchant is chosen, the ratio of etch rates concerning the different
crystal planes, can vary in a wide range. Again, the desired result influences the
choice of etchant, since ratios from 1:1 to 400:1 are possible, if one compare the
Another very important attribute is the dopant dependency of etchants. Some etchants
are very selective on the material that they are exposed to, so that a doped layer or a
layer of different material can be used as etch stop or a direction of a much higher
etchant[10].
Etching temperature
In general lower temperatures are better than higher ones, since temperature induced
The etching process carried out in this project is by using EDP which has following
properties :-
a) It is anisotropic.
b) It is highly selective.
23
Chapter 2: Overview of Silicon Micromachining
Other than EDP , the following etchants can be used for micro machining :
The main advantage of KOH is [4-7], that it is orientation dependent with much higher
<110>: <111> etch rate ratio than EDP, therefore useful for groove etching on <110>
wafer.
HNA
The HNA system is highly variable in its etching rates and characteristics depending
on
b) Mix ratios
A major disadvantage is that SiO2 is etched somewhat for all mixtures, so that it can
only be used for short etching times, otherwise, Si3N4 can be used instead.
TMAH
gaining considerable use in silicon micromachining due to its excellent silicon etch
rate, etch selectivity to masking layers, degree of anisotropy, and relatively low toxicity.
24
Chapter 2: Overview of Silicon Micromachining
Figure – 2(a)
25
Chapter 2: Overview of Silicon Micromachining
Figure – 2(b)
26
Chapter 2: Overview of Silicon Micromachining
References
[5] A Novel Convex Corner Compensation for Wet Anisotropic Etching on (100)
Silicon Wafer Huai-Yuan Chu and Weileun
[8] A new theory for the anisotropic etching of silicon and some underdeveloped
chemical micromachining concepts”, D.L.Kendall, Journal of Vacuum
Science Technology A, 8(4), pp. 3598-3604 (1990).
27
Chapter 3 : Fabrication
Of The Sensor
3.1 Introduction :
the average resistivity of the wafer. We placed the wafer at 5 different positions (a)
Lower part (b) Upper part (c) middle part (d) Right part & (e) Left part of the wafer and
measured the resistivity by passing a known value of current (µA) & noting down the
this method, we warmed one terminal of the probe and placed the terminals on the
wafer. If the wafer is of P- type, then a negative voltage will be displayed in the meter
and if the wafer is of N -type then a positive voltage will be displayed in the meter. In
our case the reading in the meter was negative. Hence we came to conclusion that the
wafer is of P type.
28
Chapter 3 : Fabrication
Of The Sensor
3.2.1 Cleaning
Step1: Sample + Acetone. Then boil for 3min. And then treat in Ultrasonic cleaner for
Step3: (1:1) conc. H2SO4 + H202. Wait till the completion of reaction. Then clean in DI-
Step4: Dip in 10% HF solution. Then clean in DI-water to remove the oxide of the
sample.
Step5: Treat the sample with Std. Cleaning-1 [H20 (5):H202(1):NH40H(1)] at a temp- of
70°C for 10min. And then pass through cold water to remove the residual organic
material.
Step6: Treat the sample with Std. Cleaning-2 [H2O (6): H2O2(1):HCI(1)} at 700C for
10min. Then pass through DI-water to remove the residual organic material and dry
with N2.
29
Chapter 3 : Fabrication Of The Sensor
3.2 .2 Oxidation
wafers is used for: (i) passivation of the silicon surface (i.e., the formation of a
chemically and electronically stable surface), (ii) masking of diffusion and ion
implantation, (iii) dielectric films, and (iv) an interface layer between the substrate and
other materials, such as in chemical and biosensors. Silicon, when exposed to the air
at room temperature, will grow a native oxide (about 20 A thick). Thicker oxides can be
temperature, the relationship between the thickness of oxide and time is parabolic.
The rate of growth is also affected by the partial pressure of the oxygen atmosphere
The ability to grow a chemically stable protective layer of silicon dioxide SiO 2 on a
silicon wafer makes silicon the most widely used semiconductor substrate. The silicon
dioxide layer is both an insulating layer on the silicon surface and a preferential
plasma A silicon dioxide layer is grown in an atmosphere containing either oxygen (O2)
The following chemical reactions describe the thermal oxidation of silicon in oxygen or
water vapour:
30
Si(solid) + 2H20(gas) →SiO2(solid) + 2H2(gas)
The silicon - silicon dioxide interface interface moves into the silicon during the
oxidation process. This creates a fresh interface region, with surface contamination on
the original silicon ending up on the oxide surface. The system used for Oxidation
comprises of:
<a> Gas flow system consists of a nitrogen and oxygen cylinder at the back with the
controls at the front to control the flow (Iit/min) of the gases. Then we have the bubbler
<b> The Furnace consists of a quartz furnace separated from the body by quartz
wool. The furnace also consists of a PID controller with 3-zone digital temperature
31
Chapter 3 : Fabrication Of The Sensor
The Working:
Step1: The clean silicon wafer is mounted on a quartz stack with two butters.
Step2: The temperature of the furnace is set at 1000°C at all the 3 zones.
Step3: The Nitrogen cylinder is opened at 2Kg/cm3 and the flow is adjusted at 2lit/min
Step4: Then oxygen cylinder is opened at 2Kg/cm3 along with Nitrogen for 2min.
Step5: Now Nitrogen flow is stopped and oxygen at 1litlmin. is made to flow through
Step7: Now Oxygen is made to flow through the bubbler with temperature at 93°C and
Step9: The oxidized wafer is brought out from the furnace and the color is observed to
find the thickness. Also the wafer is observed under the microscope.
32
Chapter 3 : Fabrication Of The Sensor
3.2.3 Photolithography
Figure – 3
33
Chapter 3 : Fabrication Of The Sensor
patterns. These regions include a variety of implants and windows in protective cover
layers through which connections can be made to the bonding pads. A sequence of
steps is required, together with a specific layout pattern, for each of these regions
lithographic processes are used to perform these operations and are carried out in
transferring the pattern on the mask to a layer of radiation sensitive material (resist)
which, in turn, is used to transfer the pattern to the films or substrates through etching
I processes. The radiation used may be optical, X-ray, electron beam (e-beam), or ion
<2> Transfer of the pattern to the wafer. In Photolithography, a film of the photo resist
is first applied to the substrate. Radiation is shone through a transparent musk plate,
on which has been imprinted a copy of desired pattern in an opaque material. The
and shadow corresponding to the image on the mask plate. In those regions where
light was transmitted through the plate, the resist solubility is altered by a
termed exposure. Following exposure, the substrate is washed with a solvent that
34
Chapter 3 : Fabrication Of The Sensor
preferentially removes the resist areas of higher solubility. This step is called
development. Depending on the type of the resist, the washed-away may be either the
illuminated or shadowed regions of the coating. A resist that loses solubility when
illuminated form a negative image of the plate and is called a negative resist. If
exposure increases resist solubility resist is washed away in the areas corresponding
to the transparent zones of the mask plate. The resist image is identical to the opaque
image on the plate, and the pattern is a photographic positive. Therefore, the resist is
called positive resist. After development, the substrate bearing the patterned resist, is
unprotected by the resist while the covered areas remain unetched. Finally, the resist
coating is removed and discarded, leaving a duplicate of the mask plate pattern
35
Chapter 3 : Fabrication Of The Sensor
The Working:
Step1: The cleaned wafer is put on the top of the spinner hold by vacuum.
Step2: The negative photo resist is spread on the center of the wafer and the spinner
Step3: The wafer is put inside the furnace for pre-bake at a temperature of 90°C for
20min.
Step4: The wafer is then put inside the furnace at 120°C for 20min.We used special
Step5: The wafer is then put under the microscope and the vacuum pump is put in the
Step6: The wafer is then loaded and the lid is closed and properly aligned by watching
Step7: The U-V source is then put in proper place and the wafer is then exposed for 5
Step8: The film over the wafer is then developed and rinsed in Acetone to remove
photo resist.
36
Chapter 3 : Fabrication Of The Sensor
3.2.4 Micromachining
Take a solution of 18gm by weight pyrocatachol, 102cc by volume ethylene diamine,
insert the sample in the solution. The etching rate is observed as 80-90 micron/hour at
37
Chapter 3 : Fabrication
Of The Sensor
38
Chapter 3 : Fabrication Of The Sensor
3.2.5 Porous Silicon Formation
tree-like structure , the pores ranging from < 2nm to a few microns.
Porous silicon is currently gaining interest in silicon microsystem technology for its
multifarious application in sensing and photonic devices .The extremely large surface
to volume ratio ( 500 m2 cm-3) of the porous silicon nanostructures, the ease of its
formation and control of the surface morphology through variation of the formation
development of smart systems-on chip sensors have made it a very attractive sensing
material. Porous silicon is a three phase mixture of silicon, oxide and voids. The
elastic properties of porous silicon which are drastically different from those of bulk
silicon are responsible for the peculiar characteristics of the porous silicon layers: its
There are different techniques for preparation of porous silicon. Two methods have
mainly been applied for the preparation of PS: (i) anodic etching in HF and (ii)
prepared by anodic etching. In some cases, stain etching has been used subsequent
39
to PS formation by anodic etching in order to increase the porosity of the PS layers.
Many of the physical properties e.g. electrical and optical properties of porous silicon
differ significantly from those of crystalline silicon and these are closely related to the
formation current density, HF concentration, c-Si surface morphology, doping type and
During pore formation ,two hydrogen atoms evolve for each silicon atom dissolved.
40
Figure – 5
Porosity = Volumetric fraction of pores with respect to total volume of porous silicon.
41
Chapter 3 : Fabrication Of The Sensor
42
Figure 6 : FESEM of the nanoporous silicon surface
43
Conventional process
CONVENTIONAL PROCESS
44
LATERAL CONTACT CONFIGURATION
45
Integrated Pressure and Temperature Sensor
46
References :
47
Chapter 4 : Design And Simulation Of MEMS Pressure And Temperature Sensor
often integrated with the silicon pressure sensor for commercial applications [1]. There
are also recent reports on the development of an integrated pressure and temperature
Integrated pressure and temperature sensors based on silicon and polysilicon have
also been reported [3]. However, the existing limitation of such a sensor is low-
sensitivity paved the way to increased nonlinearity along with the requirement of
complex fabrication steps [4]. The increasing urge towards improving the performance
piezoresistive coefficient [5].This fact has motivated the use of porous silicon, which is
48
Chapter 4 : Design And Simulation Of MEMS Pressure And Temperature Sensor
[4]. The pressure sensing characteristics of the porous silicon–silicon structure have
been recently reported [6].In such reports, the structure of the porous silicon–silicon
structure is that it can be used for temperature sensing also since the reverse
temperature [7].
conductivity of the porous silicon layer caused by the deformation in the quantized
deformation leads to a redistribution of the carriers within the different energy bands,
been found to possess temperature sensitivity similar to that of a p–n junction and
can be used as a temperature sensor. It has been observed that in reverse biased
change than in the forward biased mode. This is because under the reverse bias,
injection of minority carrier electrons from crystalline silicon substrate into porous
49
Chapter 4 : Design And Simulation Of MEMS Pressure And Temperature Sensor
silicon takes place. The injection increases considerably with increasing temperature
and subsequently the resistance of the porous silicon layer decreases significantly. In
the forward biased condition, the current through the heterojunction results primarily
from the electron injection from the aluminum electrode rather than hole flow from the
between the two sensors such that both the sensors attain a temperature within a
small tolerance of say±0.3% and also avoid the cross-coupling effect. For our
structure of the pressure and temperature sensor, when the ambient temperature rises
to a particular value, the surface of the sensor chip gets heated and a temperature
gradient is developed along the lateral direction. This temperature gradient is primarily
due to the conduction heat losses laterally through silicon and the convection losses
from the edges. The boundary conditions in our case are that there is almost no
temperature gradient just at the center and the conducting heat flux towards the edges
equivalent electrical model diagram of the integrated sensor system as shown in figure
8 has been proposed. It is observed from that the resistance between the two sensors
should be large compared to the sensor resistance to avoid any cross coupling.
50
Chapter 4 : Design And Simulation Of MEMS Pressure And Temperature Sensor
.
Figure 8 : Equivalent Model of the Sensor
In the above figure, Rps and Rpst represent the resistance of the porous silicon layer
of the pressure and temperature sensors respectively, Rsi and Rsit represent the
resistance of the underlying silicon layer in the pressure and temperature sensors,
From figure 8, it is observed that to avoid cross coupling and maintain a 0.3% variation
51
Chapter 4 : Design And Simulation Of MEMS Pressure And Temperature Sensor
where Lps, Lpst, Wps and Wpst are the length of the porous silicon layer and contact
width of the pressure and temperature sensors, respectively, tps, tpst, tsi and tsit
represent the thickness of the porous silicon layer and silicon layer in the pressure and
temperature sensors, respectively, ñps, ñps, ñsi and ñsit represent the resistivities of
the porous silicon layer and silicon layer in the pressure and temperature sensors,
respectively.
Porosity for the temperature sensor is also 55% to minimize the fabrication steps. The
for a faster thermal response. The area of the temperature sensor is chosen to be 500
µm × 500 µm and the area of the temperature sensor is 600 µm × 600 µm. The total
52
Chapter 4 : Design And Simulation Of MEMS Pressure And Temperature Sensor
fabricated by etching away the bulk silicon on a defined region until a required
membrane typically close to the edges. The diaphragm acts like a mechanical
stress amplifier. The silicon is not only used as a substrate for the diffused resistors
When a pressure difference is applied across the device, the thin diaphragm will
measured.
53
Chapter 4 : Design And Simulation Of MEMS Pressure And Temperature Sensor
configuration. Two resistors are oriented so that they can sense stress in the
direction of their current axes and two are placed to sense stress perpendicular
to their current flow. Therefore, resistance change of the first two piezoresistors
will always be opposite to that of the other two. This is achieved by placing two
piezoresistors parallel to opposite edges of the diaphragm and the other two
perpendicular to the other two edges. When the is diaphragm bent downwards,
causing the tensile stress on the diaphragm surface at the edges, the parallel
resistors are under lateral stress and show a decrease in resistance while the
resistance. If the resistors are correctly positioned with respect to the stress field
over the diaphragm, the absolute value of the four resistors changes can be made
equal.
The sensor has been designed and simulated using MEMSPRO and ANSYS software
tools.
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Chapter 4 : Design And Simulation Of MEMS Pressure And Temperature Sensor
Dimension of piezoresistors = 20 μm × 75 μm × 2 μm
a = 2500 µm
u = 50 µm
x = 75 µm
t = 50 µm
55
Chapter 4 : Design And Simulation Of MEMS Pressure And Temperature Sensor
The design and simulation of the sensor is done by MEMSPRO and ANSYS 10.0
software. Initially the area of the pressure sensor was chosen as 900 µm × 900 µm
and the distance between the temperature and pressure sensor was taken as 100 µm
sensor chip that when the pressure sensor is thermally heated to a temperature of
say 350˙C due to ambient temperature, then due to conduction of heat through the
the graph. But the position of the temperature sensor has to be optimized so that it
per the simulation results of the temperature distribution of the sensor , it is placed at a
distance of 50 µm from the pressure sensor then it can sense a temperature of 345˙C
as shown in figure.
56
Chapter 4 : Design And Simulation Of MEMS Pressure And Temperature Sensor
Figure 13 : Top view of the nanocrystalline porous silicon based integrated MEMS
pressure and temperature sensor as designed by MEMSPRO
Figure 14 : Back side of the nanocrystalline porous silicon based integrated MEMS
pressure and temperature sensor as designed by MEMSPRO
57
Chapter 4 : Design And Simulation Of MEMS Pressure And Temperature Sensor
Figure 15 : Temperature distribution on the sensor, distance between the pressure
and temperature sensor is 100 μm.
Figure 16 : Temperature distribution graph, when the distance between the pressure
and temperature sensor is 100 μm.
58
Chapter 4 : Design And Simulation Of MEMS Pressure And Temperature Sensor
Figure 17 : Stress distribution on the sensor chip on applied pressure on the membrane
59
Chapter 4 : Design And Simulation Of MEMS Pressure And Temperature Sensor
Figure 19 : Stress distribution on the sensor chip on applied pressure on the membrane
Distance between the temperature and pressure sensor is 50 μm.
60
Chapter 4 : Design And Simulation Of MEMS Pressure And Temperature Sensor
61
Chapter 4 : Design And Simulation Of MEMS Pressure And Temperature Sensor
62
Chapter 4 : Design And Simulation Of MEMS Pressure And Temperature Sensor
63
Chapter 4 : Design And Simulation Of MEMS Pressure And Temperature Sensor
Figure 26 : y-component of stress (σt) along the two sides of the piezoresistors, which
are perpendicular to the edges.
64
Chapter 4 : Design And Simulation Of MEMS Pressure And Temperature Sensor
The variation of the stress along the other two piezoresistors (i.e., the one
parallel to the edges) were found to be equal but opposite to the ones shown in
Figure-24. Using the values of x-component of stress and the y-component of stress,
piezoresistors below:
∆R π44 (σl – σt )
R 2
The Wheatstone bridge configuration converts the resistance change directly to
bridge with assumed identical (but opposite in sign) resistance change, ∆R, in
∆V ∆R Vbias
R
where R is the zero-stress resistance and Vbias, the bridge supply voltage. The
pressure sensitivity (S) is then defined as the relative change of output voltage per unit
S= ∆V1 ∆R 1
∆ P Vbias ∆P R
Note that stress is maximum at the at the edges and minimum at the centre of
the diaphragm. The stress at the edges is maximum because the edges are
65
Chapter 4 : Design And Simulation Of MEMS Pressure And Temperature Sensor
66
Chapter 4 : Design And Simulation Of MEMS Pressure And Temperature Sensor
67
Chapter 4 : Design And Simulation Of MEMS Pressure And Temperature Sensor
References
[2] A suspended microchannel with integrated temperature sensor for high pressure
Flow studies Wu S, Mai J, Zohar Y, Tai Y C and Ho C M 1997–1998
[4] Single crystal silicon piezoresistive nanowire bridge Toriyama T and Sugiyama
S 2003 Sensors Actuators A 108 244–9
[6] Design, fabrication, testing and simulation of porous silicon based smart
MEMS pressure sensor Pramanik C, Islam T, Saha H, Bhattacharya J,
Banerjee S and Dey S 2005 18th Int. Conf. on VLSI Design
[10] A Silicon Piezoresistive Pressure Sensor Ranjit Singh, Low Lee Ngo,Ho Soon
Seng, Frederick Neo Chwee Mok
68
Chapter 5 : Summary and Conclusion
5.1 Summary :
Piezoresistive pressure sensors have wide applicability in various systems including
the problem of sensitivity and nonlinearity, ribbed and bossed structured diaphragms
have been used in piezoresitive pressure sensors. Capacitive type pressure sensors
have also substituted piezoresistive type sensors in some vacuum applications. But
both the above techniques require complex fabrication steps. A simpler solution would
observed to possess one and a half times greater piezoresistive coefficient and three
been done with a view to minimize the temperature difference between the pressure
and temperature sensors and also avoid the cross-coupling effect. The design of the
pressure sensor has been done for typical specifications of low-pressure applications.
An added advantage of the integrated pressure and temperature sensor is that the
optimum porosity is obtained to be around 55% for both the presssure and
69
Chapter 5 : Summary and Conclusion
Various methods to improve the sensitivity paved the way to increased nonlinearity
along with the requirement of complex fabrication steps .The increasing urge towards
cost and complexity of fabrication has stimulated the use of nanocrsytalline silicon,
5.2 Conclusion :
Through simulation by ANSYS 10.0 we have found that the temperature sensor must
maximum temperature of the ambient and also to avoid cross-coupling effect. Hence,
the distance between the temperature and pressure sensor is optimized to show good
sensitivity results.
For the piezoresistive nanoporous pressure sensor the effect of pressure have been
studied for the particular design of the sensor. The simulation results shows the x and
y components of stress which calculates the sensitivity of the sensor with applied
voltage.
Based on these simulation results we can fabricate the sensor and hence obtain
optimized results.
70
Appendices
Calculations :
Simulation Results :-
Current density of the piezoresistor before application of
pressure
= 0.628 × 10 8
pA / (μm)2
Cross-sectional area of the piezoresistor = 40 (μm)2
Hence, current flow in the piezoresistor = 0.628 × 108 × 40 =
25.12 × 108 pA
71
= 25.12 × 10-4 A =
2.512 × 10-3 A
On application of pressure , current density of the
piezoresistor
= 0.596 × 10 8 pA
/ (μm)2
Hence, current flow in the piezoresistor = 0.596 × 108 × 40 =
23.84 × 108 pA
= 23.84 × 10-4 A =
2.384 × 10-3 A
Appendices
72
= 6.666 × 103 A / m2 = 6666 pA /
(μm)2
Simulation Results :-
Current density of the piezoresistor before application of
pressure
= 6284 pA /
(μm)2
Cross-sectional area of the piezoresistor = 40 (μm)2
Hence, current flow in the piezoresistor = 6284 × 40 = 251360
pA
= 251360 × 10 -12 A =
2.512 × 10-7 A
Appendices
73
Start > ansys 10.0
2) output window.
Aim is to:
1. Apply a constant voltage to the piezoresistors and plot current density distribution.
•Select [Add …]
•Select “Coupled Field” (on left), and “Scalar Tet 98” (on right), then [OK]
•Select [Options …]
•Select [Close]
–Main Menu > Preprocessor > Material Props > Material Models
Appendices
74
Main menu > preprocessor> Modelling > Create > volumes> block > by dimension.
Now that the appropriate pieces of the model are defined (volumes),you need to
add/subtract them together so that the model becomes one continuous piece.
Main menu > preprocessor >Modeling > Operate > Boolean >sub volumes/Add
volumes.
Main menu > preprocessor >Modeling > Operate > Boolean>glue volumes.
4. Generate Mesh:
•Then [Close]
5. Define Load :
Main Menu > Preprocessor > Loads > Define Loads > Apply > Electric > boundary >
Appendices
75
•Pick proper area where to apply voltage, then [Apply]
Main Menu > General Postproc > Plot Results > vector Plot >predefined >current
Main Menu > General Postproc > Plot Results > Contour Plot > Nodal Solution
Select “DOF solution” (on left), and “Elec poten VOLT” (on right), then [OK]
piezoresistor
Select [Add …]
Select coupled source (on left), and “solid 226” (on right)
Click [Close]
76
Appendices
Main Menu > Preprocessor > Material Props > Material Models
4.
Generate Mesh
5. Apply load
Utility Menu > Select > Everything , –Utility Menu > Plot > Areas
areas
77
Appendices
Main Menu > Preprocessor > Loads > Define Loads > Apply > Structural > pressure >
on areas
Main Menu > Preprocessor > Loads > Define Loads > apply>boundary>voltage >on
areas
Main Menu > General Postproc > Plot Results > vectorplot>current density
78
Appendices
ANSYS
Same as above only replacing the material properties of silicon by porous silicon
MEMS sensor
1) Apply a constant temperature to the pressure sensor and study the temperature
distribution
Select [Add …]
Main Menu > Preprocessor > Material Props > Material Models
79
Material > close.
Main menu > preprocessor >Modeling > Operate > Boolean>glue volumes.
Appendices
4. Generate Mesh:
Then [Close]
5. Define Load :
Main Menu > Preprocessor > Loads > Define Loads > Apply >thermal>convection>
areas
80
Enter an applied temperature of 350 K on the picked area(membrane)
6. Solve
Main Menu > General Postproc > Plot Results > contour Plot >nodal temperature>OK
Appendices
following steps:
Select [Add …]
Select coupled source (on left), and “solid 226” (on right)
Click [Close]
Main Menu > Preprocessor > Material Props > Material Models
81
Choose piezoresistivity, piezoresistive stress matrix then OK
Main menu > preprocessor >Modeling > Operator > Boolean > glue > picked volumes
D)
Generate Mesh
Main Menu > Preprocessor > Meshing > Mesh attributes >picked volume
Then [Close]
Appendices
E) Apply load
Utility Menu > Select > Everything , –Utility Menu > Plot > Areas
on areas
Main Menu > Preprocessor > Loads > Define Loads > Apply > Structural >
82
G) Solve problem
H) Review results
Main Menu > General Postproc > Plot Results > contour plot>stress>von mises
stress>OK
83