HI-SINCERITY

MICROELECTRONICS CORP.

Spec. No. : HE6537

Issued Date : 1992.11.25
Revised Date : 2002.02.22
Page No. : 1/3

HSD965
NPN EPITAXIAL PLANAR TRANSISTOR

Description
The HSD965 is suited for use as AF output amplifier and flash unit.

Absolute Maximum Ratings

TO-92

Maximum Temperatures
Storage Temperature ............................................................................................ -55 ~ +150 C
Junction Temperature ...................................................................................... 150 C Maximum
Maximum Power Dissipation
Total Power Dissipation (Ta=25C) ................................................................................ 750 mW
Maximum Voltages and Currents (Ta=25C)
VCBO Collector to Base Voltage ......................................................................................... 40 V
VCEO Collector to Emitter Voltage ...................................................................................... 20 V
VEBO Emitter to Base Voltage .............................................................................................. 7 V
IC Collector Current (Continuous) ......................................................................................... 5 A
IC Collector Current (Peak PT=10mS) .................................................................................. 8 A

Characteristics (Ta=25C)
Symbol
BVCBO
BVCEO
BVEBO
ICBO
IEBO
*VCE(sat)
*hFE1
*hFE2
fT
Cob

Min.
40
20
7
230
150
-

Typ.
0.35
150
-

Max.
0.1
0.1
1
800
50

Unit
V
V
V
uA
uA
V

MHz
pF

Test Conditions
IC=100uA, IE=0
IC=1mA, IB=0
IE=10uA, IC=0
VCB=10V, IE=0
VEB=7V, IC=0
IC=3A, IB=100mA
VCE=2V, IC=0.5A
VCE=2V, IC=2A
VCE=6V, IE=50mA
VCB=20V, f=1MHz, IE=0
*Pulse Test: Pulse Width 380us, Duty Cycle2%

Classification Of hFE
Rank
Range

HSD965

Q
230-380

R
340-600

S
560-800

HSMC Product Specification

HI-SINCERITY

Spec. No. : HE6537

Issued Date : 1992.11.25
Revised Date : 2002.02.22
Page No. : 2/3

MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current

Saturation Voltage & Collector Current

1000

10000

Saturation Voltage (mV)

VCE(sat) @ IC=30IB
o

125 C

HFE

1000

25 C
o

75 C
100

100
o

75 C
o

25 C

125 C

hFE @ VCE=2V

10

10
10

100

1000

10000

10

100

Collector Current-IC (mA)

Capacitance & Reverse-Biased Voltage

10000

Cutoff Frequency & Collector Current

1000

100

Cutoff Frequency (MHz)...

Cob

Capacitance (pF)

1000

Collector Current-IC (mA)

100

10

VCE=6V

10

1
0.1

10

100

Reverse-Biased Voltage (V)

10

100

1000

Collector Current-IC (mA)

Safe Operating Area

Power Derating
800

10000

Power Dissipation-PD (mW)

Collector Current-IC (mA)

700
1000
PT=1ms
PT=100ms
PT=1s

100

10

600
500
400
300
200
100
0

1
1

10

Forward Biased Voltage-VCE (V)

HSD965

100

50

100

150

200

Ambient Temperature-Ta ( C)

HSMC Product Specification

HI-SINCERITY

Spec. No. : HE6537

Issued Date : 1992.11.25
Revised Date : 2002.02.22
Page No. : 3/3

MICROELECTRONICS CORP.
TO-92 Dimension
2

Marking:
H
SD
9 6 5

B
1

Rank

Date Code

Control Code

3
Style: Pin 1.Emitter 2.Collector 3.Base

H
I

E
F

3-Lead TO-92 Plastic Package

HSMC Package Code: A
*: Typical

Inches
Min.
Max.
0.1704 0.1902
0.1704 0.1902
0.5000
0.0142 0.0220
*0.0500
0.1323 0.1480

DIM
A
B
C
D
E
F

Millimeters
Min.
Max.
4.33
4.83
4.33
4.83
12.70
0.36
0.56
*1.27
3.36
3.76

DIM
G
H
I
1
2
3

Inches
Min.
Max.
0.0142 0.0220
*0.1000
*0.0500
*5
*2
*2

Millimeters
Min.
Max.
0.36
0.56
*2.54
*1.27
*5
*2
*2

Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.

Material:
Lead: 42 Alloy; solder plating
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0

Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

Head Office And Factory:

Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931

HSD965

HSMC Product Specification

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