HI-SINCERITY

MICROELECTRONICS CORP.

Spec. No. : HE6523

Issued Date : 1992.11.25
Revised Date : 2001.06.06
Page No. : 1/3

HSC1815
NPN EPITAXIAL PLANAR TRANSISTOR

Description
The HSC1815 is designed for use in driver stage of AF amplifier
general purpose amplification.

Absolute Maximum Ratings

Maximum Temperatures
Storage Temperature ............................................................................................ -55 ~ +150 C
Junction Temperature ................................................................................... +150 C Maximum
Maximum Power Dissipation
Total Power Dissipation (Ta=25C) ............................................................................... 400 mW
Maximum Voltages and Currents (Ta=25C)
VCBO Collector to Base Voltage ........................................................................................ 60 V
VCEO Collector to Emitter Voltage ..................................................................................... 50 V
VEBO Emitter to Base Voltage ............................................................................................. 5 V
IC Collector Current ....................................................................................................... 150 mA
IB Base Current ............................................................................................................... 50 mA

Characteristics (Ta=25C)
Symbol
BVCBO
BVCEO
BVEBO
ICBO
IEBO
*VCE(sat)
*VBE(sat)
*hFE1
*hFE2
fT
Cob

Min.
60
50
5
120
25
80
-

Typ.
-

Max.
100
100
250
1
700
3.5

Unit
V
V
V
nA
nA
mV
V

MHz
pF

Test Conditions
IC=100uA, IE=0
IC=1mA, IB=0
IE=10uA, IC=0
VCB=60V, IE=0
VEB=5V, IC=0
IC=100mA, IB=10mA
IC=100mA, IB=10mA
VCE=6V, IC=2mA
VCE=6V, IC=150mA
VCE=10V, IC=1mA, f=100MHz
VCB=10V, f=1MHz, IE=0

*Pulse Test : Pulse Width 380us, Duty Cycle2%

Classification of hFE1
Rank
Range

HSC1815

Y
120-240

GR
200-400

BL
350-700

HSMC Product Specification

HI-SINCERITY

Spec. No. : HE6523

Issued Date : 1992.11.25
Revised Date : 2001.06.06
Page No. : 2/3

MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current

Saturation Voltage & Collector Current

1000

Saturation Voltage (mV)

VBE(sat) @ IC=10IB
VCE=6V

hFE

100

10

0.1

VCE(sat) @ IC=10IB

0.01
0.01

0.1

10

100

1000

0.01

0.1

Collector Current (mA)

Capacitance & Reverse-Biased Voltage

100

1000

Cutoff Frequency & Collector Current

10

Cutoff Frequency (MHz)

Capacitance (pF)

1000

Cob

VCE=10V
100

10

1
0.1

10

100

10

Reverse-Biased Voltage (V)

100

Collector Current (mA)

Safe Operating Area

PD-Ta

10000

450

1000

PT=1ms

400

PT=100ms

350

Power Dissipation-PD(mW)

Collector Current-IC (mA)

10

Collector Current (mA)

PT=1s
100

10

300
250
200
150
100
50
0

1
1

10

Forward Voltage-VCE (V)

HSC1815

100

50

100

150

200

Ambient Temperature-Ta( C)

HSMC Product Specification

HI-SINCERITY

Spec. No. : HE6523

Issued Date : 1992.11.25
Revised Date : 2001.06.06
Page No. : 3/3

MICROELECTRONICS CORP.
TO-92 Dimension
2

Marking :
HSMC Logo

B
1 2

Product Series

Part Number

Date Code

Rank

Laser Mark
HSMC Logo
Product Series

D
Part Number

H
I

Ink Mark

Style : Pin 1.Emitter 2.Collector 3.Base

E
F

3-Lead TO-92 Plastic Package

HSMC Package Code : A
*:Typical

Inches
Min.
Max.
0.1704 0.1902
0.1704 0.1902
0.5000
0.0142 0.0220
*0.0500
0.1323 0.1480

DIM
A
B
C
D
E
F

Millimeters
Min.
Max.
4.33
4.83
4.33
4.83
12.70
0.36
0.56
*1.27
3.36
3.76

DIM
G
H
I
1
2
3

Inches
Min.
Max.
0.0142 0.0220
*0.1000
*0.0500
*5
*2
*2

Millimeters
Min.
Max.
0.36
0.56
*2.54
*1.27
*5
*2
*2

Notes : 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.

Material :
Lead : 42 Alloy ; solder plating
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0

Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

Head Office And Factory :

Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931

HSC1815

HSMC Product Specification

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