SMT5800 Libra 20SM A01 062707

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High Tech Computer, Corp.

. Doc. Title Libra Service Manual
Issued Date Revised Date Page
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Libra Service Manual
HTC Proprietary
Confidential Treatment Requested

Rev. A01
HTC Corp.
Engineering Mobility
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REVISION CONTROL TABLE REV AX01 A01 DATE 2007/4/27 2007/6/20 CONTENTS Fist Draft 1. Modify 3.2 OS update thru Micro-SD card DEPT PSE PSE REVISED Edwin_Chen Edwin_Chen STAGE PVT MV
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1. INTRODUCTION ....................................................................................................................................................................4 1.1 1.2 PRODUCT FEATURES .........................................................................................................................................................5 PRODUCT OVERVIEW .....................................................................................................................................................10
2. DEVICE DISSEMBLING AND ASSEMBLING PROCEDURE ......................................................................................14 2.1 2.2 DISASSEMBLING PROCEDURE ........................................................................................................................................14 ASSEMBLING PROCEDURE .............................................................................................................................................22
3. ROM RE-FLASH PROCEDURE ........................................................................................................................................30 3.1 3.2 ROM UPGRADE THRU RUU (RE-FLASH UPGRADE UTILITY) ........................................................................................30 ROM IMAGE UPGRADE THRU SD CARD..........................................................................................................................34
4. DIAGNOSTIC PROGRAM ..................................................................................................................................................35 4.1 LIST OF DIAGNOSTIC / WINCE TEST ITEMS ..................................................................................................................35
5. POWER MEASUREMENT TEST ......................................................................................................................................43 5.1 6.3 6.4 MAIN BOARD LEAKAGE CURRENT TEST PROCEDURE ...................................................................................................43 DISPLAY INSPECTION .....................................................................................................................................................48 MAIN UNIT INSPECTION ..................................................................................................................................................49
7. GENERIC TROUBLESHOOTING .....................................................................................................................................50 8. GENERIC LABELING PLAN..............................................................................................................................................54 9. GENERIC SPARE PART LIST AND PHOTOS................................................................................................................56 9.1 9.2 10. SPL FOR REPAIR ...........................................................................................................................................................56 BOARD LEVEL 2.5 REPAIRS ...........................................................................................................................................58
RF ANTENNA SPECIFICATION ...................................................................................................................................62
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1. Introduction
This manual provides the technical information to support the service activities of Libra. This document contains highly confidential information, so any or all of this document should not be revealed to any third party. Chapter 1: Introduction-This Chapter is about Products features and basic Product function. After reading this chapter, you will know what feature the product has and basic hardware operation. Also you will know how to perform soft-rest and hard-rest in this chapter. Chapter 2: Device Dissembling and Assembling Procedure- After reading this chapter, you will learn how to disassemble and assemble the product. Also, you will know what tools to use and the torque. Please follow the instruction to dissemble the unit to prevent from damaging the unit. Chapter 3: ROM Re-flash Procedure- After reading this chapter, you will learn how to perform the ROM image re-flesh by using RUU and SD-Card. Also you can find the steps of enter the boot loader mode. Chapter 4: DIAGNOSTIC PROGRAM- After reading this chapter, you will learn How to use the diagnostic program to perform unit function test How to test some functions in Windows Mobile mode (ex. WLAN, Bluetooth, and USB etc) Chapter 5: Power measurement test- After reading this chapter, you will learn how to use MB leakage test procedure and battery run-down test (Battery Capacity Measurement). Chapter 6: Cosmetic Inspection Criteria- After reading this chapter you will learn the appearance quality inspection criteria, ex. Display, bezel, and housing etc Chapter 7: Generic Troubleshooting- After reading this chapter, you will learn how to do generic trouble-shooting. Chapter 8: Generic Labeling Plan- In this chapter, you will find generic labels for reference, ex. Regulation label, and battery label etc Chapter 9: Generic Spare Part List and Photos- In this chapter, you will find Spar parts reference list and photos for repairing, including unit and Board level. Chapter 10: RF Antenna Specification- Reference Spec for RF test.
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1.1 Product Features

Platform
One stop sliding QWERTY keyboard with sliding sound effect, display-on while sliding to the end, and 2 LEDs for Cap and Function mode in qwerty OS: Microsoft Windows Mobile 6 Standard
Dimension
103.5 mm(L) x 51 mm(W) x 19.2 mm(T) 120g with battery pack
Processor
Qualcomm MSM7500
Memory
ROM:128 MB(for programs ad users storage) RAM: 64 MB DDR
LCD Module
2.4 QVGA, 262K colors Transmissive LCD with white LED back light
CDMA Function
Dual band 800 (including KDDI bands), 1900 MHz KDDI bands Receive Band 843846860870 Transmit Band898901915925 Others: Receive Band 869~8941930~1990 Transmit Band824~8491850~1910 Interanl antenna Antenna diversity CDMA2000 1xEVDO/ 1xRTT and IS-95A/B voice or data Slotted mode page channel searching 800 Hz fast forward power control 13 kbps QCELP and 8 kbps EVRC vocoder Convolution and Turbo encoding/decoding support SMS (MO, MT) Supplementary Services Caller ID
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Call forwarding Call Waiting Conference call-3-way call
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TTY/TDD support R-UIM connection reserved Internal GPS antenna
Keyboard/Button/Switch
Power button ( left top, side) Quick press : to launch Quick List Long press: to do Power On/Off Quick press : Start a phone call Long press (Press & Hold):Switch on or off the Loud Speaker Long press : to do keylock Slide down & long press
Send phone button
End phone button Volume UP/Down sliding button One numerical dialing pad ( 12 buttons) Qwerty keyboard with 2 additional soft keys 2 soft Key Home Key Back Key Camera capture button One 5 way navigator
Notification
One bi-color LED (Green & Red) for CDMA standby, CDMA network status, Event Notification, Power Charging status, and Low battery- top location One bi-color LED (Blue & Amber) for Bluetooth (Blue) and GPS (Amber) connectivity status download location Vibration for notification Notification by LED, Sound, Message, Vibration
Audio
Built-in Microphone Receiver Speaker
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Loud speaker for Hands-Free supported Full duplex Audio sampling rate 16 bits with 8KHz, 11KHZ, 22KHZ, 44.1KHz AMR/AAC/WAV/WMA/MP3 codec
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Camera
Colors CMOS 2 M pixel camera Preview Mirror
Interface
Micro-SD slot External RF connector wiht cover Mini USB/ audio jack in one
Power
Battery Rechargeable batter, Lithium ion battery, 1050mAh Charging times: 2.75 hours WMA: 12 hours( Magneto test case) WMV: 8 hours (Magneto test case) Talk time: 3~5 hours Standby time: 200 hours AC input: 100~ 240V AC, 50/60 HZ DC output: 5V and 1A
Battery life:
AC adaptor
Device to Device Connectivity Power

Bluetooth Complaint with v1.2 Class 2 transmit power Supported profiles: Generic Access profile Serial Port profile Headset profile Object Push profile Generic Access profile
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PAN profile Hands-free profile Generic Object Exchange profile HID profile A2DP profile AVRCP profile Service Discovery profile
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Micro-SD Accessories
AC adapter w/DC_IN via mini-USB plug USB Sync Cable Stereo wired headset with microphone Standard Battery
MSFT Windows Mobile 6 Applications

Microsoft Outlook Mobile: Message(SMS/E-mail), Contacts, Calendar, Tasks Microsoft Media Player Mobile Microsoft MSN Message Microsoft Internet Explorer Mobile Microsoft ActiveSync Pictures & Video Device Management File Explorer Smart Dialer for QWERTY keyboard as search input
Value Added Applications

WMP 10 DirectShow plug in to support playing more audio/video format Audio decode MP3/AAC/AAC+/VMAS/AMR Video Codec MPEG4/H.263/Motion JPG Camera capture utility Camcorder Frame rate per second min 15 fps encoding for QCIF resolution Recoding format
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H.263 + AMR NB MPEG4 + AMR NB Polyphonic MIDI Ringtone Engine and Plugin Real Music Tone MP3/ AAC MMS with video clip support JAVA virtual machine(J2ME, CLDC1.1, MIDP 2.0) Word, Excel, and PPT, and PDF Viewer Voice Dial on both wired & Bluetooth headset OMA DRM 1.0/2.0
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Regulatory
R&TTE: EMC/EMI, CEM, Safety FCC approval FCC HAC (Hearing Aide Compatibility) Bluetooth 1.2 compliance test USB compliance test Bluetooth certification
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1.2 Product overview

Front side
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# 1 2 3 4 5 SPEAKER
ITEM Listen to a phone call.
FUNCTION
LIGHT SENSOR DISPLAY SCREEN NAVIGATION CONTROL/ENTER LEFT SOFT KEY
Sense dark conditions and activate a backlight under the keypad and the QWERTY keyboard automatically, glowing in dark.
Use to scroll left, right, up, or down. Press the center to use as the ENTER button. Press to perform the command shown in the label above the button.
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6 7 8 9 10 11 12 END BACK RIGHT SOFT KEY HOME TALK
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Press to go to the Home Screen.
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Press to dial a phone number or answer a call. Press and hold to activate/deactivate speakerphone mode. KEY Key Press to change input modes or press and hold to choose an input mode or symbols from the list. Press to add a space or press and hold to display a list of symbols. Press to end a call, or press and hold to lock the phone keypad and the keyboard. Press to go to the previous screen, or backspace over characters. Press to perform the command shown in the label above the button. The left LED indicator (green/red/amber) notifies you of the battery and network status of your phone, while the right LED indicator (blue) notifies you of Bluetooth connectivity status. For more information about LED Indicators, see the table at the end of this section. Press (about 3 seconds) to turn on and off the phone. Or press and quickly release the POWER button to display the Quick List, which allows you to change profiles, open Comm Manager, and enable/disable lock feature. Slide this up or down to increase or decrease the earpiece volume during a call. Drag and hold the slider down to launch Voice Speed Dial and record voice tags. Insert a microSD memory card for storing data. Remove to insert or replace battery. Listen to audio media or phone call when using speakerphone mode.
13
LED INDICATORS
14
Power Volume Adjustment Slider Micro SD slot Back Cover Speaker Camera lens Car Antenna Connector Self-Portrait Mirror CAMERA Battery Cover Latch Microphone Sync Connector/ Earphone Jack Strap Holder
15 16 17 18 19 20 21 22 23 24 25 26
Connect your phone to the car antenna while in a car to have better reception quality. Turn the back side of your phone to face yourself so that your image reflects on the mirror when taking self-portrait shots. Press to open the Camera program. If already running, press to capture an image or start recording a video clip. Slide this latch to release the battery cover. Speak into the microphone when receiving or making a phone call or during voice recording. Use for synchronizing data, recharging the battery, connecting the earphone to listen to audio media, or connecting the phones hands-free kit. Attach a strap for carrying your device.
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# 1 2 3 4 5 6
ITEM AC ADAPTER USB CABLE Mini-USB Stereo Headset Pouch One-to-two YSplitter Cable One-to-two Splitter Adapter Recharge the phone battery.
FUNCTION
Connects your device to a PC and synchronize data. Provides a volume control slider and a Send/End button. Press the Send/End button to pick up a call or put a call on hold; press and hold the button to end the call. Comes with belt clip. Store your device in the pouch to keep it away from dust and scratches. Lets you connect the supplied AC adapter and a standard 2.5mm stereo headset to your device at the same time. Lets you connect the supplied AC adapter and mini-USB stereo headset to your device at the same time.
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2. Device Dissembling and Assembling Procedure

2.1 Disassembling procedure
TOOLS NEEDED FOR ASSEMBLING AND DISASSEMBLING PROCESS. 1. LENS CLEANING CLOTH. 2. TORX SCREW DRIVER T5X50. 3. TORX SCREW DRIVER T6X50. 4. PHILIPS SCREW DRIVER 00X40. 5. FLAT PLASTIC STICK. 6. PLASTIC TWEEZERS.
SLIDE THE BATTERY COVER LATCH TO

RELEASE THE BATTERY COVER
REMOVE THE BATTERY
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UNFASTEN THE SCREW(S) AT THE

LOCATION INDICATED
HOLD THE FLAT PLASTIC STICK

VERTICALLY AND SLIDE THROUGH THE GAP BETWEEN HOUSING AND COVER PRE-ASSY (C COVER)
SEPARATE THE HOUSING (D PART) AND

THE MAIN UNIT
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REMOVE THE DIVERSITY WIRE
SEPARATE THE ANTENNA FROM THE MAIN

BOARD
RELEASE THE FPC AND QWERTY FPC

FROM THE MAIN BOARD CONNECTOR
SEPARATE THE HOUSING (C PART)AND

MAIN BOARD
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UNFASTEN THE SCREWS AT THE

LOCATION INDICATED
REMOVE THE GASKET FROM THE C PART
REMOVE
BOARD
THE
GASKET
FROM THE MAIN
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UNFASTEN THE SCREWS AT THE

LOCATION INDICATED
HOLD THE FLAT PLASTIC STICK

VERTICALLY AND SLIDE THROUGH THE GAP FOR BEZEL.
SEPARATE THE BEZEL AND THE LCM HOUSING(B PART)
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RELEASE THE MAIN FPC FROM THE

SWITCH BOARD CONNECTOR
RELEASE THE MAIN FPC FROM THE LCD

CONNECTOR
SEPARATE THE MAIN FPC FROM THE A

PART
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DISASSEMBLE THE ANTENNA RUBBER

FROM THE BEZEL
DISASSEMBLE THE SWITCH BOARD
DISASSEMBLE THE LCM FROM THE BEZEL
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DISASSEMBLY COMPLETED
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2.2 Assembling procedure
TOOLS NEEDED FOR ASSEMBLING AND DISASSEMBLING PROCESS. 1. LENS CLEANING CLOTH. 2. TORX SCREW DRIVER T5X50. 3. TORX SCREW DRIVER T6X50. 4. PHILIPS SCREW DRIVER 00X40. 5. FLAT PLASTIC STICK. 6. PLASTIC TWEEZERS. CAMERA MODULE UN-INSTALL JIG (P/N: 72H02037-00M)
ASSEMBLE THE NUMERIC KEYPAD ON THE BEZEL.
ASSEMBLE
BEZEL
THE SWITCH BOARD TO THE
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COMBINE THE LCM TO THE BEZEL
PUT THE ATENNA RUBBER ON THE BEZEL
ATTACH THE MAIN FPC ON THE BEZEL
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CONNECT
THE MAIN CONNECTOR
FPC
WITH
LCD
CONNECT
BOARD
THE MAIN
FPC
WITH SWITCH
PUT THE MAIN FPC THROUGH THE HOLE OF THE HOUSING OF LCD.
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PRESS LEFT SIDE LCD HOUSING.
THEN COMBINE THE
6pcs of screw
FASTEN 6 SCREWS AT THE LOCATION INDICATED IN SEQUENCE
TORQUE : 0.80.1 KGF-CM

2 6 4
INSERT
THE QWERTY KEY INTO THE KEYPAD BEZEL AND AFFIX IT TO THE BEZEL
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STICK THE GASKET AT THE LOCATION

INDICATED
PUT THE MIC RUBBER ON THE MAIN

BOARD
FASTEN SCREWS
INDICATED
AT THE LOCATION
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PUT
THE MAIN BOARD ON THE KEYPAD BEZEL
CONNECT MAIN FPC AND QWERTY WITH THE MAIN BOARD
FPC
PUT THE ANTENNA ON THE MAIN BOARD
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FASTEN SCREWS AT THE LOCATION

INDICATED IN SEQUENCE NOTICE: PUT TEH DIVERSITY CABLE OUTSIDE THE HOOK
ASSEMBLE THE HOUSING.
2 4
FASTEN SCREWS AS AT THE LOCATION

INDICATED IN SEQUENCE INSERT THE BATTERY

1 3
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ASSEMBLY COMPLETED
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3. ROM Re-flash Procedure

3.1 ROM upgrade thru RUU (Re-flash Upgrade Utility)
Connect device to PC
I. II. Setting and allow USB connections in Microsoft ActiveSync. Connect your device and desktop/ or laptop via USB cable.
III. Check the pop-up message from

Microsoft ActiveSync when device is synchronized with PC.
Download OS Image from SDO
I. II.
Download OS image from SDO. Un-zip the file and execute RUU program.
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RUU - 1
III.
Read the pop-up message form ROM update utility and select the I understand checkbox.
IV. Click Next to proceed.
RUU - 2
V.
Read the pop-up message form ROM update utility to follow and perform the instructions and select the I completed checkbox.
VI. Click Next to proceed.
RUU - 3
VII. Current image version confirmation. VIII. Click Update to proceed.
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RUU - 4
IX. Double verify the ROM revision which you want to update before re-flash procedure. X. Click Next to proceed.
RUU - 5
XI. Read the information from pop-up message and the OS update procedure will takes 10 minutes long. XII. Click Next to proceed.
RUU - 6
XIII. You can see the update progress from your PC and in your device.
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. Doc. Title Libra Service Manual RUU - 7
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XIV. The OS upgrade is finished, click Finish to close the utility.
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3.2 Rom Image upgrade thru SD card

Download OS Image from SDO
I. II.
Download OS image from SDO.

Un-zip the image file.
Format SD card and copy image file to SD card
III.
Select file system and format the SD card to FAT32 mode.
IV. Copy image file XXX.nbh to the micro SD

card and rename to LIBRIMG.nbh.
SD Upgrade - 1
V.
Turn the device power off and insert Diagnostic SD card.
VI. Press & Hold Volume Down, then press Power button, then release power button first. VII. Press power button start upgrade procedure.
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4. DIAGNOSTIC PROGRAM
4.1 List of Diagnostic / WinCE Test Items
Mode No Item Function Test 1 Auto Test 2 SDRAM Test 3 Display Test 4 LED Test 5 Key Test Description Full functions test automatically. RAM memory test. Color bar/R/G/B/Black/White/Gray pattern. Green/Red/Blue/Key Pad. Soft1/Soft2/Home/Back/Talk/End/5-way Navigation/
Numeric / Alphabetic Keypad/Vol Up-Down/ESG /PC/ Power/Camera, SIM door
Remark
Mode WinCE
6 B. L Test 7 SD Card Test 8 Checksum Test 9 Battery Test 10 Vibrator 11 Audio Test Run-in Test 1 1 Hour 2 2 Hours 3 4 Hours 4 8 Hours Unit Information Check Format FAT No Item 1 USB Test 2 Camera Test 3 Bluetooth Test
Front light test (Off /Dim/High). SD card Read/Write test. ROM checksum test. Battery info check. Vibrator on test. Speaker, Earphone, Receiver test. 1 Hour Run-in Test 2 Hours Run-in Test 4 Hours Run-in Test 8 Hours Run-in Test Option Option Option Option
Diagnostic
Description USB link test (Microsoft ActiveSync). Picture capture test. Bluetooth test.
Remark
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How to select test item: Using navigation button -"Up" or "Down" to select the test items How to execute the test program: Press Action button to start each of test items.
Diagnostic Main Menu/Function Test Menu

I. II. Turn the device power off and insert Diagnostic SD card. Press & Hold Volume Down, then press Power button, then release power button first, and then enter Diagnostic mode. III. Using to select the test item and move to next page as well.
IV. Select item Function Test to find

the Function test menu.
Auto Test
I. II.
Press the Action key to start the Auto-test. It will perform the regular tests, please follow the system instruction to do the test.
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ROM Checksum Test
III.
Press Action key to select ROM checksum test
IV. The Rom Checksum will be displayed on the screen V. Press Action key to exit and return to Function test menu.
Display Test (and RED/ GREEN pattern)

I. II. Press Action key to select Display Test on Function test menu. After the test pattern is show up, please check the pattern if any un-uniform color or chromatist. III. Press Action key to continue the next test pattern.
Display Test (BLUE/ BLACK pattern)
V.
Press Action key to continue the next test pattern.
Display Test (WHITE/Color bar pattern)
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VI. Press Action key to continue the

next test pattern.
LCD Back Light Test
I. II.
Press Action key to select B.L Test on Function test menu.
Press Action key to switch the LCD

backlight level from Level 1,Level2,
Level3, Press Action key to exit and

return to Function test menu.
Vibrator Test
I. II.
Press Action key to select Vibrator Test on Function test menu. Press Action key to exit and return to Function test menu.
SD Card Test
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I. II.
Press Action key to select SD Card

Test
If success, press Action key to exit

and return to Function test menu.
Button Test
I.
II.
Press Action key to select Button Test on Function test menu. Follow the instruction on screen to perform the Key/Button test
( Volume up, Volume down, Key up, Key down, Key left, Key right, Key action, Soft1, Soft2, Send, End, Start, OK.).
III. The screen will return to Function

test menu after the test is finished.
Audio Test
Press Action key to select Speaker, earphone, receiver Test on Function test menu. II. If success, press Action key to exit
I. and return to Function test menu.
Battery Test
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I. II.
Press Action key to select Battery Test on Function test menu If success, press Action key to
exit and return to Function test menu.
Sliding Test
I.
Press Action key to select Sliding Test on Function test menu. II. After recording and playing , The screen will return to Function test menu
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I. II.
Start up the Microsoft ActiveSyncprogram in the PC. Insert USB cable and connect unit to desktop/ or laptop.
Camera Test
I.
Tap Start->Program->Camera or Press Camera button to turn on the Camera.
II. III.
Make sure the device will present and enter the preview display. Check camera pre-view and image quality.
Bluetooth Test - 1 I. II.
Tap icon Comm Manager on the Today screen and turn on Bluetooth. Tap the icon Settings down-right the corner of the screen and select the Make this device. Checkbox.
III. Press Action key to go next test

pattern.
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. Doc. Title Libra Service Manual Bluetooth Test - 2
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I.
Tap Start->Settings->Connections-> Beam and select Receive all. Checkbox.
II. III.
To create a file, tap Start->Programs ->Notes->New. Tap and select the Beam file
Bluetooth Test - 3
IV. Once device is searched, tap the device to send the file. V. Return to Today screen and tap Start->Program->Comm Manager ->Bluetooth to turn off Bluetooth.
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5. Power measurement test

5.1 Main board leakage current Test Procedure
This is a quick method to measure if any abnormal leakage current on main board which caused high power consumption compare to GOOD main board. (1) Requirement - Power Supply - Micro-current Meter - Current series JIG CABLE Battery JIG
Equipment need: B A A. Power Supply (set at 4 V /1A). B. Micro-Current Meter (support 0.5mA ~ 1A).
2. Fixture needed: C. Cable D. Battery with extension cable E. Current series jig.( with black and red cable)
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3. Connect cable (C) to positive polarity of power supply (A) and current meter (B)
4. Connect cable of fixture( E ) to negative polarity of power supply (A) and current meter (B)
5. Setting is Ready now for testing ( Dont turn the power on at this moment )
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6.Turn on power supply ( 4V) and current meter ( 2A) Unit setting: * Flight mode * Turn off Bluetooth
7. Measure flight mode current (condition: Display & BL off/RF off/BT off/WiFi off) Wait about 15 sec, back light will be off and after 45 sec display will be off as well, in this condition, please check current value on the current meter. Current value must be under 40 mA, if over, it means M/B failed, please replace M/B for repair.
8. Measure power off current Check current value on the current meter, Current value must be under 3 mA, if over, it means M/B failed, please replace M/B for repair.
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Conclusions
If above measurement results are Pass both in flight mode and power off mode, then the Main board is judged as normal (Good)
If any of measurement modes is FAILED, please replace the main board.
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6. COSMETIC INSPECTION CRITERIA

6.1 DEFINITION OF CLASSES
Class A area => the front side of main unit involves all buttons and LED lens except LCD. Class B area => the view of Qwerty keypad after slid out main unit Class C area => 4 sides and back views of main unit Class D area => Socket of battery, inner side of battery cover and back side of upper slid part
Area A
Area B
Area C
Area D
6.2 Description
General inspective regulations and according SPEC refer to IS-3047 Generic Cosmetic Inspection Criteria. In the event of any inconsistencies between this document of IS-4223 and the Relationship agreement, the parties agree that this document of IS-4223 shall prevail. IT IS GENERIC COSMETIC INSPECTION CRITERIA FOR ALL PRODUCTS IF THERE HAVE ANY CONFLICT WITH THESE GENERIC CRITERIONS; PLEASE FOLLOW THE PRODUCT INSPECTION CRITERIA RESPECTIVELY.
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D: Diameter / L: Length / W: Width / N: Number of defects/ S: Distance from dot to dot Inspecting distance: 30 5cm / Mechanical inspection angle90 degrees / LCM inspection angle9015 degrees / Inspection time:5 secs per surface. Ambient illumination is to be 500-1100 lux The inspection condition of Newton ring: a. Inspection distance: 30cm / Inspection time: 5 sec b. Ambient illumination is to be 500-1000 Lux (Incandescent lamp) c. Inspection should be performed under the condition that LCD screen could reflect the mirror image of lamp. d. The criteria of Newton rings tinges and measure of area must follow up the worst-case sample.
6.3 Display inspection

Inspection Defects Bright Dots Accept Level Red+ Green+ Blue 3, S > 5mm. Level Minor Minor Minor Minor Minor Minor Minor
Single 2 adjacent 0 3 or more 0 adjacent Total Number 2, S > 5mm. Electrical Characteristic Dark Dots Single Defects 2 adjacent 0 Dark or Bright lines 0 All Allowable Dots Defects Total Number 3, S > 5mm. Shift and tilt of screen viewed area Scratch Foreign Scratch, Objects or Lint on power off status Lint (linear foreign objects)
The black edge around display area must Minor be detected by front view. 0.03 < W 0.1 (mm) Minor L 5 (mm), N 2 (mm) 0.03 < W 0.1 (mm) 0.3 < L 3.0 (mm) Minor N5 Minor Minor Minor Minor
Spots 0.1 < D 0.3 (mm), N 4 Fish eye on film 0.1 < D 0.4 (mm), N 4 Breakage on film surface Not acceptable Total acceptable defect quantity 10
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6.4 Main unit inspection

GAP & STEP INSPECTIONS
Description
1. 2. 3. OTHERS Scratch Description Class A Class C Accept Criteria Gap between ME parts. Stylus
Accept Criteria
1.5 (mm) Stylus assembly protruding, loose, missing, falling and deformed is not allowed.
Others, refer to production Others, refer to production release spec release spec
Exposure of substrate do not accept Scratch : L4mm ,W0.2mm ,N2, S10mm Label area dont care Exposure of substrate do not accept Scratch : L10mm ,W0.4mm ,N5, S5mm Contamination dot/Granule dot/Cave granule Accept Criteria D0.5mm ,N2,S 15 mm (Ignored if D D 0.15mm) D<0.9mm ,N4,S 10 mm Burr Accept Criteria Dont accept hand scrape Imprint mark Accept Criteria 0.25diameter0.65mm ,N3 Bright mark Accept Criteria L2.5mm,W0.25mm,N3 L3.0mm,W0.3mm,N5 Lint Accept Criteria L3mm , W0.2mm ,N2, S 5 mm L10mm , W0.3 mm ,N3
Minor Minor
Description Class A Class C Description Burr. Description Class A Description Class A Class C Description Class A Class C
Minor Minor
Minor
Minor
Minor Minor
Minor Minor
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7. Generic Troubleshooting
1Main Unit Does Not Respond to Power Button
(1) Connect the AC adapter, maybe the battery pack is exhaust and wait few minutes for battery recharging. (2) Check if battery installed well. (3) Check the Power Button whether its damaged. (4) Replace another battery pack. (5) Try to start boot-loader mode [refer to section 4.2]. Re-flash ROM if boot loader mode is enabled. (6) Check all connectors including LCD FPC to Main Board. (7) Replace Main Board if necessary. (8) Once the defective part has been identified, verify the defective part again whether the symptom could be duplicated with another unit.
2Buttons Do Not Respond

(1) Try to cold boot the unit then tries again. (2) Dismantle the unit; check the status of switches on the Main Board and the plastic parts of the Button not responding. (3) Try with another Main Board or Front Bezel. (4) Replace Main Board or Front Bezel if necessary. (5) Once the defective part has been identified, verify the defective part again whether the symptom could be duplicated with another unit.
3Unusual Vertical / Horizontal lines or partial display

(1) Check the connection of LCM FPC whether is properly connected. (2) Try to cold boot the unit then tries again. (3) Try to re-flash the ROM code. (4) Try with another LCM. (5) Try with another Main Board. (6) Replace LCM if necessary (7) Replace Main Board if necessary. (8) Once the defective part has been identified, verify it again with the defective part whether the symptom could be duplicated.
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4Back Light Does Not Turn ON/OFF

(1) Check the connection of LCM FPC whether is properly connected. (2) Try to re-flash the ROM code. (3) Try with another LCM. (4) Try with another Main Board. (5) Replace LCM if necessary (6) Replace Main Board if necessary. (7) Once the defective part has been identified, verify it again with the defective part whether the symptom could be duplicated.
5CF/SD Card cannot be used

(1) Check whether CF/SD Card is fully inserted to the slot until you hear a click. (2) Try to re-flash the ROM code. (3) Try with another CF/SD Card. (4) Try with another Main Board. (5) Replace Main Board if necessary. (6) Once the defective part has been identified, verify it again with the defective part whether the symptom could be duplicated.
6PC Connection not possible

(1) If test result is NFF, it is possible caused by user connect cradle to computer before ActiveSync is installed. (2) Check whether Connection Settings in the MS ActiveSync is properly set. (3) Check whether it connects with other cables or cradle, customers cable might be damaged. (4) Check the external appearance of the connector on the unit whether it is physically damaged. (5) Try to re-flash the ROM code. (6) Replace Main Board if necessary. (7) Once the defective part has been identified, verify it again with the defective part whether the symptom could be duplicated.
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7Battery Pack does not start

(1) Make sure the battery cover is closed properly. (2) Connect to the AC Adapter and see if it takes charge. Also check AC Adapter condition. (3) Check whether AC Adapter is functioning properly. (4) Check whether the condition of Battery Charging status is correct. (5) Check the appearance of Battery Pack if any abnormal.. (6) Try with another Battery Pack or Replace Battery Pack if necessary (7) Try with another Main Board or Replace Main Board if necessary. (8) Once the defective part has been identified, verify it again with the defective part whether the symptom could be duplicated.
8Battery discharges quickly even after fully charged

(1) Make sure the Battery Pack takes fully charge with AC Adapter. (2) Check whether the condition of Battery Charging status is correct. (3) Dismantle the unit and check the appearance of Battery Pack. (4) Try with another Battery Pack or Replace Battery Pack if necessary (5) Try with another Main Board or Replace Main Board if necessary. (6) Once the defective part has been identified, verify it again with the defective part whether the symptom could be duplicated.
9Battery Pack does not recharge

(1) Make sure the Battery Pack takes fully charge with AC Adapter. (2) Check whether the condition of Battery Charging status is correct. Charge should be done no more than 4 hours. (3) Dismantle the unit and check the appearance of Battery Pack. (4) Try with another Battery Pack or Replace Battery Pack if necessary (5) Try with another Main Board or Replace Main Board if necessary. (6) Once the defective part has been identified, verify it again with the defective part whether the symptom could be duplicated.
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10No Sound from Speaker or Distorted sound

(1) Check Sound & Notifications Settings in the unit for Sound Enabling. (2) Make sure its not MUTED. (3) Try to re-flash the ROM code. (4) Clean up the speaker connection side on MB if there is any contamination. (5) Dismantle and Check whether the Speaker is properly installed (Orientation) (6) Replace Speaker if necessary. (7) Replace Main Board if necessary. (8) Once the defective part has been identified, verify it again with the defective part whether the symptom could be duplicated.
11No Recorded Sound or Distorted sound

(1) Check Sound & Notifications Settings in the unit for Sound Enabling. (2) Make sure its not MUTED. (3) Try to re-flash the ROM code. (4) Dismantle and Check whether the Microphone is properly installed. (5) Replace Microphone if necessary. (6) Replace Main Board if necessary. (7) Once the defective part has been identified, verify the defective part again whether the symptom could be duplicated with another unit.
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8. Generic Labeling Plan Main unit

Main unit Regulatory label
HTC P/N: 77H00452-00M
26mm
15mm
2mm 23mm 36mm Controlled by MFG Vendor Code
HTC P/N
Countries supported
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Battery Label
Main Battery Warning Label
HTC P/N: 35H00082-00M
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9. Generic Spare Part List and Photos

9.1 SPL for Repair
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NOTE: THE PHOTO OF SPL IS GENERIC AND ONLY FOR REFERENCE, THE COLOR AND APPEARANCE MAY BE DIFFERENT FROM THE SHIPPED PARTS, IF YOU WANT TO APPLY THOSE PARTS, PLEASE CONTACT WITH YOUR SERVICE ACCOUNT MANAGER FOR MORE INFORMATION. AS FOR PICTURE, PLEASE REFER TO THE TABLE AS BELOW.
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9.2 Board Level 2.5 Repairs Basic Repair Instructions for Component Replacement:
Step 1 Step 2 Step 3 Step 4 Notice: A. B. C. D. All the parts of the PCB should be checked if it is missing or not. The OP must to wear antistatic wrist band .Don't put boards together and avoid hitting them. When you solder and repair that the soldering iron ,temperature must be setup 415. (The temperature range is 4155),and the solder wire's diameter is 0.4/0.5/0.6mm(SAC 305 (1.1%) Please be noticed to follow below steps for main board repair which is equipped with Golden Capacitor: 1. When replacing level 2.5 components located around the golden capacitor: I. II. III. IV. V. 2. The temperature of the hot air blower must be under 400c When apply the hot air to the part / component, the heating time must be under 20 seconds (including the time of removing and soldering) The temperature of the soldering iron must be under 350c When apply the solder tip to the part / component, the heating time must be under 5 seconds The solder tip must not contact with the golden capacitor Place the solder-proof tape to cover the surrounding area of the components which being replaced.
WarningDO NOT overheat the tape and components to avoid the tape melted and the components damaged
Use Heater Gun (HAKO850B, set the temperature between 350C, Air Speed 3~5) to remove the components. Wait till the temperature cool down before removing the solder-proof tape to avoid other components being removed After the damaged or defective components have been replaced; clear the surroundings for solder and flux residues.
For BGA replacement: The golden capacitor must be removed before perform pre-heating, heating, soldering and de-soldering process, and then it must be replaced with a new one (please refer to 1.c. and 1.d. steps)
3.
For main board which failed to pass the function test, the golden capacitor must be replaced with a new one and must follow below soldering criteria: The temperature of the soldering iron must be under 350c When apply the solder tip to the part / component, the heating time must be under 5 seconds The solder tip must not have a contact with the body of golden capacitor
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SW1
SW2
CON5
CON4
PF2
AMIC PF1 PCG
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RANT RSW1 CON
VIB1 BTSW1 RSW3
RSW2 PCON CON3
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10. RF Antenna Specification

Items 1 2 3 1 2 3 4 5 6 1 2 3 1 2 3 4 5 6 TCH 1st Downlink Cell Power US_Cellular Transmitter Test Check TX Power 384 -104 Check TX Power 777 -104 Check TX Power 1013 -104 US_Cellular Receiver Test FER (Frame error rate) 384 -104.5 FER (Frame error rate) 777 -104.5 FER (Frame error rate) 1013 -104.5 ERRS 384 -104.5 ERRS 777 -104.5 ERRS 1013 -104.5 US_PCS Transmitter Test Check TX Power 25 -104 Check TX Power 600 -104 Check TX Power 1175 -104 US_PCS Receiver Test FER (Frame error rate) 25 -104.5 FER (Frame error rate) 600 -104.5 FER (Frame error rate) 1175 -104.5 ERRS 25 -104.5 ERRS 600 -104.5 ERRS 1175 -104.5 Test Name Note
HTC CONFIDENTIAL

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RF ANTENNA SPECIFICATION ...................................................................................................................................62

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1.1 Product Features

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TTY/TDD support R-UIM connection reserved Internal GPS antenna

Send phone button

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Device to Device Connectivity Power

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MSFT Windows Mobile 6 Applications

Value Added Applications

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1.2 Product overview

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ITEM Listen to a phone call.

LIGHT SENSOR DISPLAY SCREEN NAVIGATION CONTROL/ENTER LEFT SOFT KEY

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2. Device Dissembling and Assembling Procedure

SLIDE THE BATTERY COVER LATCH TO

REMOVE THE BATTERY

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UNFASTEN THE SCREW(S) AT THE

HOLD THE FLAT PLASTIC STICK

SEPARATE THE HOUSING (D PART) AND

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REMOVE THE DIVERSITY WIRE

SEPARATE THE ANTENNA FROM THE MAIN

RELEASE THE FPC AND QWERTY FPC

SEPARATE THE HOUSING (C PART)AND

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UNFASTEN THE SCREWS AT THE

REMOVE THE GASKET FROM THE C PART

FROM THE MAIN

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