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2001 Prentice-Hall
Page 34-1
Figure 34.1 A collection of printed circuit boards. Source: Phoenix Technologies, Inc.
2001 Prentice-Hall
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2001 Prentice-Hall
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2001 Prentice-Hall
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Figure 34.5 Growth of silicon dioxide, showing consumption of silicon. Source: S. M. Sze.
2001 Prentice-Hall
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Figure 34.6 Pattern transfer by lithography. Note that the mask in step three can be a positive or negative image of the pattern. Source: After W. C. Till and J. T. Luxon.
2001 Prentice-Hall
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2001 Prentice-Hall
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pn Junction Diode
Figure 34.9
Kalpakjian Schmid Manufacturing Engineering and Technology
2001 Prentice-Hall
Page 34-10
Figure 34.10 (a) Scanning electron microscope photograph of a two-level metal interconnect. Note the varying surface topography. Source: National Semiconductor Corporation. (b) Schematic drawing of a two-level metal interconnect structure. Source: R. C. Jaeger.
2001 Prentice-Hall
Page 34-11
Figure 34.11 (a) SEM photograph of wire bonds connecting package leads (left-hand side) to die bonding pads. (b) and (c) Detailed views of (a). Source: Courtesy of Micron Technology, Inc.
2001 Prentice-Hall
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2001 Prentice-Hall
Page 34-13