Input Data

Schematic diagram with component detail, interconnections, edge connector specification (refer to Appendix A-3 to A-6). Component list

Figure A-7 Component List Component code POWER SUPPLY BRIDGE1 R1 Z1 C1 C2 R2 Q1 C3 C4 R3 TRANSMITTOR BATTERY SW1 SW2 D1 D2 D3 D4 D5 SW3 U1 R4 LED1 R5 L2 VC1 C5 Value IN 4001 100 12V 220UF/16V O.1UF 33K 9013 1000UF/16V 47UF/16V 47K 12V Description Diode Resistor 1/4W Zener E Capacitor E Capacitor Resistor 1/4W Transistor E Capacitor E Capacitor Resistor 1/4W Battery Dip-switch Dip-switch Diode Diode Diode Diode Diode Dip-switch IC Resistor 1/4W LED 3mm Resistor 1/4W Coil Variable Capacitor Ceramic Capacitor Footprint Code (PROTEL) DIODE0.4 AXIAL0.4 DIODE0.4 AXIAL0.4 RB.2/.4 AXIAL0.4 T0-92A RB.2/.4 RB.2/.4 AXIAL0.4 AXIAL1.0 RAD0.2 RAD0.2 DIODE0.4 DIODE0.4 DIODE0.4 DIODE0.4 DIODE0.4 DIP8 DIP18 AXIAL0.4 RB.2/.4 AXIAL0.4 AXIAL0.4 AXIAL0.4 AXIAL0.4

IN 4148 IN 4148 IN4148 IN 4148 IN 4148 DIP-8 PT-2262 33M RED LED 18K 10UH 25P 3P

R6 Q2 R7 RECEIVER-UHF L3 VC2 C6 C10 R10 R12 C7 Q3 R11 C9 L4 R8 C8 R9 R7 R8 R9 R13 C11 R14 C12 R15 Z2 Z3 U2 R16 C13 R17 RECEIVERDECODER SW4 U3

47K MPSH10 100 1 TURN 5P 5P 100P 270 18K 3P MPSH10 33K 100n 8Turns 2.7K 330n 5.6K 100 2.7K 5.6K 18K 330n 6.8K 1UF/16V 120K 12V 12V MC4558 6.2M 2P 120K

Resistor 1/4W Transistor Resistor 1/4W Coil Variable Capacitor Ceramic Capacitor Ceramic Capacitor Resistor 1/4W Resistor 1/4W Ceramic Capacitor Transistor Resistor 1/4W Ceramic Capacitor Coil Resistor 1/4W Ceramic Capacitor Resistor 1/4W Resistor 1/4W Resistor 1/4W Resistor 1/4W Resistor 1/4W Ceramic Capacitor Resistor 1/4W E Capacitor Resistor 1/4W Zener Zener IC Resistor 1/4W Ceramic Capacitor Resistor 1/4W

AXIAL0.4 T0-92A AXIAL0.4 AXIAL0.4 AXIAL0.4 AXIAL0.4 AXIAL0.4 AXIAL0.4 AXIAL0.4 AXIAL0.4 T0-92A AXIAL0.4 AXIAL0.4 AXIAL0.4 AXIAL0.4 AXIAL0.4 AXIAL0.4 AXIAL0.4 AXIAL0.4 AXIAL0.4 AXIAL0.4 AXIAL0.4 AXIAL0.4 RB.2/.4 AXIAL0.4 DIODE0.4 DIODE0.4 DIP8 AXIAL0.4 AXIAL0.4 AXIAL0.4

DIP-8 PT-2272

Dip-switch IC

DIP8 DIP18

R18 R19 D6 U4 R20 Q4 LED2 R21 R22 RELAY1 CON1 D7 RELAY2 D8 Q5 C14

470K 20K IN 4148 MC14013 47K 9013 RED LED 4.7K 4.7K 12V 2-PIN IN 4148 12V IN 4148 9013 47UF/16V

Resistor 1/4W Resistor 1/4W Diode IC Resistor 1/4W Transistor LED 5mm Resistor 1/4W Resistor 1/4W Relay Socket Diode Relay Diode Transistor E Capacitor

AXIAL0.4 AXIAL0.4 DIODE0.4 DIP14 AXIAL0.4 T0-92A RB.2/.4 AXIAL0.4 AXIAL0.4 SIP8 SIP2 DIODE0.4 SIP8 DIODE0.4 T0-92A AXIAL0.4

mechanical specifications such as board size and shape, mounting holes, identification of restricted areas with respect to component height, edge connector PCB specifications, using single- and double-sided.

Photo Plotting
In the photo plotter, the input data are converted back to graphics by photographic (Refer to Appendix A-7 to A-9).

PCB Fabrication Process

Step 1 Clean the blank PCB. The first step is probably the most important. Step 2 Apply the Photoresist. While liquid photoresist can be applied by spraying, dipping, speed whirling, and roller coating, these methods are used primarily for mass-production in industry. When the liquid photoresist is first applied, it really is not yet a resist, but a sensitizer. To take on the properties of a resist that will protect copper underneath, it must be dried and exposed to ultraviolet light. Step 3 Dry the Photoresist and leave the board in a dark cabinet overnight to let it dry. Step 4 Expose the Sensitized PCB to Ultraviolet Light. If the board were now placed under an ultraviolet light, the entire sensitized surface would turn to a resist, and no copper could be etched away. Using an ultra-violet black light, set the printing frame so that it is directly facing the light, approximately 1 foot away. Be sure the surface is exposed to ultraviolet light and that the lamp holder does not cast shadows. Expose for a minimum of 2 minutes. When the exposure is complete, remote the PCB from the frame. The sensitized areas exposed to ultra-violet light are now hard and have formed into a resist. Step 5 Develop the Image (Pattern). The purpose of the developing step is to remove the unwanted remaining sensitized material (where there was no ultraviolet exposure) and bring out the latent image of the traces and pads. While still under safe-light condition, place the board in a tray filled to a depth of inch with developer. Cover the tray to avoid breathing harmful fumes, and rock the tray gently for about 20 minutes. Then, remove the board and let it drain. At this time return to normal lighting conditions. An image of the traces and pads should now be standing out in clear relief from the surrounding copper. Steps 6 Rinse and Dry. Under cool, slow running water, rinse the board for 2 t0 3 minutes. Do not let the water hit the board directly, since it could smear the resist pattern. Step 7 Of all the processes involved in making a PCB, the etching procedure is probably the easiest. Fill the etching container with acid to a depth that will cover the submerged PCB. Ideally, the board should be standing on edge. But if it must lie horizontally, be sure the copper side is facing up. Don't plunge the board into the acid; place it in the container.

Step 8 Using water to cleaning the Acid.