MICROSYSTEMS LABORATORY

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Degrees
Degree B. S. M. S. Ph. D. University Department of Mechanical Engineering, Chung-Ang Univ. Department of Mechanical Engineering, Chung-Ang Univ. School of Engineering Osaka University Year 1997.02 1999.02 2002.03

Experience
Position T. A. R. A. Research Fellow Designated Professor Assistant Professor Associate Professor Organization School of Engineering, Osaka University Collaborative Research Center for Advanced Science and Technology, Osaka University School of Engineering, Osaka University School of Engineering, Osaka University School of Engineering, Osaka University School of Mechanical engineering, Chung-Ang University Period 1999.10 ~ 2000. 7 2000. 8 ~ 2001. 3 2002. 4 ~ 2002.10 2002.11 ~ 2003.12 2004. 7 ~ 2004. 8 2004. 9 ~ Present

deuxyim@hanmail.net

marbrug@naver.com

leepull@hanmail.net

hjsong0727@nate.com

dlqudgns89@naver.com

MICROSYSTEMS LABORATORY
Automobile Ship & Marine Industry

Space & Aircraft

Microsystems
Home electronics & Information Apparatus

Medical

Applications

System Integration Technology

Material Manufacturing Design

Assembly Evaluation

Fundamental Technology


MICROELECTRONIC PACKAGING Field
Hybrid Interconnection Using Low-Melting-Point Alloy Thermo-Sonic Bonding Technique 3D Stack-Up by Using Solderable ECA

MICRO SENSOR and ACTUATOR Field

Capacitive Micromachined Ultrasonic Transducer Micro-mirror

MICRO-, NANO ~ Field

Micro- and Nano-bubble solution and its application

ETC.


MICROELECTRONIC PACKAGING Field
Hybrid Interconnection Using Low-Melting-Point Alloy
Hybrid Interconnection
Combined with Metallurgical interconnection (Soldering) Low process temperature, Simple process, Fine pitch capability (ECA)

Using Low-Melting-Point Alloy Filler

Bonding process
Lead Polymer Redu Conductionctant path A Substrate

Cu electrode

Wetting test

Cross section of solderable ECA joint


MICROELECTRONIC PACKAGING Field
Thermo-Sonic Bonding Technique
Pad Flexible substrate Heating Plate Binder Conduction particle Flexible substrate Heating Plate ACF

(a) Flexible substrate fixing on heating plate

Bump Si chip

(b) ACF pre-bonding Flexible substrate

Low Pressure
Ultrasonic vibration Si chip

Flexible substrate Heating Plate Heating

LCD panel Heating Plate Heating

(c) Chip alignment and pre-heating

(d)Apply the heating, pressure and Ultrasonic

Bonding process

Si chip
Bump Electrode

Merits of this process

Low process temperature

Reduction of process time Decreased bonding pressure

Substrate

Conductive particle

Cross section of bonding joint


MICROELECTRONIC PACKAGING Field
3D Stack-up by using Solderable ECA
Flip chip Polymer Si wafer

ECA paste

Reflow

Substrate

Squeegee & Alignment

Polymer (Underfill) Solder

Complete

Merits of this process

Low process temperature Simplify the whole process Fast filling time Underfill between the stacked substrates 3D Stack-up


MICRO SENSOR and ACTUATOR Field
Capacitive Micromachined Ultrasonic Transducer
Thickness of Post B Radius of Plate B Thickness of Plate Radius of Plate Thickness of Plate B Radius of Post B Radius of Plate A Thickness of Plate A Height of Vacuum Gap Width of Post A

Width of Post Height of Vacuum Gap

Conventional design Displacement, m 0.0

Novel design Displacement, m x10-7 0.0 -0.5 -1.0 -1.5 -2.0 -2.5 -2.7

(a) 0 V

0.0 FEM results

(b) 23 V


MICRO SENSOR and ACTUATOR Field
Micro-mirror

Fabricated micro-mirror

y
1861.4 Hz

2644.0 Hz

(a) Natural frequency FEM results

(b) Air-film damping pressure


Micro-, Nano- Fields
Micro- and Nano-bubble solution and its application

Bubble

(a) Recording image of the bubble

(b) Particle size distribution

Wide range of application

(c) Concentration and DO meter of the Oxyzen bubble Medicine Water treatment Energy Agriculture Food

WELCOME TO MICROSYSTEMS LAB.

THANK YOU FOR YOUR ATTENTION