Presented by G NAVEEN KUMAR (13011D0614) DSCE JNTU-CEH

CONTENTS
INTRODUCTION

WHY 3D IC
LIMITED PERFORMANCE OF 2D IC COMPARISION OF 2D,3D EVOLUTION IN 3D ICS 3D IC ARCHITECTURE MANUFACTURING TECHNOLOGY OF 3D ICS PERFORMANCE CHARACTERISTICS CONCERNS IN 3D CIRCUITS ADVANTAGES CONCLUSION

INTRODUCTION

A chip in three-dimensional integrated circuit (3DIC) technology is composed of two or more layers of active electronic components, integrated both vertically and horizontally into a single circuit.

Why 3D IC ?

The large growth of computer and information technology industry is depending on VLSI circuits with increasing functionality and performance at minimum cost and power dissipation and 2D ICs generate various gate delays and interconnection delay. So to reduce these delays and total power consumption, 3D IC technology is introduced.

LIMITED PERFORMANCE OF 2D ICs

As we try to increase the performance and efficiency of chip, the complexity of chip design increases and this requires more and more transistors. So the final size of the circuit and delays increases. The losses increases with large interconnection because the capacitance and resistances are generated in between the clad and copper.

COMPARISION OF 2D,3D
Metric Total Area (mm2) 2D 31.36 3D 23.4 Change -25.3%

Total Wire Length (m)

Max Speed (Mhz) Power (mW)

19.107
63.7 340.0

8.238
79.4 324.9

-56.9%
+24.6% -4.4%

3D IC ARCHITECTURE

What does it say

3D IC is a concept that can significantly : Improve interconnect performance Increase transistor packing density Reduce chip area Power dissipation In 3D design structure the entire chip Si is divided by number of layers of oxide and metal, to form transistors.

Manufacturing Technologies
There are four ways to built 3D IC Monolithic Wafer on wafer Die on wafer Die on die

Monolithic
Electronic components and their connections (wiring) are built in layers on a single semiconductor wafer, which is then diced into 3D ICs. There is only one substrate, hence no need for aligning, thinning, bonding, or through-silicon vias.

2. Wafer on wafer

Electronic components are built on two or more semiconductor wafers, which are then aligned, bonded, and diced into 3D ICs.

3. Die on wafer
Electronic components are built on two semiconductor wafers. One wafer is diced aligned and bonded onto die sites of the second wafer.

4.Die on die
Electronic components are built on multiple dice, which are then aligned and bonded. One advantage of die-on-die is that each component die can be tested first, so that one bad die does not ruin an entire stack

PERFORMANCE CHARACTERISTICS
1.
2.

TIMING ENERGY
With shorter interconnects in 3D ICs, both switching energy and cycle time are expected to be reduced

Benefits

Foot Print Cost Heterogeneous Integration Shorter Interconnect Power Circuit Security Bandwidth

Advantages

3D integration can reduce the wiring, thereby reducing the capacitances, power dissipation and chip area improves performance. Digital , analog circuits can be formed with better noise performance. Reduced interconnect delays(R,L,C) and high clock rates High integration density (may go heterogeneous) High band width -processors and advanced focal planes The cost of a 3-D IC will be 10 times less than the present ones.

Concerns In 3D Circuit

Thermal Issues in 3D-circuits Reliability Issues

CONCLUSION
Many companies like MIT (USA), IBM are doing research on 3D IC technology and they are going to introduce cheaper chips for certain applications, like memory used in digital cameras, cell phones, handheld gaming devices etc.

The original cost will be 10 times lesser than the current ones.
3D ICs will be the first of a new generation of dense, inexpensive chips having less delay and interconnection losses that will replace the conventional storage and recording media.

QUERIES

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