Professional Documents
Culture Documents
PowerMOSFETs
Outline
ConstructionofpowerMOSFETs
PhysicaloperationsofMOSFETs
PowerMOSFETswitchingCharacteristics
FactorslimitingoperatingspecficationsofMOSFETs
COOLMOS
PSPICEandothersimulationmodelsforMOSFETs
CopyrightbyJohnWiley&Sons2003
MOSFETs1
MulticellVerticalDiffusedPowerMOSFET(VDMOS)
source
conductor
contact to source
diffusion
field
oxide
gate
oxide
+
P
+
P
gate
width
Ngate
conductor
CopyrightbyJohnWiley&Sons2003
N+
MOSFETs2
ImportantStructuralFeaturesofVDMOS
source
body-source
short
gate conductor
field oxide
gate oxide
N+
P (body)
N-
(drift region)
N+
N+
N+
P (body)
parasitic
BJT
channel
length
integral
diode
N+
drain
1.ParasiticBJT.Heldincutoffbybodysourceshort
2.Integralantiparalleldiode.FormedfromparasiticBJT.
3.Extensionofgatemetallizationoverdraindriftregion.Fieldplateandaccumulation
layerfunctions.
4.Divisionofsourceintomanysmallareasconnectedelectricallyinparallel.
Maximizesgatewidthtochannellengthratioinordertoincreasegain.
5.Lightlydopeddraindriftregion.Determinesblockingvoltagerating.
CopyrightbyJohnWiley&Sons2003
MOSFETs3
AlternativePowerMOSFETGeometries
Source
boddy-source short
Oxide
N+
N+
Channel
P
length
Gate
conductor
P
Parasitic BJT
N-
ID
Integral
diode
N+
TrenchgateMOSFET
Newestgeometry.Lowest
onstateresistance.
Drain
gate oxide
gate
source
N+
N+
N
i
N+
drain
CopyrightbyJohnWiley&Sons2003
VgrooveMOSFET.
Firstpracticalpower
MOSFET.
Higheronstate
resistance.
MOSFETs4
MOSFETIVCharacteristicsandCircuitSymbols
i
[v
- V
GS
ohmic
V
= v
GS(th)
]
DS
GS5
active
V
GS4
actual
V
GS3
linearized
GS2
V
GS1
< V
GS(th)
GS
BV
V
GS(th)
v
DS
DSS
v
GS
G
G
N-channel
MOSFET
S
CopyrightbyJohnWiley&Sons2003
P-channel
MOSFET
MOSFETs5
TheFieldEffectBasisofMOSFETOperation
VGG1
SiO
2
V
GG3
SiO
2
+ + + +
+
ionized
acceptors
depletion layer
boundary
VGG2
SiO
2
+ + + +
free electrons
+ +
+ + + + + +
+
inversion layer
with free electrons
N
+
depletion layer
ionized
boundary
acceptors
+ + +
ionized
acceptors
+ +
+ +
V GS wher e st r ong i nver si on l ayer has for med.
Typi cal val ues 2- 5 vol t s i n power MOSFETs
.
CopyrightbyJohnWiley&Sons2003
MOSFETs6
DriftVelocitySaturation
electron
drift velocity
8x10 6
cm/sec
density.
1.5x10
V/cm
electric
field
In MOSFET channel, J = q n n E
= q n v n ; velocity v n = n E
Velocity saturation means that the
mobility n inversely proportional to
electric field E.
CopyrightbyJohnWiley&Sons2003
MOSFETs7
ChanneltoSourceVoltageDrop
GG
V
DD1
Vox(x)
N
inversion
V (x)
CS
x
V GS = V GG = V ox + V CS(x) ;
V CS(x) = ID1 RCS(x)
D1
depletion
N
N
CopyrightbyJohnWiley&Sons2003
MOSFETs8
ChannelPinchoffatLargeDrainCurrent
+
V
GG
DD2
Vox(x)
inversion
V (x)
CS
x
depletion
velocity
saturation
region
D2
A pparent dilemma of
channel disappearing at
drain end for large I D
avoided.
1. Large elect ric field at drain
end orient ed parallel t o
drain current flow. A rises
from large current flow in
channel const rict ion at
drain.
N
N
MOSFETSwitchingModelsforBuckConverter
Vd
Io
DS(on)
RG
V
GG
BuckconverterusingpowerMOSFET.
gs
MOSFETequivalentcircuitvalidfor
onstate(triode)regionoperation.
D
C
gd
gd
I = f(V )
GS
D
G
C
gs
S
CopyrightbyJohnWiley&Sons2003
MOSFETequivalentcircuitvalidforoff
state(cutoff)andactiveregionoperation.
MOSFETs10
MOSFETCapacitancesDeterminingSwitchingSpeed
gate
source
C gs
N+
N+
gd
gd2
idealization
gd
Cds
actual
N
drain-body
depletion layer
N+
C gd1
v
drain
= v
GS
DS
200 V
DS
MOSFETs11
InternalCapacitancesVsSpecSheetCapacitances
MOSFETinternalcapacitances
Reversetransferorfeedbackcapacitance
C
C gd
G
bridge
D
C gs
+V b
Cds
C gd
Inputcapacitance
G
Outputcapacitance
G
Ciss
S
Ciss = C gs + C gd
CopyrightbyJohnWiley&Sons2003
C oss
S
C oss = C gd + Cds
MOSFETs12
TurnonEquivalentCircuitsforMOSFETBuckConverter
Equivalent cir cuit
dur ing t d(on).
V in
D
F
I o
C
+
V
GG
D
F
C
R
GG
C gd1
DC
+
gs
V in
GG
Cgd1
+
V
GG
gs
V in
I o
R
I o
DC
C gd1
V in
I o
DS(on)
G
C
gs
C gd2
CopyrightbyJohnWiley&Sons2003
MOSFETs13
MOSFETbasedBuckConverterTurnonWaveforms
V
GG+
V
GS,I o
V
= R (C
+C )
gs
G gd2
GS(th)
Freewheelingdiode
assumedtobeideal.
(noreverserecovery
current).
CopyrightbyJohnWiley&Sons2003
MOSFETs14
TurnonGateChargeCharacteristic
V
gs
Vgs,on
I
V + D1
t
g
mo
d1
V
d
V
d2
V
Specified I
Q
on
Qon=
C
gd
d3
D1
T1
CopyrightbyJohnWiley&Sons2003
+
V
ds
-
ds
g (V - V )
t
m gs
C
gs
Qgate
+
V
gs
-
D1
V
gs
V + I /g
t
D1 m
V
t
V
gs,of
I
d
t
V
gs,on
I
D1
V
ds
V
d
V
ds,on
t
MOSFETs15
TurnonWaveformswithNonidealFreewheelingDiode
i
Io
V in
(t)
F
I o + I rr
t
I rr
I rr
i (t)
D
t rr
t
GS,I
in
C gs
Equivalentcircuitfor
estimatingeffectoffree
wheelingdiodereverse
recovery.
o
t
GG
V
GS(th)
Io
ri
C gd1
(t)
DS
t
CopyrightbyJohnWiley&Sons2003
MOSFETs16
MOSFETbasedBuckConverterTurnoffWaveforms
= RG(Cgd2+ C gs)
v (t)
GS
V
GG
GS,I o
i (t)
G
CopyrightbyJohnWiley&Sons2003
Model quanitatively
using the same
equivalent cir cuits as
for tur n- on. Simply
use cor r ect dr iving
voltages and initial
conditions
MOSFETs17
dV/dtLimitstoPreventParasiticBJTTurnon
D
gate
source
N+
N+
P
Cgd
parasitic
BJT
Cgd
N+
S
drain
dV DS
dt
could turn on parasitic BJ T.
D
L+
D
F+
T+
I o
D
T-
L-
DF-
CopyrightbyJohnWiley&Sons2003
MOSFETs18
MaximumGateSourceVoltage
V GS(max) = maximum per missible gatesour ce voltage.
If V GS >V GS(max) r uptur e of gate oxide by
lar ge electr ic f ields possible.
EBD(oxide) 5- 10 million V / cm
Gate oxide typically 1000 anstr oms thick
V GS(max) < [5x10 6 ] [10 - 5 ] = 50 V
Typical V GS(max) 20 - 30 V
Static char ge on gate conductor can r uptur e
gate oxide
Handle MOSFETs with car e (gr ound
your self bef or e handling device)
Place anti- par allel connected Zener diodes
between gate and sour ce as a pr otective
measur e
CopyrightbyJohnWiley&Sons2003
MOSFETs19
MOSFETBreakdownVoltage
depletion layer boundary
without field plate
action of gate electrode
MOSFETs20
MOSFETOnstateLosses
gate
source
channel
resistance
accumulation
layer
resistance
N+
P
P
I
source region
resistance
drift region
resistance
drain region
resistance
+
drain
rDS(on) =
ID
3x10 -7
BV DSS2
A
ParallelingofMOSFETs
D
Rd
Q
1
G
MOSFETs22
MOSFETSafeOperatingArea(SOA)
log ( i
DM
10
-5
sec
10 -4 sec
Tj,max
10
-3
sec
No second br eakdown.
DSS
log (v
CopyrightbyJohnWiley&Sons2003
DC
BV
No distinction between
FBSOA and RBSOA. SOA
is squar e.
)
DS
MOSFETs23
StructuralComparison:VDMOSVersusCOOLMOS
source
N+
N+
N+
+
P
gate
cond
uctor
+
P
N+
Conventional
verticallyoriented
powerMOSFET
N-
N+
drain
source
N+
P
b
P
b
N+
gate
cond
uctor
N+
W
P
b
P
N
b
N+
N+
COOLMOSstructure
(compositebufferstructure,
superjunctionMOSFET,
supermultiresurf
MOSFET)
VerticalPandNregionsof
widthbdopedatsame
density(Na=Nd)
drain
CopyrightbyJohnWiley&Sons2003
MOSFETs24
COOLMOSOperationinBlockingState
source
gate
cond
uctor
N+
P
b
N+
N+
COOLMOSstructurepartially
depleted.
N+
P
b
V1
+
N+
drain
P
b
Notentypedriftregionand
adjacentptypestripesdeplete
uniformlyalongentirevertical
length.
source
gate
cond
uctor
N+
Arrowsindicatedirectionof
depletionlayergrowthasdevice
turnsoff.
N+
N+
N
Ec
Ec
P
b
N+
Vc
+
N+
drain
CopyrightbyJohnWiley&Sons2003
COOLMOSstructureatedge
offulldepletionwithapplied
voltageVc.Depletionlayer
reachestomiddleofverticalP
andNregionsatb/2.
Usingstepjunctionformalism,
Vc=(qb2Nd)/(4)=bEc,max/2
KeepEc,maxEBD/2.Thus
Nd(EBD)/(qb)
MOSFETs25
COOLMOSOperationinBlockingState(cont.)
source
gate
cond
uctor
N+
N+
P
b
N+
P
N
Ev
Ev
P
b
N+
Ev
P
Ec
Ec
N+
drain
V > Vc
ForappliedvoltagesV>Vc,verticallyorientedelectricfieldEvbeginstogrowindepletionregion.
EvspatiallyuniformsincespacechargecompensatedforbyEc.EvV/WforV>>Vc.
DopinglevelNdinntypedriftregioncanbemuchgreaterthanindriftregionofconventional
VDMOSdriftregionofsimilarBVBDcapability.
AtbreakdownEv=EBD300kV/cm;V=BVBD=EBDW
CopyrightbyJohnWiley&Sons2003
MOSFETs26
COOLMOSOperationinONState
source
gate
cond
uctor
N+
P
b
N+
N+
R
on
P
b
OnstatespecificresistanceARon[cm2]
muchlessthancomparableVDMOS
becauseofhigherdriftregiondoping.
N+
V
1
COOLMOSconductionlossesmuch
lessthancomparableVDMOS.
N+
drain
R
L
RonA=W/(qnNd);RecallthatNd=(EBD)/(qb)
BreakdownvoltagerequirementssetW=BVBD/EBD.
SubstitutingforWandNdyieldsRonA=(bBVBD)/(nEBD2)
CopyrightbyJohnWiley&Sons2003
MOSFETs27
RonAComparison:VDMOSversusCOOLMOS
COOLMOSatBVBD=1000V.Assumeb10m.UseEBD=300kV/cm.
RonA=(103cm)(1000V)/[(9x1014F/cm)(12)(1500cm2Vsec)(300kV/cm)2]
RonA=0.014cm.CorrespondstoNd=4x1015cm3
TypicalVDMOS,RonA=3x107(BVBD)2
RonA=3x107(1000)2=0.3cm;CorrespondingNd=1014cm3
RatioCOOLMOStoVDMOSspecificresistance=0.007/0.3=0.023orapproximately1/40
AtBVBD=600V,ratio=1/26.
ExperimentallyatBVBD=600V,ratiois1/5.
Formorecompleteanalysissee:AntonioG.M.StrolloandEttoreNapoli,OptimalONResistance
VersusBreakdownVoltageTradeoffinSuperjunctionPowerDevice:ANovelAnalyticalModel,IEEE
Trans.OnElectronDevices,Vol.48,No.9,pp21612167,(Sept.,2001)
CopyrightbyJohnWiley&Sons2003
MOSFETs28
COOLMOSSwitchingBehavior
LargerblockingvoltagesVds>depletion
voltageVc,COOLMOShassmallerCgs,Cgd,
andCdsthancomparable(sameRonand
BVDSS)VDMOS.
MOSFETwitchingwaveformsforclampedinductiveload.
v (t)
GS
V GS,Io
V
GS(th)
t
v (t)
DS
EffectonCOOLMOSswitchingtimes
relativetoVDMOSswitchingtimes.
V
DS(on)
V
d
t
t
d(on)
i (t)
D
t ri
t fv1 t
fv2
SmallblockingvoltagesVds<depletion
voltageVc,COOLMOShaslargerCgs,Cgd,
andCdsthancomparable(sameRonand
BVDSS)VDMOS.
d(off)
Io
trv1
Turnondelaytimeshorter
Currentrisetimeshorter
Voltagefalltime1shorter
t fi
t rv2
t
CopyrightbyJohnWiley&Sons2003
Voltagefalltime2longer
Turnoffdelaytimelonger
Voltagerisetime1 longer
Voltagerisetime2shorter
Currentfalltimeshorter
MOSFETs29
PSPICEBuiltinMOSFETModel
Circuitcomponents
Drain
RD
RG,RDS,RS,RB,andRD=parasitic
ohmicresistances
CgsCgd,andCgb=constantvoltage
independentcapacitors
CbsandCbd=nonlinearvoltage
dependentcapacitors(depletionlayer
capacitances)
Idrain=f(Vgs,Vds)accountsfordc
characteristicsofMOSFET
Modeldevelopedforlateral(signallevel)
MOSFETs
Cgb
Cbd
Cgd
RB
RG
Idrain
RDS
Bulk
Gate
Cgs
Cbs
RS
Source
CopyrightbyJohnWiley&Sons2003
MOSFETs30
Lateral(Signallevel)MOSFET
Body-source short
C
gs
gd
BodysourceshortkeepsCbsconstant.
N+
N+
C
BodysourceshortputsCbdbetweendrainand
source.
bg
bd
bs
Drain-body
Variationsindrainsourcevoltagerelatively
small,sochangesinCbdalsorelativelysmall.
B
Source-body
depletion layer
depletion layer
Cgs,Cbg,Cgdduetoelectrostatic
capacitanceofgateoxide.Independent
ofappliedvoltage
CbsandCbdduetodepletionlayers.
Capacitancevarieswithjunctionvoltage.
CopyrightbyJohnWiley&Sons2003
Capacitancesrelativelyindependentofterminal
voltages
ConsequentlyPSPICEMOSFETmodelhas
voltageindependentcapacitances.
MOSFETs31
VerticalPowerMOSFET
Body-
source
gate
source
short
C
gs
C
bg
+
C
gd
N
P
bs
N
bd
+
N
drain
drain-body
Draindriftregionandlargedrainsource
voltagevariationscauselargevariationsin
drainbodydepletionlayerthickness
LargechangesinCgdwithchangesindrainsource
voltage.10to100:1changesinCgdmeasuredinhigh
voltageMOSFETs.
depletion
layer
MOSFETcircuitsimulation
modelsmusttakethisvariation
intoaccount.
ModeratechangesinCgbandCbs.
CopyrightbyJohnWiley&Sons2003
MOSFETs32
InadequaciesofPSPICEMOSFETModel
4
MTP3055E
C gd
GS
= 0
CgsandCgdinPSPICEmodelare
constantindependentofterminalvoltages
[nF]
SPICE model
InverticalpowerMOSFETs,Cgdvaries
substantiallywithterminalvoltages.
60V
0V
10V
20V
V
DS
30V
MTP3055E V
DS
Comparisonoftransientresponseofdrain
sourcevoltageusingPSPICEmodeland
animprovedsubcircuitmodel.Both
modelsusedinsamestepdownconverter
circuit.
40V
Motorola
subcircuit
model
20V
0V
0s
100ns
Time
SPICE
model
200ns
CopyrightbyJohnWiley&Sons2003
300ns
MOSFETs33
ExampleofanImprovedMOSFETModel
DevelopedbyMotorolafortheirTMOSlineof
powerMOSFETs
Drain
LDRAIN
DGD
CGDMAX
RGDMAX
CGS
SpacechargecapacitanceofDGDmodels
voltagedependentgatedraincapacitance.
DBODY
CGDMAXinsuresthatgatedraincapacitance
doesnotgetunrealisticallylargeatverylow
drainvoltages.
RDBODY
DBODYmodelsbuiltinantiparalleldiode
inherentintheMOSFETstructure.
RDRAIN2
LGATE RGATE
Gate
RDRAIN1
M1usesbuiltinPSPICEmodelstodescribe
dcMOSFETcharacteristics.Spacecharge
capacitancesofintrinsicmodelsettozero.
M1
RSOURCE
LSOURCE
CGSmodelsgatesourcecapacitanceof
MOSFET.Voltagedependenceofthis
capacitanceignoredinthismodel.
Source
Resistancesandinductancesmodelparasitic
componentsduetopackaging.
CopyrightbyJohnWiley&Sons2003
Manyothermodelsdescribedinliterature.Too
numeroustolisthere.
MOSFETs34
AnotherImprovedMOSFETSimulationModel
M2andM3areSPICElevel2
MOSFETsusedalongwithVoffsetto
modelvoltagedependentbehaviorof
Cgd.
Drain
L
D
R
d
M3
M2
D
sub
V
Q
ofset
JFETQ1andRdaccountforvoltagedrop
inNdraindriftregion
+
-
DsubisbuiltinSPICEdiodemodelused
toaccountforparasiticantiparalleldiode
inMOSFETstructure.
M1
Gate
L
R
G
R
S
L
S
Source
LG,RG,LSRS,LD,RDparasitic
inductancesandresistances
Reference"AnAccurateModelfor
PowerDMOSFETsIncludingInter
electrodeCapacitances",RobertScott,
GerhardA.Frantz,andJenniferL.
Johnson,IEEETrans.onPower
Electronics,Vol.6,No.2,pp.192198,
(April,1991)
M1=intrinsicSPICElevel2MOSFETwithno
parasiticresistancesorcapacitances.
CopyrightbyJohnWiley&Sons2003
MOSFETs35