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HeatSinksandComponentTemperatureControl
CopyrightbyJohnWiley&Sons2003
HeatSinks1
NeedforComponentTemperatureControl
Allcomponents,capacitors,inductorsandtransformers,andsemiconductordevices
andcircuitshavemaximumoperatingtemperaturesspecifiedbymanufacturer.
Componentreliabilitydecreaseswithincreasingtemperature.Semiconductor
failureratedoublesforevery1015Cincreaseintemperatureabove50C
(approx.ruleofthumb).
Highcomponentoperatingtemperatureshaveundesirableeffectsoncomponents.
Capacitors
MagneticComponents
Semconductors
Electrolyteevaporation
rateincreases
significantlywith
temperatureincreases
andthusshortens
lifetime.
Losses(atconstantpower
input)increaseabove100
C
Unequalpowersharingin
paralleledorseriesed
devices.
Windinginsulation(lacquer
orvarnish)degradesabove
100C
Reductioninbreakdown
voltageinsomedevices.
Increaseinleakagecurrents.
Increaseinswitchingtimes.
CopyrightbyJohnWiley&Sons2003
HeatSinks2
TemperatureControlMethods
Controlvoltagesacrossandcurrentthroughcomponentsviagooddesignpractices.
Snubbersmayberequiredforsemiconductordevices.
Freewheelingdiodesmaybeneededwithmagneticcomponents.
Usecomponentsdesignedbymanufacturerstomaximizeheattransfervia
convectionandradiationfromcomponenttoambient.
Shortheatflowpathsfrominteriortocomponentsurfaceandlargecomponent
surfacearea.
Componentuserhasresponsibilitytoproperlymounttemperaturecritical
componentsonheatsinks.
Applyrecommendedtorqueonmountingboltsandnutsandusethermalgrease
betweencomponentandheatsink.
Properlydesignsystemlayoutandenclosureforadequateairflowsothatheat
sinkscanoperateproperlytodissipateheattotheambient.
CopyrightbyJohnWiley&Sons2003
HeatSinks3
HeatConductionThermalResistance
d
b
Genericgeometry
ofheatflowvia
conduction
P
cond
Temperature = T 2
heat flow
direction
T2 > T
1
Temperature = T
1
HeatflowPcond[W/m2]=A(T2T1)/d=(T2T1)/Rcond
ThermalresistanceRcond=d/[A]
CrosssectionalareaA=hb
=ThermalconductivityhasunitsofWm1C1(Al=220Wm1C1).
UnitsofthermalresistanceareC/W
CopyrightbyJohnWiley&Sons2003
HeatSinks4
ThermalEquivalentCircuits
Heatflowthrough
Thermalequivalentcircuit
astructurecomposed
oflayersofdifferent
materials.
Chip
Case
simplifiescalculationof
temperaturesinvariousparts
ofstructure.
Tj
Tc
Isolation pad
Heat sink T
T =P (R
i
+Rcs+Rsa)+Ta
jc
Ifthereparallelheatflowpaths,
Ambient Temperature T a
CopyrightbyJohnWiley&Sons2003
thenthermalresistancesofthe
parallelpathscombineasdo
electricalresistorsinparallel.
HeatSinks5
TransientThermalImpedance
HeatcapacityperunitvolumeCv=dQ/dT[Joules/C]preventsshortdurationhigh
powerdissipationsurgesfromraisingcomponenttemperaturebeyondoperatinglimits.
Transientthermalequivalent
P(t)
circuit.Cs=CvVwhereVisthe
volumeofthecomponent.
P(t)
=RCs/4=thermal
time
constant
T (t= )=0.833P R
j
CopyrightbyJohnWiley&Sons2003
HeatSinks6
ApplicationofTransientThermalImpedance
SymbolicresponseforarectangularpowerdissipationpulseP(t)=Po{u(t)u(tt )}.
1
P(t)
Tj(t)=Po{Z(t)Z(tt1)}
P(t)
Half sine pulse
Po
Equivalent
rectangular
pulse
T/2
T/8
3T/8
CopyrightbyJohnWiley&Sons2003
Symbolicsolutionforhalfsinepower
dissipationpulse.
P(t)=Po{u(tT/8)u(t3T/8)};area
undertwocurvesidentical.
Tj(t)=Po{Z(tT/8)Z(t3T/8)}
HeatSinks7
ZforMultilayerStructures
P(t)
Multilayergeometry
Tj
Cu
Ta
Silicon
Copper mount
Heat sink
Tc
Tj
Transientthermal
P(t)
equivalentcircuit
C s (Si)
Cu
C s (Cu)
Tc
R (sink)
Cs (sink)
Ta
Transientthermal
R (Si)
CopyrightbyJohnWiley&Sons2003
impedance(asymptotic)
ofmultilayerstructure
assumingwidely
separatedthermaltime
constants.
HeatSinks8
HeatSinks
Aluminumheatsinksofvariousshapesandsizeswidelyavailableforcoolingcomponents.
Oftenanodizedwithblackoxidecoatingtoreducethermalresistancebyupto25%.
Sinkscooledbynaturalconvectionhavethermaltimeconstantsof415minutes.
Forcedaircooledsinkshavesubstantiallysmallerthermaltimeconstants,typically
lessthanoneminute.
Choiceofheatsinkdependsonrequiredthermalresistance,R
sa
,whichisdeterminedby
severalfactors.
sa
Maximumpower,Pdiss,dissipatedinthecomponentmountedontheheatsink.
Component'smaximuminternaltemperature,Tj,max
Component'sjunctiontocasethermalresistance,Rjc.
Maximumambienttemperature,Ta,max.
={Tj,maxTa,max}PdissRjc
PdissandTa,maxdeterminedbyparticularapplication.
Tj,maxandRjcsetbycomponentmanufacturer.
CopyrightbyJohnWiley&Sons2003
HeatSinks9
RadiativeThermalResistance
StefanBoltzmannlawdescribesradiativeheattransfer.
Prad=5.7x108EA[(Ts)4(Ta)4];[Prad]=[watts]
E=emissivity;blackanodizedaluminumE=0.9;polishedaluminumE=0.05
A=surfacearea[m2]throughwhichheatradiationemerges.
Ts=surfacetemperature[K]ofcomponent.Ta=ambienttemperature[K].
(T T )/Prad=R
s
,rad
=[TsTa][5.7EA{(Ts/100)4(Ta/100)4}]1
Exampleblackanodizedcubeofaluminum10cmonaside.T =120Cand
s
Ta=20C
R,rad=[393293][(5.7)(0.9)(6x102){(393/100)4(293/100)4}]1
R,rad=2.2C/W
CopyrightbyJohnWiley&Sons2003
HeatSinks10
ConvectiveThermalResistance
P
=convectiveheatlosstosurroundingairfromaverticalsurfaceatsealevelhaving
aheightdvert[inmeters]lessthanonemeter.
conv
Pconv=1.34A[TsTa]1.25dvert0.25
A=totalsurfaceareain[m2]
Ts=surfacetemperature[K]ofcomponent.Ta=ambienttemperature[K].
[T T ]/P
s
conv
=R,conv=[TsTa][dvert]0.25[1.34A(TsTa)1.25]1
R,conv=[dvert]0.25{1.34A[TsTa]0.25}1
R,conv=[101]0.25([1.34][6x102][12020]0.25)1
R,conv=2.2C/W
CopyrightbyJohnWiley&Sons2003
HeatSinks11
CombinedEffectsofConvectionandRadiation
Heatlossviaconvectionandradiationoccurinparallel.
Steadystatethermalequivalentcircuit
R,sink=R,radR,conv/[R,rad+R,conv]
Exampleblackanodizedaluminumcube10cmperside
R,rad=2.2C/WandR,conv=2.2C/W
R,sink=(2.2)(2.2)/(2.2+2.2)=1.1C/W
CopyrightbyJohnWiley&Sons2003
HeatSinks12