Professional Documents
Culture Documents
• Number of credits : 3
(1: theory ; 2: homework + project +Seminar)
• Textbooks:
“CMOS: Circuit Design, Layout, and Simulation”
R. Jacob Baker
• Other Books:
"CMOS Analog Circuit Design"
Phillip E. Allen and Douglas R. Holdberg
Introduction to the course
• Course Policies:
* Homework + Project : 40%
* Final Test :60%
Conversion
10 ‘ Scale ABCB
0.0 F
4.0 D
4.5 D+
5.0 C
6.0 C+
7.0 B
7.8 B+
8.5 A
CONTENTS
• Chapter 1: Introduction to CMOS Design
• Chapter 2: The Well
• Chapter 3: The Metal Layers
• Chapter 4: The Active and Poly Layers
• Chapter 5: CAD Tools (Microwind)
• Chapter 6: Resistors, Capacitors, MOSFETs
• Chapter 7: Models for Analog Design (IC Course)
• Chapter 8: The Inverter (IC Course)
• Chapter 9: VLSI Layout Examples
• Chapter 10: Current Mirrors
• Chapter 11: Amplifiers
• Chapter 12: Differential Amplifiers
• Chapter 13: Operational Amplifiers I
• Chapter 14: Voltage References
• Chapter 15: Data Converter Fundamentals (ADC)
• Chapter 16: Data Converter Fundamentals (DAC)
Chapter 1
Introduction to CMOS Design
1.1 Fabrication
• CMOS integrated circuits are fabricated silicon wafers.
NMOS
PMOS
2. CMOS Background
• Advantages of CMOS:
- Low power
- Layout on small area
- Can be fabricated with few defects and low cost.
95% of ICs are fabricated in CMOS
3. Technology Scale Down
* A Parasitic Diode
Chapter 2: The Well
* Layout of Corners
2.4. PN Junction Physics -
Capacitance
2.4. PN Junction Physics -
Capacitance
2.5. Design Rules for the Well
Chapter 3: The Metal Layers
The velocity
Where
3.2.3 Design Rules for the Metal
Layers
A Layout Trick for the Metal Layers
3.2.4 Contact Resistance
3.4 Layout Examples
3.4 Layout Examples
3.4 Layout Examples
3.4 Layout Examples
3.4 Layout Examples
Chapter 4:
The Active and Poly Layers